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Patent applications and USPTO patent grants for Guajardo; James R..The latest application filed is for "structure and method to minimize warpage of packaged semiconductor devices".
Patent | Date |
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Structure and method to minimize warpage of packaged semiconductor devices Grant 9,978,614 - Lakhera , et al. May 22, 2 | 2018-05-22 |
Structure And Method To Minimize Warpage Of Packaged Semiconductor Devices App 20160307780 - LAKHERA; Nishant ;   et al. | 2016-10-20 |
Structure And Method To Minimize Warpage Of Packaged Semiconductor Devices App 20160064299 - LAKHERA; NISHANT ;   et al. | 2016-03-03 |
Edge coupling of semiconductor dies Grant 9,087,702 - Pham , et al. July 21, 2 | 2015-07-21 |
Edge Coupling Of Semiconductor Dies App 20150061097 - Pham; Tim V. ;   et al. | 2015-03-05 |
Using an integrated circuit die configuration for package height reduction Grant 8,957,510 - Pham , et al. February 17, 2 | 2015-02-17 |
Using An Integrated Circuit Die Configuration For Package Height Reduction App 20150008567 - PHAM; TIM V. ;   et al. | 2015-01-08 |
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