Guo; Yuejin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Guo; Yuejin.The latest application filed is for "methods for making three-dimensional module".

Company Profile

12.7.13

Guo; Yuejin - Phoenix AZ
GUO; Yuejin - ShenZhen CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit packaging method and integrated packaging circuit Grant 11,335,664 - Hu , et al. May 17, 2	2022-05-17
Methods for Making Three-Dimensional Module App 20220084961 - ZHANG; Guobiao ; et al.	2022-03-17
Fan-out Packaging Method and Fan-out Packaging Plate App 20220051908 - HU; Chuan ; et al.	2022-02-17
Three-dimensional module with integrated passive components Grant 11,217,542 - Zhang , et al. January 4, 2	2022-01-04
Integrated circuit packaging structure and method Grant 11,183,458 - Hu , et al. November 23, 2	2021-11-23
Fan-out Packaging Method Employing Combined Process App 20210358883 - HU; Chuan ; et al.	2021-11-18
Multi-bit-per-cell three-dimensional resistive random-access memory (3D-RRAM) Grant 11,170,863 - Zhang , et al. November 9, 2	2021-11-09
Integrated circuit system and packaging method therefor Grant 10,930,634 - Hu , et al. February 23, 2	2021-02-23
Three-Dimensional Module with Integrated Passive Components App 20210013162 - ZHANG; Guobiao ; et al.	2021-01-14
Integrated circuit packaging method and integrated packaged circuit Grant 10,867,959 - Hu , et al. December 15, 2	2020-12-15
Multi-Bit-Per-Cell Three-Dimensional Resistive Random-Access Memory (3D-RRAM) App 20200350030 - ZHANG; Guobiao ; et al.	2020-11-05
Integrated circuit multichip stacked packaging structure and method Grant 10,615,151 - Hu , et al.	2020-04-07
Integrated Circuit Packaging Method and Integrated Packaging Circuit App 20200043886 - Hu; Chuan ; et al.	2020-02-06
Integrated circuit system and packaging method therefor App 20200006310 - HU; Chuan ; et al.	2020-01-02
Integrated Circuit Packaging Method and Integrated Packaged Circuit App 20190326207 - Hu; Chuan ; et al.	2019-10-24
Integrated Circuit Multichip Stacked Packaging Structure and Method App 20190326261 - Hu; Chuan ; et al.	2019-10-24
Integrated Circuit Packaging Structure and Method App 20190287909 - Hu; Chuan ; et al.	2019-09-19

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