Gruenhagen; Mike
Patent Applications and Registrations
Patent applications and USPTO patent grants for Gruenhagen; Mike.The latest application filed is for "reliable wafer-level chip-scale solder bump structure".
- Gruenhagen; Mike - Salt Lake City UT
| Patent | Date |
|---|---|
| Reliable Wafer-level Chip-scale Solder Bump Structure App 20100117231 - Lang; Dennis ; et al. | 2010-05-13 |
| Reliable Wafer-level Chip-scale Package Solder Bump Structure In A Packaged Semiconductor Device App 20080054461 - Lang; Dennis ; et al. | 2008-03-06 |
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