GUEGUEN; Pierric

Patent Applications and Registrations

Patent applications and USPTO patent grants for GUEGUEN; Pierric.The latest application filed is for "protection device for an electrical circuit, electrical circuit equipped with such a device and method for protecting such an electrical circuit".

Company Profile

0.10.8

GUEGUEN; Pierric - LYON FR
Gueguen; Pierric - Echirolles N/A FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Protection Device For An Electrical Circuit, Electrical Circuit Equipped With Such A Device And Method For Protecting Such An Electrical Circuit App 20220013308 - FLEUREAU; Patrice ; et al.	2022-01-13
Treatment, before the bonding of a mixed Cu-oxide surface, by a plasma containing nitrogen and hydrogen Grant 10,910,782 - Vandroux , et al. February 2, 2	2021-02-02
Method for modifying the crystalline structure of a copper element Grant 9,620,412 - Di Cioccio , et al. April 11, 2	2017-04-11
Process for direct bonding two elements comprising copper portions and portions of dielectric materials Grant 9,027,821 - Di Cioccio , et al. May 12, 2	2015-05-12
Simplified copper-copper bonding Grant 8,647,983 - Di Cioccio , et al. February 11, 2	2014-02-11
Self-assembly of chips on a substrate Grant 8,642,391 - Di Cioccio , et al. February 4, 2	2014-02-04
Process For Direct Bonding Two Elements Comprising Copper Portions And Portions Of Dielectric Materials App 20130270328 - Di Cioccio; Lea ; et al.	2013-10-17
Treatment, Before The Bonding Of A Mixed Cu-oxide Surface, By A Plasma Containing Nitrogen And Hydrogen App 20130153093 - Vandroux; Laurent ; et al.	2013-06-20
Method For Modifying The Crystalline Structure Of A Copper Element App 20120097296 - Di Cioccio; Lea ; et al.	2012-04-26
Simplified Copper-copper Bonding App 20120100657 - Di Cioccio; Lea ; et al.	2012-04-26
Self-assembly Of Chips On A Substrate App 20110033976 - Di Cioccio; Lea ; et al.	2011-02-10

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