Guerin; Luc

Patent Applications and Registrations

Patent applications and USPTO patent grants for Guerin; Luc.The latest application filed is for "wind deflector for a vehicle towing a trailer".

Company Profile

7.26.20

Guerin; Luc - Granby CA
Guerin; Luc - Quebec CA
Guerin; Luc - Bromont N/A CA
Guerin; Luc - Cranby CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wind deflector for a vehicle towing a trailer Grant 10,926,813 - Guerin February 23, 2	2021-02-23
High-density chip-to-chip interconnection with silicon bridge Grant 10,784,202 - Arguin , et al. Sept	2020-09-22
Wind Deflector for a Vehicle Towing a Trailer App 20200114984 - Guerin; Luc	2020-04-16
High-density Chip-to-chip Interconnection With Silicon Bridge App 20190172787 - Arguin; Francois ; et al.	2019-06-06
Laser ashing of polyimide for semiconductor manufacturing Grant 9,865,564 - Cadotte , et al. January 9, 2	2018-01-09
All intermetallic compound with stand off feature and method to make Grant 9,793,232 - Arvin , et al. October 17, 2	2017-10-17
Temporary liquid thermal interface material for surface tension adhesion and thermal control Grant 9,269,603 - Guerin , et al. February 23, 2	2016-02-23
Laser Ashing Of Polyimide For Semiconductor Manufacturing App 20150162300 - Cadotte; Maxime ; et al.	2015-06-11
Laser ashing of polyimide for semiconductor manufacturing Grant 8,999,107 - Cadotte , et al. April 7, 2	2015-04-07
Temporary Liquid Thermal Interface Material For Surface Tension Adhesion And Thermal Control App 20140332810 - GUERIN; Luc ; et al.	2014-11-13
Solder ball contact susceptible to lower stress Grant 8,614,512 - Guerin , et al. December 24, 2	2013-12-24
Silicon carrier optoelectronic packaging Grant 8,559,474 - Andry , et al. October 15, 2	2013-10-15
Technique for verifying the microstructure of lead-free interconnects in semiconductor assemblies Grant 8,514,386 - Bergeron , et al. August 20, 2	2013-08-20
Solder ball contact susceptible to lower stress Grant 8,383,505 - Guerin , et al. February 26, 2	2013-02-26
Solder Ball Contact Susceptible To Lower Stress App 20130015579 - Guerin; Luc ; et al.	2013-01-17
Silicon Carrier Optoelectronic Packaging App 20120326290 - Andry; Paul S. ; et al.	2012-12-27
Techniques for forming solder bump interconnects Grant 8,328,156 - Dang , et al. December 11, 2	2012-12-11
Technique For Verifying The Microstructure Of Lead-free Interconnects In Semiconductor Assemblies App 20120300220 - Bergeron; Christian ; et al.	2012-11-29
Silicon carrier optoelectronic packaging Grant 8,290,008 - Andry , et al. October 16, 2	2012-10-16
Solder Ball Contact Susceptible To Lower Stress App 20120256313 - Guerin; Luc ; et al.	2012-10-11
Techniques for Forming Solder Bump Interconnects App 20120138769 - Dang; Bing ; et al.	2012-06-07
Laser Ashing Of Polyimide For Semiconductor Manufacturing App 20120111496 - Cadotte; Maxime ; et al.	2012-05-10
Techniques for forming solder bump interconnects Grant 8,148,255 - Dang , et al. April 3, 2	2012-04-03
Silicon Carrier Optoelectronic Packaging App 20110044369 - Andry; Paul S. ; et al.	2011-02-24
Semiconductor package having non-aligned active vias Grant 7,868,459 - Audet , et al. January 11, 2	2011-01-11
Methods involving marking molds Grant 7,837,419 - Bouchard , et al. November 23, 2	2010-11-23
Methods Involving Marking Molds App 20090123589 - Bouchard; Eric ; et al.	2009-05-14
Techniques For Forming Solder Bump Interconnects App 20090072392 - Dang; Bing ; et al.	2009-03-19
Semiconductor Package Having Non-aligned Active Vias App 20080054482 - Audet; Jean ; et al.	2008-03-06
Enhanced via structure for organic module performance Grant 7,312,523 - Audet , et al. December 25, 2	2007-12-25
Enhanced Via Structure For Organic Module Performance App 20070023913 - Audet; Jean J. ; et al.	2007-02-01
Standoff Structures For Surface Mount Components App 20070007323 - Russell; David J. ; et al.	2007-01-11
Area array package with low inductance connecting device Grant 7,066,740 - Audet , et al. June 27, 2	2006-06-27
Area Array Package With Low Inductance Connecting Device App 20050013124 - Audet, Jean ; et al.	2005-01-20
Connecting devices and method for interconnecting circuit components Grant 6,652,290 - Audet , et al. November 25, 2	2003-11-25
Connecting devices and method for interconnecting circuit components App 20020019153 - Audet, Gerald P. ; et al.	2002-02-14
Compliant leads for area array surface mounted components Grant 6,339,534 - Coico , et al. January 15, 2	2002-01-15
Connecting devices and method for interconnecting circuit components Grant 6,302,702 - Audet , et al. October 16, 2	2001-10-16

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