| Patent | Date |
|---|
Component carrier
Grant 10,315,821 - Zaal , et al. | 2019-06-11 |
Reduction of defects in wafer level chip scale package (WLCSP) devices
Grant 10,177,111 - Kamphuis , et al. J | 2019-01-08 |
Component Carrier
App 20180134473 - Zaal; Jeroen Johannes Maria ; et al. | 2018-05-17 |
Integrated circuits and molding approaches therefor
Grant 9,842,776 - Nakka , et al. December 12, 2 | 2017-12-12 |
Integrated Circuits And Molding Approaches Therefor
App 20170200646 - Nakka; John Suman ; et al. | 2017-07-13 |
Reduction of defects in wafer level chip scale package (WLCSP) devices
Grant 9,704,823 - Kamphuis , et al. July 11, 2 | 2017-07-11 |
Reduction Of Defects In Wafer Level Chip Scale Package (wlcsp) Devices
App 20170179076 - Kamphuis; Tonny ; et al. | 2017-06-22 |
Reducing defects in wafer level chip scale package (WLCSP) devices
Grant 9,466,585 - Kamphuis , et al. October 11, 2 | 2016-10-11 |
Reducing Defects In Wafer Level Chip Scale Package (wlcsp) Devices
App 20160276306 - Kamphuis; Tonny ; et al. | 2016-09-22 |
Reduction Of Defects In Wafer Level Chip Scale Package (wlcsp) Devices
App 20160276176 - Kamphuis; Tonny ; et al. | 2016-09-22 |
Lead for connection to a semiconductor device
Grant 9,418,918 - Groenhuis , et al. August 16, 2 | 2016-08-16 |
Leadless chip carrier having improved mountability
Grant 9,418,919 - Groenhuis , et al. August 16, 2 | 2016-08-16 |
Leadless Chip Carrier Having Improved Mountability
App 20160211197 - GROENHUIS; Roelf Anco Jacob ; et al. | 2016-07-21 |
Discrete semiconductor device package and manufacturing method
Grant 9,263,335 - Boettcher , et al. February 16, 2 | 2016-02-16 |
Exposed Die Quad Flat No-leads (qfn) Package
App 20160005679 - Israel; Emil Casey ; et al. | 2016-01-07 |
Manufacturing methods for a sensor package including a lead frame
Grant 9,222,989 - Hesen , et al. December 29, 2 | 2015-12-29 |
Lead For Connection To A Semiconductor Device
App 20150287666 - Groenhuis; Roelf Anco Jacob ; et al. | 2015-10-08 |
Discrete Semiconductor Device Package And Manufacturing Method
App 20150140739 - BOETTCHER; Tim ; et al. | 2015-05-21 |
Discrete semiconductor device package and manufacturing method
Grant 8,981,566 - Boettcher , et al. March 17, 2 | 2015-03-17 |
Method for manufacturing a microelectronic package comprising at least one microelectronic device
Grant 8,884,410 - Van De Water , et al. November 11, 2 | 2014-11-11 |
Sensor Package
App 20140130346 - HESEN; Paulus Martinus Catharina ; et al. | 2014-05-15 |
Sensor packages including a lead frame and moulding body and methods of manufacturing
Grant 8,664,946 - Hesen , et al. March 4, 2 | 2014-03-04 |
Electronic Device And Method Of Manufacturing Such Device
App 20130334695 - TIJSSEN; Edwin ; et al. | 2013-12-19 |
Discrete Semiconductor Device Package And Manufacturing Method
App 20130320551 - BOETTCHER; Tim ; et al. | 2013-12-05 |
Circuit connector apparatus and method therefor
Grant 8,508,035 - Groenhuis , et al. August 13, 2 | 2013-08-13 |
Circuit connector apparatus and method therefor
App 20130140705 - Groenhuis; Roelf Anco Jacob ; et al. | 2013-06-06 |
Semiconductor Device Packaging Method And Semiconductor Device Package
App 20120286410 - GROENHUIS; Roelf Anco Jacob ; et al. | 2012-11-15 |
Leadframe And Method For Packaging Semiconductor Die
App 20120286399 - BOETTCHER; Tim ; et al. | 2012-11-15 |
Leadless Chip Carrier Having Improved Mountability
App 20120181678 - GROENHUIS; Roelf Anco Jacob ; et al. | 2012-07-19 |
Methods of packaging a semiconductor die and package formed by the methods
Grant 8,183,682 - Dijkstra , et al. May 22, 2 | 2012-05-22 |
Semiconductor Device Packaging Method And Semiconductor Device Package
App 20120112351 - WALCZYK; Sven ; et al. | 2012-05-10 |
Method For Manufacturing A Microelectronic Package Comprising At Least One Microelectronic Device
App 20110198738 - Van De Water; Peter WIilhelmus Maria ; et al. | 2011-08-18 |
Air cavity package for a semiconductor die and methods of forming the air cavity package
Grant 7,944,062 - Groenhuis , et al. May 17, 2 | 2011-05-17 |
Electronic device and method of manufacturing thereof
Grant 7,858,444 - Schriks , et al. December 28, 2 | 2010-12-28 |
Sensor Package
App 20100117171 - Hesen; Paulus Martinus Catharina ; et al. | 2010-05-13 |
Electronic Device And Method Of Manufacturing Thereof
App 20090162791 - SCHRIKS; Cornelis Gerardus ; et al. | 2009-06-25 |
Electronic device and method of manufacturing thereof
Grant 7,514,801 - Schriks , et al. April 7, 2 | 2009-04-07 |
Methods of Packaging a Semiconductor Die and Package Formed by the Methods
App 20080277772 - Groenhuis; Roelf Anco Jacob ; et al. | 2008-11-13 |
Air Cavity Package for a Semiconductor Die and Methods of Forming the Air Cavity Package
App 20080272475 - Dijkstra; Paul ; et al. | 2008-11-06 |
Carrier, method of manufacturing a carrier and an electronic device
Grant 7,247,938 - Groenhuis , et al. July 24, 2 | 2007-07-24 |
Electronic device and method of manufacturing thereof
App 20070052097 - Schriks; Cornelis Gerardus ; et al. | 2007-03-08 |
Method of manufacturing an electronic component and electronic component obtained by means of said method
Grant 7,022,588 - Bosman , et al. April 4, 2 | 2006-04-04 |
Carrier, method of manufacturing a carrier and an electronic device
App 20050153483 - Groenhuis, Roelf Anco Jacob ; et al. | 2005-07-14 |
Method of manufacturing an electronic component and electronic component obtained by means of said method
App 20040253768 - Bosman, Johan ; et al. | 2004-12-16 |
| 