Guay; Patrick
Patent Applications and Registrations
Patent applications and USPTO patent grants for Guay; Patrick.The latest application filed is for "methods for assembling semiconductor devices and interposers".
- Guay; Patrick - Singapore SG
| Patent | Date |
|---|---|
| Methods for assembling semiconductor devices and interposers Grant 7,528,007 - Fee , et al. May 5, 2 | 2009-05-05 |
| Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers Grant 7,274,095 - Fee , et al. September 25, 2 | 2007-09-25 |
| Methods for assembling semiconductor devices and interposers App 20060194373 - Fee; Setho Sing ; et al. | 2006-08-31 |
| Ball grid array interposer, packages and methods App 20040217459 - Fee, Setho Sing ; et al. | 2004-11-04 |
| Ball grid array interposer, packages and methods Grant 6,746,894 - Fee , et al. June 8, 2 | 2004-06-08 |
| U-shape tape for BOC FBGA package to improve moldability Grant 6,617,201 - Chye , et al. September 9, 2 | 2003-09-09 |
| U-shape tape for BOC FBGA package to improve moldability App 20030025185 - Chye, Lim T. ; et al. | 2003-02-06 |
| Ball grid array interposer, packages and methods App 20020142513 - Fee, Setho Sing ; et al. | 2002-10-03 |
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