GRUBER; PETER ALFRED

Patent Applications and Registrations

Patent applications and USPTO patent grants for GRUBER; PETER ALFRED.The latest application filed is for "forming constant diameter spherical metal balls".

Company Profile

0.24.12

GRUBER; PETER ALFRED - MOHEGAN LAKE NY
Gruber; Peter Alfred - Mohengan Lake NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Forming Constant Diameter Spherical Metal Balls App 20140262113 - FEGER; CLAUDIUS ; et al.	2014-09-18
Microcavity structure and process Grant 8,703,274 - Budd , et al. April 22, 2	2014-04-22
Forming metal preforms and metal balls Grant 8,561,880 - Gruber , et al. October 22, 2	2013-10-22
Forming constant diameter spherical metal balls Grant 8,408,448 - Feger , et al. April 2, 2	2013-04-02
Method and apparatus for forming planar alloy deposits on a substrate Grant 7,906,420 - Gruber , et al. March 15, 2	2011-03-15
Method and apparatus for forming planar alloy deposits on a substrate Grant 7,867,842 - Gruber , et al. January 11, 2	2011-01-11
Microcavity Structure And Process App 20100086739 - Budd; Russell A. ; et al.	2010-04-08
Method and Apparatus for Forming Planar Alloy Deposits on a Substrate App 20100072263 - Gruber; Peter Alfred ; et al.	2010-03-25
Method and Apparatus for Forming Planar Alloy Deposits on a Substrate App 20100028612 - Gruber; Peter Alfred ; et al.	2010-02-04
Integrated Circuit Interconnect Method and Apparatus App 20100025862 - Gruber; Peter Alfred ; et al.	2010-02-04
Integrated Circuit Interconnect Method and Apparatus App 20100025863 - Gruber; Peter Alfred ; et al.	2010-02-04
Method for Forming a Solder Mold with Venting Channels and Method for Using the Same App 20090039142 - Bezama; Raschid Jose ; et al.	2009-02-12
Solder Mold With Venting Channels App 20090039140 - Bezama; Raschid Jose ; et al.	2009-02-12
Hybrid molds for molten solder screening process Grant 6,832,747 - Cordes , et al. December 21, 2	2004-12-21
Method and apparatus for applying solder to an element on a substrate Grant 6,708,872 - Gruber , et al. March 23, 2	2004-03-23
Method for filling high aspect ratio via holes in electronic substrates Grant 6,581,280 - Curcio , et al. June 24, 2	2003-06-24
Method and apparatus for forming solder bumps Grant 6,527,158 - Brouillette , et al. March 4, 2	2003-03-04
Method and apparatus for applying solder to an element on a substrate App 20030024968 - Gruber, Peter Alfred ; et al.	2003-02-06
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes App 20020179335 - Curcio, Brian Eugene ; et al.	2002-12-05
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes Grant 6,452,117 - Curcio , et al. September 17, 2	2002-09-17
Hybrid molds for molten solder screening process App 20020125402 - Cordes, Steven A. ; et al.	2002-09-12
Method and apparatus for forming solder bumps Grant 6,394,334 - Brouillette , et al. May 28, 2	2002-05-28
Etched glass solder bump transfer for flip chip integrated circuit devices Grant 6,332,569 - Cordes , et al. December 25, 2	2001-12-25
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes App 20010027842 - Curcio, Brian E. ; et al.	2001-10-11
Apparatus and method for vacuum injection molding Grant 6,231,333 - Gruber , et al. May 15, 2	2001-05-15
Plastic solder array using injection molded solder Grant 6,153,505 - Bolde , et al. November 28, 2	2000-11-28
Method for building interconnect structures by injection molded solder and structures built Grant 6,133,633 - Berger , et al. October 17, 2	2000-10-17
Interconnect for low temperature chip attachment Grant 6,127,735 - Berger , et al. October 3, 2	2000-10-03
Etched glass solder bump transfer for flip chip integrated circuit devices Grant 6,105,852 - Cordes , et al. August 22, 2	2000-08-22
Method and apparatus for forming solder bumps Grant 6,056,191 - Brouillette , et al. May 2, 2	2000-05-02
Apparatus for transferring solder bumps and method of using Grant 6,003,757 - Beaumont , et al. December 21, 1	1999-12-21
Method for building interconnect structures by injection molded solder and structures built Grant 5,775,569 - Berger , et al. July 7, 1	1998-07-07
Solder anchor decal and method Grant 5,673,846 - Gruber October 7, 1	1997-10-07

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.