| Patent | Date |
|---|
Adjustable Optical Lens and Camera Module and Manufacturing Method and Applications Thereof
App 20220308310 - WANG; Mingzhu ; et al. | 2022-09-29 |
Camera Module with Compression-Molded Circuit Board and Manufacturing Method Thereof
App 20220304148 - WANG; Mingzhu ; et al. | 2022-09-22 |
Camera Module And Array Camera Module Based On Integral Packaging Technology
App 20220303441 - WANG; Mingzhu ; et al. | 2022-09-22 |
Photosensitive Component, And Camera Module And Manufacturing Method Therefor
App 20220303437 - WANG; Mingzhu ; et al. | 2022-09-22 |
Camera module and molding circuit board assembly, circuit board and application thereof
Grant 11,451,693 - Wang , et al. September 20, 2 | 2022-09-20 |
Camera Lens Module And Manufacturing Method Thereof
App 20220283399 - WANG; Mingzhu ; et al. | 2022-09-08 |
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly And Manufacturing Method Thereof
App 20220286592 - WANG; Mingzhu ; et al. | 2022-09-08 |
Camera lens module and manufacturing method thereof
Grant 11,435,545 - Liu , et al. September 6, 2 | 2022-09-06 |
Molded Photosensitive Assembly For Array Imaging Module For Electronic Device And Manufacturing Method Thereof
App 20220268968 - WANG; Mingzhu ; et al. | 2022-08-25 |
Manufacture of semiconductor module with dual molding
Grant 11,393,862 - Wang , et al. July 19, 2 | 2022-07-19 |
Camera module, manufacturing method thereof and corresponding intelligent terminal
Grant 11,394,861 - Wang , et al. July 19, 2 | 2022-07-19 |
Camera Module, Photosensitive Component, Photosensitive-component Joined Panel, And Forming Die Thereof And Manufacturing Method Thereof
App 20220223633 - TANAKA; Takehiko ; et al. | 2022-07-14 |
Split Lens and Camera Module and Electronic Apparatus
App 20220224808 - WANG; Mingzhu ; et al. | 2022-07-14 |
Camera lens module and manufacturing method thereof
Grant 11,385,432 - Wang , et al. July 12, 2 | 2022-07-12 |
Photosensitive component, and camera module and manufacturing method therefor
Grant 11,388,320 - Wang , et al. July 12, 2 | 2022-07-12 |
Optical lens head, camera module and assembling method therefor
Grant 11,378,722 - Wang , et al. July 5, 2 | 2022-07-05 |
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
Grant 11,363,184 - Wang , et al. June 14, 2 | 2022-06-14 |
Monitoring Method For Vibration Drilling State Of Stack Structure Material
App 20220152770 - Chen; Yan ; et al. | 2022-05-19 |
Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof
Grant 11,315,967 - Tanaka , et al. April 26, 2 | 2022-04-26 |
Camera Module And Molded Circuit Board Assembly Thereof, Array Camera Module And Electronic Device
App 20220109018 - WANG; Mingzhu ; et al. | 2022-04-07 |
Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device
Grant 11,289,521 - Wang , et al. March 29, 2 | 2022-03-29 |
Photosensitive Assembly And Camera Module And Manufacturing Method Thereof
App 20220094822 - WANG; Mingzhu ; et al. | 2022-03-24 |
Method for compensating for image quality of optical system by means of lens adjustment
Grant 11,277,564 - Wang , et al. March 15, 2 | 2022-03-15 |
Camera module and molded circuit board assembly thereof, array camera module and electronic device
Grant 11,233,079 - Wang , et al. January 25, 2 | 2022-01-25 |
Array Camera Module And Application Thereof
App 20220021792 - WANG; Mingzhu ; et al. | 2022-01-20 |
Photosensitive assembly and camera module and manufacturing method thereof
Grant 11,223,751 - Wang , et al. January 11, 2 | 2022-01-11 |
Integral Parking Process-Based Camera Module, Integral Base Component of Same, and Manufacturing Method Thereof
App 20210392251 - WANG; Mingzhu ; et al. | 2021-12-16 |
Array Camera Module Having Height Difference, Circuit Board Assembly And Manufacturing Method Therefor, And Electronic Device
App 20210377427 - Wang; Mingzhu ; et al. | 2021-12-02 |
Lens Assembly, Camera Module And Method For Assembling Same
App 20210364735 - WANG; Mingzhu ; et al. | 2021-11-25 |
Camera Module, Molding Photosensitive Assembly Thereof, Manufacturing Method Thereof And Electronic Device
App 20210343768 - WANG; Mingzhu ; et al. | 2021-11-04 |
Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
Grant 11,163,216 - Wang , et al. November 2, 2 | 2021-11-02 |
Array camera module and application thereof
Grant 11,165,941 - Wang , et al. November 2, 2 | 2021-11-02 |
Camera Module with Compression-Molded Circuit Board and Manufacturing Method Thereof
App 20210329781 - WANG; Mingzhu ; et al. | 2021-10-21 |
Semiconductor Packaging Method And Semiconductor Device Based On Molding Process
App 20210313385 - WANG; Mingzhu ; et al. | 2021-10-07 |
Manufacture of semiconductor module with transparent molding component
Grant 11,139,328 - Wang , et al. October 5, 2 | 2021-10-05 |
Photosensitive Component, And Camera Module And Manufacturing Method Therefor
App 20210306530 - WANG; Mingzhu ; et al. | 2021-09-30 |
Systems And Methods For Manufacturing Semiconductor Modules
App 20210305308 - Wang; Mingzhu ; et al. | 2021-09-30 |
Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device
Grant 11,128,787 - Wang , et al. September 21, 2 | 2021-09-21 |
Multi-group Lens Assembly, Camera Module And Assembly Method Thereof, And Electronic Device
App 20210278622 - LIU; Chunmei ; et al. | 2021-09-09 |
Lens assembly, camera module and method for assembling same
Grant 11,106,006 - Wang , et al. August 31, 2 | 2021-08-31 |
Camera Module And Molding Circuit Board Assembly, Circuit Board And Application Thereof
App 20210266436 - WANG; Mingzhu ; et al. | 2021-08-26 |
Adjustable optical lens and camera module, manufacturing method and applications thereof
Grant 11,099,353 - Wang , et al. August 24, 2 | 2021-08-24 |
Camera module, molding photosensitive assembly thereof, manufacturing method thereof and electronic device
Grant 11,094,727 - Wang , et al. August 17, 2 | 2021-08-17 |
System-Level Camera Module with Electrical Support and Manufacturing Method Thereof
App 20210250474 - WANG; Mingzhu ; et al. | 2021-08-12 |
Semiconductor packaging method and semiconductor device based on molding process
Grant 11,081,518 - Wang , et al. August 3, 2 | 2021-08-03 |
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
App 20210203819 - WANG; Mingzhu ; et al. | 2021-07-01 |
Camera module with compression-molded circuit board and manufacturing method thereof
Grant 11,051,400 - Wang , et al. June 29, 2 | 2021-06-29 |
Systems and methods for manufacturing semiconductor modules
Grant 11,049,898 - Wang , et al. June 29, 2 | 2021-06-29 |
Camera module and molding circuit board assembly, circuit board and application thereof
Grant 11,039,052 - Wang , et al. June 15, 2 | 2021-06-15 |
Circuit board, molded photosensitive assembly and manufacturing method therefor, photographing module, and electronic device
Grant 11,032,454 - Wang , et al. June 8, 2 | 2021-06-08 |
Camera Module And Molded Circuit Board Assembly Thereof, Array Camera Module And Electronic Device
App 20210167105 - WANG; Mingzhu ; et al. | 2021-06-03 |
System-level camera module with electrical support and manufacturing method thereof
Grant 11,025,805 - Wang , et al. June 1, 2 | 2021-06-01 |
Adjustable Optical Lens and Camera Module and Manufacturing Method Thereof
App 20210132318 - WANG; Mingzhu ; et al. | 2021-05-06 |
Photosensitive Assembly and Camera Module and Manufacturing Method Thereof
App 20210127040 - WANG; Mingzhu ; et al. | 2021-04-29 |
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
Grant 10,986,258 - Wang , et al. April 20, 2 | 2021-04-20 |
Adjustable optical lens and camera module and manufacturing method thereof
Grant 10,976,514 - Wang , et al. April 13, 2 | 2021-04-13 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20210088696 - WANG; Mingzhu ; et al. | 2021-03-25 |
Camera module and manufacturing method thereof
Grant 10,958,816 - Wang , et al. March 23, 2 | 2021-03-23 |
Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device
App 20210055629 - WANG; Mingzhu ; et al. | 2021-02-25 |
Adjustable optical lens and camera module and manufacturing method thereof
Grant 10,928,605 - Wang , et al. February 23, 2 | 2021-02-23 |
Molded photosensitive assembly of array imaging module
Grant 10,908,324 - Wang , et al. February 2, 2 | 2021-02-02 |
Adjustable Optical Lens and Camera Module and Aligning Method Thereof
App 20200409014 - WANG; Mingzhu ; et al. | 2020-12-31 |
Integrated Photosensitive Module, Photosensitive Assembly, Camera Module And Preparation Method Therefor
App 20200403017 - WANG; Mingzhu ; et al. | 2020-12-24 |
Array Camera Module And Application Thereof
App 20200382683 - WANG; Mingzhu ; et al. | 2020-12-03 |
Camera Module, Manufacturing Method Thereof And Corresponding Intelligent Terminal
App 20200382686 - WANG; Mingzhu ; et al. | 2020-12-03 |
Lens Module And Capturing Module Intergrating Focusing Mechanism And Assembly Method Therefor
App 20200355984 - WANG; Mingzhu ; et al. | 2020-11-12 |
Camera Module and Molded Circuit Board Assembly and Manufacturing Method Thereof
App 20200336627 - WANG; Mingzhu ; et al. | 2020-10-22 |
Manufacture of semiconductor module with dual molding
Grant 10,804,305 - Wang , et al. October 13, 2 | 2020-10-13 |
Manufacture Of Semiconductor Module With Dual Molding
App 20200321381 - WANG; Mingzhu ; et al. | 2020-10-08 |
Camera Lens Module And Manufacturing Method Thereof
App 20200319423 - LIU; Chunmei ; et al. | 2020-10-08 |
Lens module and capturing module intergrating focusing mechanism and assembly method therefor
Grant 10,782,593 - Wang , et al. Sept | 2020-09-22 |
Method for compensating for image quality of optical system by means of lens adjustment
Grant 10,778,897 - Wang , et al. Sept | 2020-09-15 |
Camera Module, Photosensitive Component, Photosensitive-component Joined Panel, And Forming Die Thereof And Manufacturing Method
App 20200286933 - TANAKA; Takehiko ; et al. | 2020-09-10 |
Image capturing module and electrical support thereof
Grant 10,771,666 - Wang , et al. Sep | 2020-09-08 |
Adjustable optical lens and camera module and aligning method thereof
Grant 10,768,391 - Wang , et al. Sep | 2020-09-08 |
Camera module and electrical holder and assembling method thereof
Grant 10,750,074 - Wang , et al. A | 2020-08-18 |
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
Grant 10,742,859 - Wang , et al. A | 2020-08-11 |
Camera lens module and manufacturing method thereof
Grant 10,732,376 - Wang , et al. | 2020-08-04 |
Electrical bracket and circuit conducting method for camera module
Grant 10,735,631 - Zhang , et al. | 2020-08-04 |
Camera Module And Molding Circuit Board Assembly, Circuit Board And Application Thereof
App 20200244852 - Kind Code | 2020-07-30 |
Method For Compensating For Image Quality Of Optical System By Means Of Lens Adjustment
App 20200228715 - WANG; Mingzhu ; et al. | 2020-07-16 |
Molded Photosensitive Assembly for Array Imaging Module for Electronic Device and Manufacturing Method Thereof
App 20200218034 - WANG; Mingzhu ; et al. | 2020-07-09 |
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
Grant 10,708,480 - Wang , et al. | 2020-07-07 |
Camera lens module with one or more optical lens modules and manufacturing method thereof
Grant 10,678,016 - Wang , et al. | 2020-06-09 |
Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
Grant 10,670,946 - Wang , et al. | 2020-06-02 |
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
Grant 10,666,847 - Wang , et al. | 2020-05-26 |
Camera Module, Electronic Device Having Same And Method For Manufacturing Camera Module
App 20200162648 - WANG; Mingzhu ; et al. | 2020-05-21 |
Split Lens Assembly And Camera Module
App 20200158980 - Wang; Mingzhu ; et al. | 2020-05-21 |
Camera Module, Molding Photosensitive Assembly Thereof, Manufacturing Method Thereof And Electronic Device
App 20200156295 - WANG; Mingzhu ; et al. | 2020-05-21 |
Camera module and molded circuit board assembly and manufacturing method thereof
Grant 10,659,664 - Wang , et al. | 2020-05-19 |
Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
Grant 10,630,876 - Wang , et al. | 2020-04-21 |
Camera Module and Array Camera Module Based on Integral Packaging Technology
App 20200120249 - WANG; Mingzhu ; et al. | 2020-04-16 |
Circuit Board, Molded Photosensitive Assembly And Manufacturing Method Therefor, Photographing Module, And Electronic Device
App 20200120244 - WANG; Mingzhu ; et al. | 2020-04-16 |
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
App 20200077002 - WANG; Mingzhu ; et al. | 2020-03-05 |
Molded photosensitive assembly for array imaging module for electronic device
Grant 10,578,837 - Wang , et al. | 2020-03-03 |
Photosensitive assembly and camera module and manufacturing method thereof
Grant 10,582,097 - Wang , et al. | 2020-03-03 |
Array Camera Module Having Height Difference, Circuit Board Assembly And Manufacturing Method Therefor, And Electronic Device
App 20200021720 - WANG; Mingzhu ; et al. | 2020-01-16 |
Semiconductor Packaging Method And Semiconductor Device Based On Molding Process
App 20200013823 - WANG; Mingzhu ; et al. | 2020-01-09 |
Camera Module and Manufacturing Method Thereof
App 20190387147 - WANG; Mingzhu ; et al. | 2019-12-19 |
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
Grant 10,498,942 - Wang , et al. De | 2019-12-03 |
Camera Module, Circuit Board Assembly And Manufacturing Method Thereof, And Electronic Device With Camera Module
App 20190364184 - WANG; Mingzhu ; et al. | 2019-11-28 |
Camera Lens Module with One or More Optical Lens Modules and Manufacturing Method Thereof
App 20190361191 - WANG; Mingzhu ; et al. | 2019-11-28 |
Camera Module and Electrical Holder and Assembling Method Thereof
App 20190364183 - WANG; Mingzhu ; et al. | 2019-11-28 |
Camera module and array camera module based on integral packaging technology
Grant 10,477,088 - Wang , et al. Nov | 2019-11-12 |
Semiconductor packaging method and semiconductor device based on molding process
Grant 10,461,116 - Wang , et al. October 29, 2 | 2019-10-29 |
Manufacture Of Semiconductor Module With Dual Molding
App 20190326342 - Wang; Mingzhu ; et al. | 2019-10-24 |
System-Level Camera Module with Electrical Support and Manufacturing Method Thereof
App 20190327396 - WANG; Mingzhu ; et al. | 2019-10-24 |
Manufacture Of Semiconductor Module With Transparent Molding Component
App 20190319057 - Wang; Mingzhu ; et al. | 2019-10-17 |
Camera module and manufacturing method thereof
Grant 10,440,247 - Wang , et al. O | 2019-10-08 |
System-level camera module with electrical support and manufacturing method thereof
Grant 10,412,278 - Wang , et al. Sept | 2019-09-10 |
Photosensitive Assembly and Camera Module and Manufacturing Method Thereof
App 20190253585 - WANG; Mingzhu ; et al. | 2019-08-15 |
Camera lens module with one or more optical lens modules and manufacturing method thereof
Grant 10,353,167 - Wang , et al. July 16, 2 | 2019-07-16 |
Camera module and electric holder and assembling method thereof
Grant 10,356,299 - Wang , et al. July 16, 2 | 2019-07-16 |
Adjustable Optical Lens and Camera Module and Manufacturing Method Thereof
App 20190212517 - WANG; Mingzhu ; et al. | 2019-07-11 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20190179099 - WANG; Mingzhu ; et al. | 2019-06-13 |
Photosensitive assembly and camera module and manufacturing method thereof
Grant 10,321,028 - Wang , et al. | 2019-06-11 |
Camera Module And Molded Photosensitive Assembly And Manufacturing Method Therefor, And Electronic Device
App 20190165019 - WANG; Mingzhu ; et al. | 2019-05-30 |
Camera lens module and manufacturing method thereof
Grant 10,302,892 - Wang , et al. | 2019-05-28 |
Camera Lens Module and Manufacturing Method Thereof
App 20190154945 - WANG; Mingzhu ; et al. | 2019-05-23 |
Adjustable Optical Lens and Camera Module and Manufacturing Method Thereof
App 20190137721 - WANG; Mingzhu ; et al. | 2019-05-09 |
Adjustable optical lens and camera module and manufacturing method thereof
Grant 10,281,674 - Wang , et al. | 2019-05-07 |
Manufacturing method of a molded photosensitive assembly of an array imaging module
Grant 10,274,694 - Wang , et al. | 2019-04-30 |
Adjustable Optical Lens and Camera Module, Manufacturing Method and Applications Thereof
App 20190079262 - WANG; Mingzhu ; et al. | 2019-03-14 |
System-level camera module with encapsulated electrical support
Grant 10,230,876 - Wang , et al. | 2019-03-12 |
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
Grant 10,230,879 - Wang , et al. | 2019-03-12 |
Camera lens module and manufacturing method thereof
Grant 10,228,532 - Wang , et al. | 2019-03-12 |
Adjustable optical lens and camera module and manufacturing method thereof
Grant 10,222,573 - Wang , et al. | 2019-03-05 |
Optical Lens Head, Camera Module And Assembling Method Therefor
App 20190064399 - WANG; Mingzhu ; et al. | 2019-02-28 |
Electrical Bracket and Circuit Conducting Method for Camera Module
App 20190058815 - ZHANG; Baozhong ; et al. | 2019-02-21 |
Camera module and electric holder and assembling method thereof
Grant 10,212,322 - Wang , et al. Feb | 2019-02-19 |
Lens Assembly, Camera Module And Method For Assembling Same
App 20190049693 - WANG; Mingzhu ; et al. | 2019-02-14 |
Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device
App 20190041727 - WANG; Mingzhu ; et al. | 2019-02-07 |
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
App 20190045097 - WANG; Mingzhu ; et al. | 2019-02-07 |
Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
Grant 10,197,890 - Wang , et al. Fe | 2019-02-05 |
Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
Grant 10,192,914 - Wang , et al. Ja | 2019-01-29 |
Array camera module based on integral packaging technology
Grant 10,194,064 - Wang , et al. Ja | 2019-01-29 |
Image Capturing Module And Electrical Support Thereof
App 20190020798 - WANG; Mingzhu ; et al. | 2019-01-17 |
Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Grant 10,175,447 - Wang , et al. J | 2019-01-08 |
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
Grant 10,171,716 - Wang , et al. J | 2019-01-01 |
Method For Compensating For Image Quality Of Optical System By Means Of Lens Adjustment
App 20180376071 - WANG; Mingzhu ; et al. | 2018-12-27 |
Lens Module And Capturing Module Intergrating Focusing Mechanism And Assembly Method Therefor
App 20180364545 - WANG; Mingzhu ; et al. | 2018-12-20 |
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
App 20180352128 - WANG; Mingzhu ; et al. | 2018-12-06 |
Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Grant 10,148,859 - Wang , et al. De | 2018-12-04 |
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
Grant 10,136,041 - Wang , et al. November 20, 2 | 2018-11-20 |
Camera module and array camera module based on integral packaging technology
Grant 10,129,452 - Wang , et al. November 13, 2 | 2018-11-13 |
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
Grant 10,129,451 - Wang , et al. November 13, 2 | 2018-11-13 |
Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Grant 10,126,519 - Wang , et al. November 13, 2 | 2018-11-13 |
Electrical bracket and circuit conducting method for camera module
Grant 10,116,843 - Zhang , et al. October 30, 2 | 2018-10-30 |
Camera module and array camera module based on integral packaging technology
Grant 10,110,791 - Wang , et al. October 23, 2 | 2018-10-23 |
Semiconductor Packaging Method And Semiconductor Device Based On Molding Process
App 20180294308 - WANG; Mingzhu ; et al. | 2018-10-11 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20180288296 - WANG; Mingzhu ; et al. | 2018-10-04 |
Systems And Methods For Manufacturing Semiconductor Modules
App 20180286913 - Wang; Mingzhu ; et al. | 2018-10-04 |
Camera Lens Module and Manufacturing Method Thereof
App 20180246290 - WANG; Mingzhu ; et al. | 2018-08-30 |
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
Grant 10,051,167 - Wang , et al. August 14, 2 | 2018-08-14 |
Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Grant 10,033,913 - Wang , et al. July 24, 2 | 2018-07-24 |
Camera Module and Array Camera Module Based on Integral Packaging Technology
App 20180176430 - WANG; Mingzhu ; et al. | 2018-06-21 |
Camera Module and Molded Circuit Board Assembly and Manufacturing Method Thereof
App 20180167538 - WANG; Mingzhu ; et al. | 2018-06-14 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20180164529 - WANG; Mingzhu ; et al. | 2018-06-14 |
Camera module and molded circuit board assembly and manufacturing method thereof
Grant 9,998,644 - Wang , et al. June 12, 2 | 2018-06-12 |
Camera module and molded circuit board assembly and manufacturing method thereof
Grant 9,992,397 - Wang , et al. June 5, 2 | 2018-06-05 |
Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device
App 20180113378 - WANG; Mingzhu ; et al. | 2018-04-26 |
Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
Grant 9,955,055 - Wang , et al. April 24, 2 | 2018-04-24 |
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
App 20180109705 - WANG; Mingzhu ; et al. | 2018-04-19 |
Camera Lens Module with One or More Optical Lens Modules and Manufacturing Method Thereof
App 20180106978 - WANG; Mingzhu ; et al. | 2018-04-19 |
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
App 20180097978 - WANG; Mingzhu ; et al. | 2018-04-05 |
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
App 20180091713 - WANG; Mingzhu ; et al. | 2018-03-29 |
Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Grant 9,906,700 - Wang , et al. February 27, 2 | 2018-02-27 |
Camera module and array camera module based on integral packaging technology
Grant 9,900,487 - Wang , et al. February 20, 2 | 2018-02-20 |
Camera Module and Manufacturing Method Thereof
App 20180048798 - WANG; Mingzhu ; et al. | 2018-02-15 |
Manufacturing method of molded photosensitive assembly for electronic device
Grant 9,894,772 - Wang , et al. February 13, 2 | 2018-02-13 |
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
App 20180035030 - WANG; Mingzhu ; et al. | 2018-02-01 |
Camera Module and Molded Circuit Board Assembly and Manufacturing Method Thereof
App 20180035029 - WANG; Mingzhu ; et al. | 2018-02-01 |
Camera Module and Molded Circuit Board Assembly and Manufacturing Method Thereof
App 20180035021 - WANG; Mingzhu ; et al. | 2018-02-01 |
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
App 20180035028 - WANG; Mingzhu ; et al. | 2018-02-01 |
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
App 20180035022 - WANG; Mingzhu ; et al. | 2018-02-01 |
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
App 20180035032 - WANG; Mingzhu ; et al. | 2018-02-01 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20180020138 - WANG; Mingzhu ; et al. | 2018-01-18 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20180012923 - WANG; Mingzhu ; et al. | 2018-01-11 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20180009141 - WANG; Mingzhu ; et al. | 2018-01-11 |
Photosensitive Assembly and Camera Module and Manufacturing Method Thereof
App 20180007244 - WANG; Mingzhu ; et al. | 2018-01-04 |
Camera module and array camera module based on integral packaging technology
Grant 9,848,109 - Wang , et al. December 19, 2 | 2017-12-19 |
Camera Module and Array Camera Module Based on Integral Packaging Technology
App 20170353640 - WANG; Mingzhu ; et al. | 2017-12-07 |
Camera Module and Array Camera Module Based on Integral Packaging Technology
App 20170353644 - WANG; Mingzhu ; et al. | 2017-12-07 |
Camera Module and Array Camera Module Based on Integral Packaging Technology
App 20170353646 - WANG; Mingzhu ; et al. | 2017-12-07 |
Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Grant 9,826,132 - Wang , et al. November 21, 2 | 2017-11-21 |
Camera Module and Array Camera Module Based on Integral Packaging Technology
App 20170310861 - WANG; Mingzhu ; et al. | 2017-10-26 |
Camera Module and Array Camera Module Based on Integral Packaging Technology
App 20170310860 - WANG; Mingzhu ; et al. | 2017-10-26 |
Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
Grant 9,781,324 - Wang , et al. October 3, 2 | 2017-10-03 |
Camera module and manufacturing method thereof
Grant 9,781,323 - Wang , et al. October 3, 2 | 2017-10-03 |
Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Grant 9,781,325 - Wang , et al. October 3, 2 | 2017-10-03 |
Camera Module and Manufacturing Method Thereof
App 20170280027 - WANG; Mingzhu ; et al. | 2017-09-28 |
Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof
App 20170271390 - WANG; Mingzhu ; et al. | 2017-09-21 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20170264803 - WANG; Mingzhu ; et al. | 2017-09-14 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20170264801 - WANG; Mingzhu ; et al. | 2017-09-14 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20170264804 - WANG; Mingzhu ; et al. | 2017-09-14 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20170264802 - WANG; Mingzhu ; et al. | 2017-09-14 |
Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device
App 20170244874 - WANG; Mingzhu ; et al. | 2017-08-24 |
Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device
App 20170244878 - WANG; Mingzhu ; et al. | 2017-08-24 |
Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device
App 20170245370 - WANG; Mingzhu ; et al. | 2017-08-24 |
Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device
App 20170244877 - WANG; Mingzhu ; et al. | 2017-08-24 |
Camera Module with Compression-Molded Circuit Board and Manufacturing Method Thereof
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