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Patent applications and USPTO patent grants for GUJJULA; Sushrutha.The latest application filed is for "micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap".
Patent | Date |
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Micro-electronic Package With Substrate Protrusion To Facilitate Dispense Of Underfill Between A Narrow Die-to-die Gap App 20220165585 - LIN; Ziyin ;   et al. | 2022-05-26 |
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap Grant 11,282,717 - Lin , et al. March 22, 2 | 2022-03-22 |
Micro-electronic Package With Substrate Protrusion To Facilitate Dispense Of Underfill Between A Narrow Die-to-die Gap App 20190304808 - LIN; Ziyin ;   et al. | 2019-10-03 |
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