Grueter; Ruedi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Grueter; Ruedi.The latest application filed is for "device for dispensing adhesive on a substrate".
- Grueter; Ruedi - Buttisholz N/A CH
- Grueter; Ruedi - Neuenkirch CH
| Patent | Date |
|---|---|
| Apparatus for mounting semiconductor chips Grant 9,603,294 - Suter , et al. March 21, 2 | 2017-03-21 |
| Device for dispensing adhesive on a substrate Grant 9,233,389 - Grueter , et al. January 12, 2 | 2016-01-12 |
| Device For Dispensing Adhesive On A Substrate App 20140305372 - Grueter; Ruedi ; et al. | 2014-10-16 |
| Apparatus For Mounting Semiconductor Chips App 20130133188 - Suter; Guido ; et al. | 2013-05-30 |
| Apparatus for mounting a flip chip on a substrate Grant 8,166,637 - Blessing , et al. May 1, 2 | 2012-05-01 |
| Apparatus For Mounting A Flip Chip On A Substrate App 20100040449 - Blessing; Patrick ; et al. | 2010-02-18 |
| Method And Device For Wetting The Bumps Of A Semiconductor Chip With Soldering Flux App 20100019018 - Baumann; Damian ; et al. | 2010-01-28 |
| Method for mounting a flip chip on a substrate Grant 7,597,234 - Blessing , et al. October 6, 2 | 2009-10-06 |
| Method for mounting a flip chip on a substrate App 20070145102 - Blessing; Patrick ; et al. | 2007-06-28 |
| Apparatus for placing a semiconductor chip as a flipchip on a substrate Grant 7,020,954 - Hartmann , et al. April 4, 2 | 2006-04-04 |
| Apparatus for placing a semiconductor chip as a flipchip on a substrate App 20020162217 - Hartmann, Dominik ; et al. | 2002-11-07 |
| Die bonder and/or wire bonder with a device for holding down a substrate App 20020066765 - Behler, Stefan ; et al. | 2002-06-06 |
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