loadpatents
name:-0.00040006637573242
name:-0.006850004196167
name:-0.00043416023254395
Groover; Richard L. Patent Filings

Groover; Richard L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Groover; Richard L..The latest application filed is for "thermally enhanced chip scale lead on chip semiconductor package and method of making same".

Company Profile
0.6.0
  • Groover; Richard L. - Chandler AZ
  • Groover; Richard L. - Santa Clara CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Thermally enhanced chip scale lead on chip semiconductor package and method of making same
Grant 7,064,009 - McCann , et al. June 20, 2
2006-06-20
Thermally enhanced chip scale lead on chip semiconductor package and method of making same
Grant 7,045,883 - McCann , et al. May 16, 2
2006-05-16
Thermally enhanced chip scale lead on chip semiconductor package and method of making same
Grant 6,873,032 - McCann , et al. March 29, 2
2005-03-29
Thermally enhanced chip scale lead on chip semiconductor package
Grant 6,597,059 - McCann , et al. July 22, 2
2003-07-22
Electrically and thermally enhanced package using a separate silicon substrate
Grant 5,598,031 - Groover , et al. January 28, 1
1997-01-28
Wirebond lead system with improved wire separation
Grant 5,530,281 - Groover , et al. June 25, 1
1996-06-25

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