| Patent | Date |
|---|
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20220013434 - Vadhavkar; Sameer S. ; et al. | 2022-01-13 |
Stacked Semiconductor Die Assemblies With Partitioned Logic And Associated Systems And Methods
App 20210217734 - Li; Jian ; et al. | 2021-07-15 |
Stacked semiconductor die assemblies with partitioned logic and associated systems and methods
Grant 10,978,427 - Li , et al. April 13, 2 | 2021-04-13 |
Stacked Semiconductor Die Assemblies With Multiple Thermal Paths And Associated Systems And Methods
App 20200350224 - Groothuis; Steven K. ; et al. | 2020-11-05 |
Semiconductor device assembly with vapor chamber
Grant 10,816,275 - Groothuis , et al. October 27, 2 | 2020-10-27 |
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
Grant 10,741,468 - Groothuis , et al. A | 2020-08-11 |
Semiconductor Device Assembly With Vapor Chamber
App 20200141658 - Groothuis; Steven K. ; et al. | 2020-05-07 |
Stacked Semiconductor Die Assemblies With Partitioned Logic And Associated Systems And Methods
App 20200075555 - Li; Jian ; et al. | 2020-03-05 |
Semiconductor device assembly with vapor chamber
Grant 10,551,129 - Groothuis , et al. Fe | 2020-02-04 |
Semiconductor Device Assembly With Vapor Chamber
App 20190145713 - Groothuis; Steven K. ; et al. | 2019-05-16 |
Stacked Semiconductor Die Assemblies With Multiple Thermal Paths And Associated Systems And Methods
App 20190122950 - Groothuis; Steven K. ; et al. | 2019-04-25 |
Semiconductor device assembly with vapor chamber
Grant 10,215,500 - Groothuis , et al. Feb | 2019-02-26 |
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
Grant 10,170,389 - Groothuis , et al. J | 2019-01-01 |
Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
Grant 10,163,755 - Vadhavkar , et al. Dec | 2018-12-25 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20180308785 - Vadhavkar; Sameer S. ; et al. | 2018-10-25 |
Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods
Grant 9,837,396 - Vadhavkar , et al. December 5, 2 | 2017-12-05 |
Stacked semiconductor die assemblies with thermal spacers and associated systems and methods
Grant 9,818,625 - Li , et al. November 14, 2 | 2017-11-14 |
Semiconductor die assembly and methods of forming thermal paths
Grant 9,780,079 - Li , et al. October 3, 2 | 2017-10-03 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20170229439 - Vadhavkar; Sameer S. ; et al. | 2017-08-10 |
Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
Grant 9,691,746 - Vadhavkar , et al. June 27, 2 | 2017-06-27 |
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Associated Methods
App 20160372452 - Vadhavkar; Sameer S. ; et al. | 2016-12-22 |
Seminconductor Device Assembly With Vapor Chamber
App 20160343639 - Groothuis; Steven K. ; et al. | 2016-11-24 |
Semiconductor Die Assembly And Methods Of Forming The Same
App 20160322340 - Li; Jian ; et al. | 2016-11-03 |
Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods
Grant 9,443,744 - Vadhavkar , et al. September 13, 2 | 2016-09-13 |
Stacked Semiconductor Die Assemblies With Thermal Spacers And Associated Systems And Methods
App 20160181125 - Li; Jian ; et al. | 2016-06-23 |
Stacked semiconductor die assemblies with thermal spacers and associated systems and methods
Grant 9,287,240 - Li , et al. March 15, 2 | 2016-03-15 |
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Associated Methods
App 20160013115 - Vadhavkar; Sameer S. ; et al. | 2016-01-14 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20160013173 - Vadhavkar; Sameer S. ; et al. | 2016-01-14 |
Stacked Semiconductor Die Assemblies With Multiple Thermal Paths And Associated Systems And Methods
App 20150348956 - Groothuis; Steven K. ; et al. | 2015-12-03 |
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
Grant 9,153,520 - Groothuis , et al. October 6, 2 | 2015-10-06 |
Stacked Semiconductor Die Assemblies With Partitioned Logic And Associated Systems And Methods
App 20150279431 - Li; Jian ; et al. | 2015-10-01 |
Stacked Semiconductor Die Assemblies With Thermal Spacers And Associated Systems And Methods
App 20150170991 - Li; Jian ; et al. | 2015-06-18 |
Stacked Semiconductor Die Assemblies With Multiple Thermal Paths And Associated Systems And Methods
App 20130119528 - Groothuis; Steven K. ; et al. | 2013-05-16 |
Microelectronic component assemblies having lead frames adapted to reduce package bow
Grant 7,601,562 - Groothuis , et al. October 13, 2 | 2009-10-13 |
Microelectronic Component Assemblies Having Lead Frames Adapted To Reduce Package Bow
App 20070128770 - Groothuis; Steven K. ; et al. | 2007-06-07 |
Microelectronic component assemblies having lead frames adapted to reduce package bow
Grant 7,183,485 - Groothuis , et al. February 27, 2 | 2007-02-27 |
Microelectronic component assemblies having lead frames adapted to reduce package bow
App 20040177984 - Groothuis, Steven K. ; et al. | 2004-09-16 |
Model generator for constructing and method of generating a model of an object for finite element analysis
Grant 5,581,489 - Groothuis , et al. December 3, 1 | 1996-12-03 |
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