Gruenwald; Richard
Patent Applications and Registrations
Patent applications and USPTO patent grants for Gruenwald; Richard.The latest application filed is for "method for forming packaged semiconductor die with micro-cavity".
- Gruenwald; Richard - Potsdam DE
| Patent | Date |
|---|---|
| Method for Forming Packaged Semiconductor Die with Micro-Cavity App 20220115282 - Klein; Matthias ; et al. | 2022-04-14 |
| Packaged semiconductor die with micro-cavity Grant 11,244,876 - Klein , et al. February 8, 2 | 2022-02-08 |
| Packaged Semiconductor Die with Micro-Cavity and Method for Forming Packaged Semiconductor Die with Micro-Cavity App 20210111082 - Klein; Matthias ; et al. | 2021-04-15 |
| Metallization for a cavity housing and a nonmagnetic sealed cavity housing Grant 9,023,442 - Gruenwald May 5, 2 | 2015-05-05 |
| Measurement system for the wireless position-independent measurement of the temperature Grant 8,930,160 - Wall , et al. January 6, 2 | 2015-01-06 |
| Metallization for a cavity housing and a nonmagnetic sealed cavity housing App 20120177853 - Gruenwald; Richard | 2012-07-12 |
| Measurement System For The Wireless Position-independent Measurement Of The Temperature App 20120143559 - Wall; Bert ; et al. | 2012-06-07 |
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