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Chemical mechanical polishing (CMP) of cobalt-containing substrate
Grant 10,745,589 - Shi , et al. A | 2020-08-18 |
Composite abrasive particles for chemical mechanical planarization composition and method of use thereof
Grant 10,669,449 - Zhou , et al. | 2020-06-02 |
Composite Abrasive Particles for Chemical Mechanical Planarization Composition and Method of Use Thereof
App 20200115590 - Zhou; Hongjun ; et al. | 2020-04-16 |
Composite abrasive particles for chemical mechanical planarization composition and method of use thereof
Grant 10,109,493 - Zhou , et al. October 23, 2 | 2018-10-23 |
Low dishing copper chemical mechanical planarization
Grant 9,978,609 - Shi , et al. May 22, 2 | 2018-05-22 |
Chemical Mechanical Polishing (CMP) of Cobalt-Containing substrate
App 20170362466 - Shi; Xiaobo ; et al. | 2017-12-21 |
Low Dishing Copper Chemical Mechanical Planarization
App 20160314989 - Shi; Xiaobo ; et al. | 2016-10-27 |
Composite Abrasive Particles For Chemical Mechanical Planarization Composition and Method of Use Thereof
App 20160200944 - Zhou; Hongjun ; et al. | 2016-07-14 |
Chemical Mechanical Polishing Slurry for Reducing Corrosion and Method of Use Therefor
App 20160122590 - Lew; Blake J. ; et al. | 2016-05-05 |
Engagement Probes
Grant 7,330,036 - Farnworth , et al. February 12, 2 | 2008-02-12 |
Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
Grant 7,116,118 - Farnworth , et al. October 3, 2 | 2006-10-03 |
Apparatuses configured to engage a conductive pad
Grant 7,098,475 - Farnworth , et al. August 29, 2 | 2006-08-29 |
Engagement probe having a grouping of projecting apexes for engaging a conductive pad
Grant 7,026,835 - Farnworth , et al. April 11, 2 | 2006-04-11 |
Multiprobe detection system for chemical-mechanical planarization tool
Grant 6,960,115 - Weldon , et al. November 1, 2 | 2005-11-01 |
Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
Grant 6,833,727 - Farnworth , et al. December 21, 2 | 2004-12-21 |
Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
App 20040207421 - Farnworth, Warren M. ; et al. | 2004-10-21 |
Multiprobe detection system for chemical-mechanical planarization tool
Grant 6,805,613 - Weldon , et al. October 19, 2 | 2004-10-19 |
Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
App 20040174178 - Farnworth, Warren M. ; et al. | 2004-09-09 |
Apparatuses configured to engage a conductive pad
App 20040095158 - Farnworth, Warren M. ; et al. | 2004-05-20 |
Multiprobe detection system for chemical-mechanical planarization tool
App 20040038624 - Weldon, Matthew ; et al. | 2004-02-26 |
Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
App 20040021476 - Farnworth, Warren M. ; et al. | 2004-02-05 |
Engagement probe and apparatuses configured to engage a conductive pad
Grant 6,686,758 - Farnworth , et al. February 3, 2 | 2004-02-03 |
Methods of engaging electrically conductive pads on a semiconductor substrate
Grant 6,670,819 - Farnworth , et al. December 30, 2 | 2003-12-30 |
Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes
Grant 6,657,450 - Farnworth , et al. December 2, 2 | 2003-12-02 |
Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate
Grant 6,614,249 - Farnworth , et al. September 2, 2 | 2003-09-02 |
Engagement probes
App 20030006798 - Farnworth, Warren M. ; et al. | 2003-01-09 |
Methods Of Engaging Electrically Conductive Test Pads On A Semiconductor Substrate Removable Electrical Interconnect Apparatuses, Engagement Probes And Removable Engagement Probes
App 20020140450 - FARNWORTH, WARREN M. ; et al. | 2002-10-03 |
Engagement probes
App 20020093361 - Farnworth, Warren M. ; et al. | 2002-07-18 |
Methods of engaging electrically conductive pads on a semiconductor substrate
App 20020067183 - Farnworth, Warren M. ; et al. | 2002-06-06 |
Method of forming an apparatus configured to engage an electrically conductive pad on a semiconductive substrate and a method of engaging electrically conductive pads on a semiconductive substrate
App 20010050570 - Farnworth, Warren M. ; et al. | 2001-12-13 |
Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate
App 20010030550 - Farnworth, Warren M. ; et al. | 2001-10-18 |
Removable electrical interconnect apparatuses and removable engagement probes
App 20010015655 - Farnworth, Warren M. ; et al. | 2001-08-23 |
Method for chemical planarization (CMP) of a semiconductor wafer to provide a planar surface free of microscratches
Grant 5,514,245 - Doan , et al. May 7, 1 | 1996-05-07 |
Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
Grant 5,326,428 - Farnworth , et al. July 5, 1 | 1994-07-05 |
Method to reduce the reflectivity of a semi-conductor metallic surface
Grant 5,166,093 - Grief November 24, 1 | 1992-11-24 |
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