Gurumurthy; Charan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gurumurthy; Charan.The latest application filed is for "method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method".

Company Profile

1.27.29

Gurumurthy; Charan - Higley AZ
Gurumurthy; Charan - Gilbert AZ US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method Grant 10,306,760 - Li , et al.	2019-05-28
Integrated circuit and process for fabricating thereof Grant 9,941,158 - Gurumurthy , et al. April 10, 2	2018-04-10
Method Of Forming A Substrate Core Structure Using Microvia Laser Drilling And Conductive Layer Pre-patterning And Substrate Core Structure Formed According To The Method App 20170231092 - Li; Yonggang ; et al.	2017-08-10
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method Grant 9,648,733 - Li , et al. May 9, 2	2017-05-09
Processes of making pad-less interconnect for electrical coreless substrate Grant 9,049,807 - Soto , et al. June 2, 2	2015-06-02
Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method Grant 8,877,565 - Li , et al. November 4, 2	2014-11-04
Method Of Forming A Substrate Core Structure Using Microvia Laser Drilling And Conductive Layer Pre-patterning And Substrate Core Structure Formed According To The Method App 20130242498 - Li; Yonggang ; et al.	2013-09-19
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method Grant 8,440,916 - Li , et al. May 14, 2	2013-05-14
Doping of lead-free solder alloys and structures formed thereby Grant 8,395,051 - Pang , et al. March 12, 2	2013-03-12
Method of making substrate package with through holes for high speed I/O flex cable Grant 8,353,101 - Gurumurthy , et al. January 15, 2	2013-01-15
Embedding device in substrate cavity Grant 8,115,307 - Toyama , et al. February 14, 2	2012-02-14
Integrated Circuit And Process For Fabricating Thereof App 20110298135 - Gurumurthy; Charan ; et al.	2011-12-08
Solder Joints With Enhanced Electromigration Resistance App 20110290864 - PANG; Mengzhi ; et al.	2011-12-01
Solder Joints With Enhanced Electromigration Resistance App 20110293962 - PANG; Mengzhi ; et al.	2011-12-01
Integrated circuit and process for fabricating thereof Grant 7,998,857 - Gurumurthy , et al. August 16, 2	2011-08-16
Method of forming collapse chip connection bumps on a semiconductor substrate Grant 7,985,622 - Nalla , et al. July 26, 2	2011-07-26
Forming a helical inductor Grant 7,956,713 - Chandrasekhar , et al. June 7, 2	2011-06-07
Substrate Package With Through Holes For High Speed I/o Flex Cable App 20110108427 - Gurumurthy; Charan ; et al.	2011-05-12
Method Of Forming A Multilayer Substrate Core Structure Using Sequential Microvia Laser Drilling And Substrate Core Structure Formed According To The Method App 20110058340 - Li; Yonggang ; et al.	2011-03-10
Substrate package with through holes for high speed I/O flex cable Grant 7,888,784 - Gurumurthy , et al. February 15, 2	2011-02-15
Lga Substrate And Method Of Making Same App 20100301484 - Bchir; Omar J. ; et al.	2010-12-02
Optical die structures and associated package substrates Grant 7,831,115 - Bchir , et al. November 9, 2	2010-11-09
System, apparatus, and method for advanced solder bumping Grant 7,790,598 - Pang , et al. September 7, 2	2010-09-07
Doping of lead-free solder alloys and structures formed thereby App 20100155115 - Pang; Mengzhi ; et al.	2010-06-24
Solder Joints With Enhanced Electromigration Resistance App 20100155947 - PANG; Mengzhi ; et al.	2010-06-24
Substrate Package With Through Holes For High Speed I/o Flex Cable App 20100078826 - Gurumurthy; Charan ; et al.	2010-04-01
Method Of Forming Collapse Chip Connection Bumps On A Semiconductor Substrate App 20100044862 - Nalla; Ravi ; et al.	2010-02-25
Assembly of thin die coreless package Grant 7,666,714 - Lu , et al. February 23, 2	2010-02-23
Direct layer laser lamination for electrical bump substrates, and processes of making same App 20090314519 - Soto; Javier ; et al.	2009-12-24
Embedding Device In Substrate Cavity App 20090294992 - Toyama; Munehiro ; et al.	2009-12-03
Optical Die Structures And Associated Package Substrates App 20090238233 - Bchir; Omar ; et al.	2009-09-24
Substrates For Optical Die Structures App 20090238516 - Bchir; Omar J. ; et al.	2009-09-24
Embedding device in substrate cavity Grant 7,592,202 - Toyama , et al. September 22, 2	2009-09-22
Substrates for optical die structures Grant 7,583,871 - Bchir , et al. September 1, 2	2009-09-01
System, Apparatus, And Method For Advanced Solder Bumping App 20090196000 - Pang; Mengzhi ; et al.	2009-08-06
Lga Substrate And Method Of Making Same App 20090166858 - Bchir; Omar J. ; et al.	2009-07-02
Integrated Circuit And Process For Fabricating Thereof App 20090108455 - Gurumurthy; Charan ; et al.	2009-04-30
System, apparatus, and method for advanced solder bumping Grant 7,517,788 - Pang , et al. April 14, 2	2009-04-14
Forming a helical inductor App 20090079530 - Chandrasekhar; Arun ; et al.	2009-03-26
Printed Circuit Board And Method For Preparation Thereof App 20090056989 - Bchir; Omar ; et al.	2009-03-05
Method of Forming a Multilayer Substrate Core Structure Using Sequential Microvia Laser Drilling And Substrate Core Structure Formed According to the Method App 20090001550 - Li; Yonggang ; et al.	2009-01-01
Method of Forming a Substrate Core Structure Using Microvia Laser Drilling and Conductive Layer Pre-Patterning And Substrate Core Structure Formed According to the Method App 20090002958 - Li; Yonggang ; et al.	2009-01-01
Solder composition doped with a barrier component and method of making same App 20080242063 - Pang; Mengzhi ; et al.	2008-10-02
Assembly of thin die coreless package App 20080160673 - Lu; Daoqiang ; et al.	2008-07-03
Embedding device in substrate cavity App 20070232050 - Toyama; Munehiro ; et al.	2007-10-04
Method of using micro-contact imprinted features for formation of electrical interconnects for substrates Grant 7,013,562 - Gurumurthy March 21, 2	2006-03-21
Method of using micro-contact imprinted features for formation of electrical interconnects for substrates App 20050186774 - Gurumurthy, Charan	2005-08-25
Method of using micro-contact imprinted features for formation of electrical interconnects for substrates App 20040187310 - Gurumurthy, Charan	2004-09-30

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