| Patent | Date |
|---|
Microelectronic device wafers and methods of manufacturing
Grant 8,455,983 - Wood , et al. June 4, 2 | 2013-06-04 |
Microelectronic Device Wafers And Methods Of Manufacturing
App 20120070959 - Wood; Alan G. ; et al. | 2012-03-22 |
Microelectronic device wafers and methods of manufacturing
Grant 8,062,958 - Wood , et al. November 22, 2 | 2011-11-22 |
Thin flip-chip method
Grant 7,811,903 - Grigg , et al. October 12, 2 | 2010-10-12 |
Microelectronic Device Wafers And Methods Of Manufacturing
App 20100252915 - Wood; Alan G. ; et al. | 2010-10-07 |
Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same
Grant 7,557,452 - Williams , et al. July 7, 2 | 2009-07-07 |
Thin Flip-chip Method
App 20080048343 - Grigg; Ford B. ; et al. | 2008-02-28 |
Thin flip-chip method
Grant 7,291,543 - Grigg , et al. November 6, 2 | 2007-11-06 |
Methods for fabricating stiffeners for flexible substrates
App 20070172992 - Grigg; Ford B. | 2007-07-26 |
Electrical connection methods employing corresponding, insulator-coated members of interconnection elements
App 20070148818 - Williams; Vernon M. ; et al. | 2007-06-28 |
Methods for fabricating reinforced, self-aligning conductive structures for semiconductor device components
App 20070148817 - Williams; Vernon M. ; et al. | 2007-06-28 |
Methods for fabricating stiffeners for flexible substrates
Grant 7,189,600 - Grigg March 13, 2 | 2007-03-13 |
Support ring for use with a contact pad and semiconductor device components including the same
Grant 7,170,171 - Grigg January 30, 2 | 2007-01-30 |
Thick solder mask for confining encapsulant material over selected locations of a substrate and assemblies including the solder mask
Grant 7,138,724 - Grigg , et al. November 21, 2 | 2006-11-21 |
Method and stencil for extruding material on a substrate
Grant 7,134,390 - Cobbley , et al. November 14, 2 | 2006-11-14 |
Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask
Grant 7,125,748 - Grigg , et al. October 24, 2 | 2006-10-24 |
Microelectronic devices and methods for mounting microelectronic packages to circuit boards
Grant 7,122,905 - Grigg October 17, 2 | 2006-10-17 |
Semiconductor device assemblies including interposers with dams protruding therefrom
Grant 7,115,981 - Grigg October 3, 2 | 2006-10-03 |
Methods for providing support for conductive structures protruding from semiconductor device components
Grant 7,109,106 - Grigg September 19, 2 | 2006-09-19 |
Solder masks used in encapsulation, assemblies including the solar mask, and methods
App 20060205117 - Grigg; Ford B. ; et al. | 2006-09-14 |
Method for fabricating interposers including upwardly protruding dams, semiconductor device assemblies including the interposers
Grant 7,064,002 - Grigg June 20, 2 | 2006-06-20 |
Methods for fabricating interposers including upwardly protruding dams
Grant 7,041,532 - Grigg May 9, 2 | 2006-05-09 |
Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
Grant 7,029,954 - Grigg April 18, 2 | 2006-04-18 |
LOC semiconductor assembled with room temperature adhesive
App 20060022314 - Grigg; Ford B. ; et al. | 2006-02-02 |
Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask
Grant 6,984,545 - Grigg , et al. January 10, 2 | 2006-01-10 |
Markings for use with semiconductor device components
App 20050285278 - Grigg, Ford B. ; et al. | 2005-12-29 |
LOC semiconductor assembled with room temperature adhesive
Grant 6,979,888 - Grigg , et al. December 27, 2 | 2005-12-27 |
Method and stencil for extruding material on a substrate
App 20050274267 - Cobbley, Chad ; et al. | 2005-12-15 |
Method and stencil for extruding material on a substrate
App 20050268801 - Cobbley, Chad ; et al. | 2005-12-08 |
Methods for fabricating electronic components to include supports for conductive structures
App 20050227411 - Grigg, Ford B. | 2005-10-13 |
Thin flip-chip method
App 20050208734 - Grigg, Ford B. ; et al. | 2005-09-22 |
Methods for labeling semiconductor device components
Grant 6,939,501 - Grigg , et al. September 6, 2 | 2005-09-06 |
Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask
App 20050181545 - Grigg, Ford B. ; et al. | 2005-08-18 |
Support ring for use with a contact pad and semiconductor device components including the same
App 20050156314 - Grigg, Ford B. | 2005-07-21 |
Thin flip-chip method
Grant 6,905,946 - Grigg , et al. June 14, 2 | 2005-06-14 |
Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad
Grant 6,902,995 - Grigg June 7, 2 | 2005-06-07 |
Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
Grant 6,900,078 - Grigg May 31, 2 | 2005-05-31 |
Support ring for use with a contact pad and semiconductor device components including the same
Grant 6,882,049 - Grigg April 19, 2 | 2005-04-19 |
Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
App 20040224442 - Grigg, Ford B. | 2004-11-11 |
Tape stiffener and semiconductor device component assemblies including same
App 20040212062 - Grigg, Ford B. | 2004-10-28 |
Method of manufacturing LOC semiconductor assembled with room temperature adhesive
Grant 6,787,396 - Grigg , et al. September 7, 2 | 2004-09-07 |
Methods for fabricating interposers including upwardly protruding DAMS
App 20040166607 - Grigg, Ford B. | 2004-08-26 |
Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
App 20040142507 - Grigg, Ford B. | 2004-07-22 |
Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
Grant 6,746,899 - Grigg June 8, 2 | 2004-06-08 |
Methods for finishing microelectronic device packages
App 20040104200 - Nally, Steven P. ; et al. | 2004-06-03 |
Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
Grant 6,740,962 - Grigg May 25, 2 | 2004-05-25 |
Thick solder mask for confining encapsulant material over selected location of a substrate and assemblies including the solder mask
App 20040080027 - Grigg, Ford B. ; et al. | 2004-04-29 |
Semiconductor device assemblies including interposers with dams protruding therefrom
App 20040070061 - Grigg, Ford B. | 2004-04-15 |
Stereolithographically marked semiconductor devices and methods
Grant 6,706,374 - Grigg , et al. March 16, 2 | 2004-03-16 |
Stereolithographically marked semiconductor devices and methods
Grant 6,703,105 - Grigg , et al. March 9, 2 | 2004-03-09 |
Microelectronic devices and methods for mounting microelectronic packages to circuit boards
App 20040012930 - Grigg, Ford B. | 2004-01-22 |
Method and stencil for extruding material on a substrate
App 20040011228 - Cobbley, Chad ; et al. | 2004-01-22 |
Thick solder mask for confining encapsulant material over selected locations of a substrate, assemblies including the solder mask, and methods
App 20040014255 - Grigg, Ford B. ; et al. | 2004-01-22 |
Methods for labeling semiconductor device components
App 20040000744 - Grigg, Ford B. ; et al. | 2004-01-01 |
LOC semiconductor assembled with room temperature adhesive
Grant 6,653,721 - Grigg , et al. November 25, 2 | 2003-11-25 |
Stereolithographically marked semiconductor devices and methods
Grant 6,635,333 - Grigg , et al. October 21, 2 | 2003-10-21 |
Semiconductor device assemblies including interposers with dams protruding therefrom
Grant 6,630,730 - Grigg October 7, 2 | 2003-10-07 |
Methods for manufacturing microelectronic devices and methods for mounting microelectronic packages to circuit boards
Grant 6,622,380 - Grigg September 23, 2 | 2003-09-23 |
Method of manufacturing LOC semiconductor assembled with room temperature adhesive
App 20030176019 - Grigg, Ford B. ; et al. | 2003-09-18 |
Methods for providing support for conductive structures protruding from semiconductor device components
App 20030176016 - Grigg, Ford B. | 2003-09-18 |
Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
App 20030176021 - Grigg, Ford B. | 2003-09-18 |
Support ring for use with a contact pad and semiconductor device compoents including the same
App 20030173665 - Grigg, Ford B. | 2003-09-18 |
Methods for finishing microelectronic device packages
Grant 6,602,430 - Nally , et al. August 5, 2 | 2003-08-05 |
Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad
App 20030139030 - Grigg, Ford B. | 2003-07-24 |
Methods for labeling semiconductor device components
Grant 6,585,927 - Grigg , et al. July 1, 2 | 2003-07-01 |
Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
Grant 6,562,661 - Grigg May 13, 2 | 2003-05-13 |
Stereolithographically marked semiconductor devices and methods
App 20030077418 - Grigg, Ford B. ; et al. | 2003-04-24 |
Stereolithographically marked semiconductor devices and methods
App 20030072926 - Grigg, Ford B. ; et al. | 2003-04-17 |
Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad
Grant 6,548,897 - Grigg April 15, 2 | 2003-04-15 |
Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods
App 20030068840 - Grigg, Ford B. | 2003-04-10 |
Thin flip--chip method
Grant 6,506,681 - Grigg , et al. January 14, 2 | 2003-01-14 |
Thin flip-chip method
App 20030008510 - Grigg, Ford B. ; et al. | 2003-01-09 |
Stereolithographically marked semiconductor devices and methods
Grant 6,489,007 - Grigg , et al. December 3, 2 | 2002-12-03 |
Method and stencil for extruding material on a substrate
App 20020139257 - Cobbley, Chad ; et al. | 2002-10-03 |
LOC semiconductor assembled with room temperature adhesive
App 20020090751 - Grigg, Ford B. ; et al. | 2002-07-11 |
Thin flip - chip method
App 20020068453 - Grigg, Ford B. ; et al. | 2002-06-06 |
LOC Semiconductor assembled with room temprature adhesive
App 20020056896 - Grigg, Ford B. ; et al. | 2002-05-16 |
LOC semiconductor assembled with room temperature adhesive
App 20020030253 - Grigg, Ford B. ; et al. | 2002-03-14 |
Method and stencil for extruding material on a substrate
App 20020023554 - Cobbley, Chad ; et al. | 2002-02-28 |
Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad
App 20020024136 - Grigg, Ford B. | 2002-02-28 |
Stereolithographically marked semiconductor devices and methods
App 20020018871 - Grigg, Ford B. ; et al. | 2002-02-14 |
Stereolithographically marked semiconductor devices and methods
App 20020006501 - Grigg, Ford B. ; et al. | 2002-01-17 |
Stereolithographically marked semiconductors devices and methods
Grant 6,337,122 - Grigg , et al. January 8, 2 | 2002-01-08 |
Tape stiffener, semiconductor device assemblies including same, and stereolithographic methods for fabricating same
App 20010051395 - Grigg, Ford B. | 2001-12-13 |
Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods
App 20010038144 - Grigg, Ford B. | 2001-11-08 |
Stereolithographically marked semiconductor devices and methods
App 20010035597 - Grigg, Ford B. ; et al. | 2001-11-01 |
Semiconductor Processing Methods Of Forming Encapsulant Over Semiconductive Dies, And Methods Of Forming Die Packages
App 20010012641 - GRIGG, FORD B. ; et al. | 2001-08-09 |
LOC semiconductor assembled with room temperature adhesive
App 20010007784 - Grigg, Ford B. ; et al. | 2001-07-12 |
Method and stencil for extruding material on a substrate
Grant 6,089,151 - Cobbley , et al. July 18, 2 | 2000-07-18 |
LOC semiconductor assembled with room temperature adhesive
Grant 5,959,347 - Grigg , et al. September 28, 1 | 1999-09-28 |
LOC semiconductor assembled with room temperature adhesive
Grant 5,840,598 - Grigg , et al. November 24, 1 | 1998-11-24 |
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