Gulpen; Jan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Gulpen; Jan.The latest application filed is for "method of making a plurality of packaged semiconductor devices".
- Gulpen; Jan - Nijmegen NL
| Patent | Date |
|---|---|
| Method of making a plurality of packaged semiconductor devices Grant 10,431,476 - de Witte , et al. O | 2019-10-01 |
| Wafer level chip scale semiconductor package Grant 10,109,564 - Groenhuis , et al. October 23, 2 | 2018-10-23 |
| Method Of Making A Plurality Of Packaged Semiconductor Devices App 20180301353 - de Witte; Jetse ; et al. | 2018-10-18 |
| Shielded QFN package and method of making Grant 10,096,555 - Gulpen , et al. October 9, 2 | 2018-10-09 |
| Wafer Level Chip Scale Semiconductor Package App 20170372988 - GROENHUIS; ROELF ; et al. | 2017-12-28 |
| Shielded Qfn Package And Method Of Making App 20170213797 - Gulpen; Jan ; et al. | 2017-07-27 |
| Shielded QFN package and method of making Grant 9,653,414 - Gulpen , et al. May 16, 2 | 2017-05-16 |
| Ultrathin Routable Quad Flat No-leads (qfn) Package App 20170103939 - Gulpen; Jan ; et al. | 2017-04-13 |
| Shielded Qfn Package And Method Of Making App 20170025369 - Gulpen; Jan ; et al. | 2017-01-26 |
| Single inline no-lead semiconductor package Grant 9,379,071 - Kamphuis , et al. June 28, 2 | 2016-06-28 |
| Single Inline No-lead Semiconductor Package App 20150303156 - Kamphuis; Tonny ; et al. | 2015-10-22 |
| Fan-out chip scale package Grant 8,679,963 - Gulpen , et al. March 25, 2 | 2014-03-25 |
| Fan-out Chip Scale Package App 20130273731 - GULPEN; Jan ; et al. | 2013-10-17 |
| Fan-out chip scale package Grant 8,482,136 - Gulpen , et al. July 9, 2 | 2013-07-09 |
| Fan-out Chip Scale Package App 20110156237 - Gulpen; Jan ; et al. | 2011-06-30 |
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