Grief; Malcolm K

Patent Applications and Registrations

Patent applications and USPTO patent grants for Grief; Malcolm K.The latest application filed is for "wafer-scale package including power source".

Company Profile

0.7.3

Grief; Malcolm K - Phoenix AZ
Grief; Malcolm K. - Phoenix AZ
Grief; Malcolm K. - Chandler AZ
Grief; Malcolm K. - Boise ID
Grief; Malcolm K. - Eindhoven NL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer-scale package including power source Grant 9,431,312 - O'Brien , et al. August 30, 2	2016-08-30
Wafer-scale Package Including Power Source App 20160204004 - O'Brien; Richard J. ; et al.	2016-07-14
Wafer-scale package including power source Grant 9,318,400 - O'Brien , et al. April 19, 2	2016-04-19
Wafer-scale Package Including Power Source App 20140171822 - O'Brien; Richard J. ; et al.	2014-06-19
Wafer-scale package including power source Grant 8,666,505 - O'Brien , et al. March 4, 2	2014-03-04
Wafer-scale Package Including Power Source App 20120101540 - O'Brien; Richard J. ; et al.	2012-04-26
Apparatus and method for planar end-point detection during chemical-mechanical polishing Grant 5,738,562 - Doan , et al. April 14, 1	1998-04-14
Method of forming a configuration of interconnections on a semiconductor device having a high integration density Grant RE34,583 - Grief , et al. April 12, 1	1994-04-12
Method of forming a configuration of interconnections on a semiconductor device having a high integration density Grant 4,936,950 - Doan , et al. June 26, 1	1990-06-26

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