Patent applications and USPTO patent grants for Groechel; David.The latest application filed is for "system and method for chemical mechanical planarization".
Patent | Date |
---|---|
System and method for chemical mechanical planarization Grant 7,048,607 - Wu , et al. May 23, 2 | 2006-05-23 |
High pressure high non-reactive diluent gas content high plasma ion density plasma oxide etch process Grant 6,238,588 - Collins , et al. May 29, 2 | 2001-05-29 |
Oxide etch process with high selectivity to nitride suitable for use on surfaces of uneven topography Grant 6,194,325 - Yang , et al. February 27, 2 | 2001-02-27 |
Parallel plate electrode plasma reactor having an inductive antenna and adjustable radial distribution of plasma ion density Grant 6,054,013 - Collins , et al. April 25, 2 | 2000-04-25 |
Plasma reactor with heated source of a polymer-hardening precursor material Grant 6,024,826 - Collins , et al. February 15, 2 | 2000-02-15 |
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