loadpatents
name:-0.013229846954346
name:-0.082770109176636
name:-0.00041294097900391
Gruenhagen; Michael D. Patent Filings

Gruenhagen; Michael D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gruenhagen; Michael D..The latest application filed is for "double layer metal (dlm) power mosfet".

Company Profile
0.10.10
  • Gruenhagen; Michael D. - Salt Lake City UT US
  • Gruenhagen; Michael D. - Sandy UT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
Grant 8,598,035 - Gruenhagen , et al. December 3, 2
2013-12-03
Double layer metal (DLM) power MOSFET
Grant 8,502,313 - Dikshit , et al. August 6, 2
2013-08-06
Shield contacts in a shielded gate MOSFET
Grant 8,338,285 - Dunn , et al. December 25, 2
2012-12-25
Double Layer Metal (dlm) Power Mosfet
App 20120267714 - Dikshit; Rohit ;   et al.
2012-10-25
Methods and Designs for Localized Wafer Thinning
App 20120168947 - Kim; Suku ;   et al.
2012-07-05
Methods and designs for localized wafer thinning
Grant 8,158,506 - Kim , et al. April 17, 2
2012-04-17
Semiconductor die containing lateral edge shapes and textures
Grant 8,072,044 - Gruenhagen , et al. December 6, 2
2011-12-06
Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same
Grant 8,058,732 - Gruenhagen , et al. November 15, 2
2011-11-15
Shield Contacts In A Shielded Gate Mosfet
App 20110275208 - Dunn; Dixie ;   et al.
2011-11-10
Semiconductor Dice With Backside Trenches Filled With Elastic Material For Improved Attachment, Packages Using The Same, And Methods Of Making The Same
App 20110230046 - Gruenhagen; Michael D. ;   et al.
2011-09-22
Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
Grant 7,960,800 - Gruenhagen , et al. June 14, 2
2011-06-14
Shield contacts in a shielded gate MOSFET
Grant 7,952,141 - Dunn , et al. May 31, 2
2011-05-31
Semiconductor Die Containing Lateral Edge Shapes And Textures
App 20110062564 - Gruenhagen; Michael D. ;   et al.
2011-03-17
Shield Contacts in a Shielded Gate MOSFET
App 20110018059 - Dunn; Dixie ;   et al.
2011-01-27
Nickel-titanum Contact Layers In Semiconductor Devices
App 20110006409 - Gruenhagen; Michael D. ;   et al.
2011-01-13
Semiconductor Dice with Backside Trenches Filled With Elastic Material For Improved Attachment, Packages Using the Same, and Methods of Making the Same
App 20100148325 - Gruenhagen; Michael D. ;   et al.
2010-06-17
Semiconductor Die Structures for Wafer-Level Chipscale Packaging of Power Devices, Packages and Systems for Using the Same, and Methods of Making the Same
App 20100123225 - Gruenhagen; Michael D. ;   et al.
2010-05-20
Methods And Designs For Localized Wafer Thinning
App 20090273082 - Kim; Suku ;   et al.
2009-11-05

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