Gregorich; Thomas Matthew

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gregorich; Thomas Matthew.The latest application filed is for "flip chip package utilizing trace bump trace interconnection".

Company Profile

2.21.20

Gregorich; Thomas Matthew - San Diego CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Flip chip package utilizing trace bump trace interconnection Grant 11,121,108 - Lin , et al. September 14, 2	2021-09-14
Flip Chip Package Utilizing Trace Bump Trace Interconnection App 20200294948 - Lin; Tzu-Hung ; et al.	2020-09-17
Flip chip package utilizing trace bump trace interconnection Grant 10,707,183 - Lin , et al.	2020-07-07
Flip Chip Package Utilizing Trace Bump Trace Interconnection App 20190295980 - Lin; Tzu-Hung ; et al.	2019-09-26
Flip chip package utilizing trace bump trace interconnection Grant 10,354,970 - Lin , et al. July 16, 2	2019-07-16
Semiconductor package Grant 9,659,893 - Lin , et al. May 23, 2	2017-05-23
Semiconductor package with trace covered by solder resist Grant 9,640,505 - Lin , et al. May 2, 2	2017-05-02
Enhanced flip chip structure using copper column interconnect Grant 9,437,534 - Gregorich , et al. September 6, 2	2016-09-06
Integrated circuit package structure Grant 9,437,512 - Gregorich , et al. September 6, 2	2016-09-06
Semiconductor Package App 20150357291 - LIN; Tzu-Hung ; et al.	2015-12-10
Semiconductor Package App 20150348932 - LIN; Tzu-Hung ; et al.	2015-12-03
Semiconductor package with solder resist capped trace to prevent underfill delamination Grant 9,142,526 - Lin , et al. September 22, 2	2015-09-22
Enhanced Flip Chip Structure Using Copper Column Interconnect App 20150249060 - Gregorich; Thomas Matthew ; et al.	2015-09-03
Enhanced flip chip structure using copper column interconnect Grant 9,064,757 - Gregorich , et al. June 23, 2	2015-06-23
Molded interposer package and method for fabricating the same Grant 9,040,359 - Gregorich , et al. May 26, 2	2015-05-26
Molded interposer package and method for fabricating the same Grant 8,957,518 - Gregorich , et al. February 17, 2	2015-02-17
Molded Interposer Package And Method For Fabricating The Same App 20140377913 - GREGORICH; Thomas Matthew ; et al.	2014-12-25
Molded interposer package and method for fabricating the same Grant 8,859,340 - Gregorich , et al. October 14, 2	2014-10-14
Molded Interposer Package And Method For Fabricating The Same App 20140127865 - GREGORICH; Thomas Matthew ; et al.	2014-05-08
Semiconductor Package App 20140091481 - LIN; Tzu-Hung ; et al.	2014-04-03
Semiconductor package Grant 8,633,588 - Lin , et al. January 21, 2	2014-01-21
Enhanced Flip Chip Structure Using Copper Column Interconnect App 20130221536 - Gregorich; Thomas Matthew ; et al.	2013-08-29
Package substrate for bump on trace interconnection Grant 8,502,377 - Lin , et al. August 6, 2	2013-08-06
Molded Interposer Package And Method For Fabricating The Same App 20130168857 - GREGORICH; Thomas Matthew ; et al.	2013-07-04
Semiconductor Package App 20130161810 - Lin; Tzu-Hung ; et al.	2013-06-27
Flip Chip Package Utilizing Trace Bump Trace Interconnection App 20130140694 - Lin; Tzu-Hung ; et al.	2013-06-06
Integrated Circuit Package Structure App 20130087911 - GREGORICH; Thomas Matthew ; et al.	2013-04-11
Flip chip package utilizing trace bump trace interconnection Grant 8,390,119 - Lin , et al. March 5, 2	2013-03-05
Printed Circuit Board (pcb) Assembly With Advanced Quad Flat No-lead (a-qfn) Package App 20120140427 - GREGORICH; Thomas Matthew ; et al.	2012-06-07
Package Substrate For Bump On Trace Interconnection App 20120032343 - Lin; Tzu-Hung ; et al.	2012-02-09
Flip Chip Package Utilizing Trace Bump Trace Interconnection App 20120032322 - Lin; Tzu-Hung ; et al.	2012-02-09

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