Guggilla; Srinivas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Guggilla; Srinivas.The latest application filed is for "multiple spacer patterning schemes".

Company Profile

11.12.17

Guggilla; Srinivas - San Jose CA
Guggilla; Srinivas - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods for modifying photoresist profiles and tuning critical dimensions Grant 11,456,173 - Gupta , et al. September 27, 2	2022-09-27
Multiple spacer patterning schemes Grant 11,315,787 - Yang , et al. April 26, 2	2022-04-26
Methods and apparatus for co-sputtering multiple targets Grant 11,101,117 - Subramani , et al. August 24, 2	2021-08-24
Multiple Spacer Patterning Schemes App 20200335338 - YANG; Tzu-Shun ; et al.	2020-10-22
Multiple Spacer Patterning Schemes App 20200335339 - YANG; Tzu-shun ; et al.	2020-10-22
Methods For Modifying Photoresist Profiles And Tuning Critical Diimensions App 20200321210 - GUPTA; Meenakshi ; et al.	2020-10-08
Multi-layer Stacks For 3d Nand Extendability App 20200295041 - HAN; Xinhai ; et al.	2020-09-17
Methods for depositing dielectric barrier layers and aluminum containing etch stop layers Grant 10,707,122 - Kesapragada , et al.	2020-07-07
Multi-layer stacks for 3D NAND extendibility Grant 10,700,087 - Han , et al.	2020-06-30
Methods And Apparatus For Co-sputtering Multiple Targets App 20200013597 - SUBRAMANI; Anantha K. ; et al.	2020-01-09
Method And Apparatus For Protecting Metal Interconnect From Halogen Based Precursors App 20190348369 - NAIK; Mehul B. ; et al.	2019-11-14
Methods and apparatus for co-sputtering multiple targets Grant 10,468,238 - Subramani , et al. No	2019-11-05
Multi-layer Stacks For 3d Nand Extendability App 20190115365 - HAN; Xinhai ; et al.	2019-04-18
Methods For Depositing Dielectric Barrier Layers And Aluminum Containing Etch Stop Layers App 20190027403 - KESAPRAGADA; Sree Rangasai V. ; et al.	2019-01-24
Methods for depositing dielectric barrier layers and aluminum containing etch stop layers Grant 10,109,520 - Kesapragada , et al. October 23, 2	2018-10-23
Method and apparatus for protecting metal interconnect from halogen based precursors Grant 10,002,834 - Naik , et al. June 19, 2	2018-06-19
Interconnect structures and methods of formation Grant 9,984,976 - Cheng , et al. May 29, 2	2018-05-29
Aluminum nitride barrier layer Grant 9,646,876 - Padhi , et al. May 9, 2	2017-05-09
Methods for depositing dielectric films via physical vapor deposition processes Grant 9,633,839 - Zeng , et al. April 25, 2	2017-04-25
Methods For Depositing Dielectric Barrier Layers And Aluminum Containing Etch Stop Layers App 20170098575 - KESAPRAGADA; Sree Rangasai V. ; et al.	2017-04-06
Methods And Apparatus For Co-sputtering Multiple Targets App 20170053784 - SUBRAMANI; Anantha K. ; et al.	2017-02-23
Methods For Depositing Dielectric Films Via Physical Vapor Deposition Processes App 20160372319 - ZENG; Weimin ; et al.	2016-12-22
Method And Apparatus For Protecting Metal Interconnect From Halogen Based Precursors App 20160268207 - NAIK; Mehul B. ; et al.	2016-09-15
Aluminum Nitride Barrier Layer App 20160254181 - Padhi; Deenesh ; et al.	2016-09-01
Interconnect Structures And Methods Of Formation App 20160240483 - CHENG; YANA ; et al.	2016-08-18
Substrate Processing System And Methods Thereof App 20100304027 - Lee; Wei Ti ; et al.	2010-12-02
Method and apparatus for cleaning substrates Grant 6,908,865 - Kranz , et al. June 21, 2	2005-06-21
Method and apparatus for cleaning substrates App 20030062333 - Kranz, Martin ; et al.	2003-04-03

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