| Patent | Date |
|---|
Packaged Leds With Phosphor Films, And Associated Systems And Methods
App 20210359173 - Greenwood; Jonathon G. | 2021-11-18 |
Packaged LEDs with phosphor films, and associated systems and methods
Grant 11,081,625 - Greenwood August 3, 2 | 2021-08-03 |
Method For Embedding Silicon Die Into A Stacked Package
App 20210202461 - Silvestri; Paul ; et al. | 2021-07-01 |
Method For Embedding Silicon Die Into A Stacked Package
App 20170309607 - Silvestri; Paul ; et al. | 2017-10-26 |
Method for embedding silicon die into a stacked package
Grant 9,735,136 - Silvestri , et al. August 15, 2 | 2017-08-15 |
Packaged Leds With Phosphor Films, And Associated Systems And Methods
App 20170194537 - Greenwood; Jonathon G. | 2017-07-06 |
Microelectronic Devices And Methods For Manufacturing Microelectronic Devices
App 20160031707 - Greenwood; Jonathon G. ; et al. | 2016-02-04 |
Light emitting diode thermally enhanced cavity package and method of manufacture
Grant 8,936,953 - Greenwood January 20, 2 | 2015-01-20 |
Light emitting diode wafer-level package with self-aligning features
Grant 8,878,205 - Greenwood November 4, 2 | 2014-11-04 |
Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication
Grant 8,872,310 - Cobbley , et al. October 28, 2 | 2014-10-28 |
Light Emitting Diode Thermally Enhanced Cavity Package And Method Of Manufacture
App 20140093989 - Greenwood; Jonathon G. | 2014-04-03 |
Light emitting diode thermally enhanced cavity package and method of manufacture
Grant 8,598,612 - Greenwood December 3, 2 | 2013-12-03 |
Light Emitting Diode Wafer-level Package With Self-aligning Features
App 20130248897 - Greenwood; Jonathon G. | 2013-09-26 |
Semiconductor Device Structures And Electronic Devices Including Same Hybrid Conductive Vias, And Methods Of Fabrication
App 20130187289 - Cobbley; Chad A. ; et al. | 2013-07-25 |
Light emitting diode wafer-level package with self-aligning features
Grant 8,441,020 - Greenwood May 14, 2 | 2013-05-14 |
Semiconductor device structures and electronic devices including same hybrid conductive vias
Grant 8,344,514 - Cobbley , et al. January 1, 2 | 2013-01-01 |
Packaged Leds With Phosphor Films, And Associated Systems And Methods
App 20110309393 - Greenwood; Jonathon G. | 2011-12-22 |
Light Emitting Diode Thermally Enhanced Cavity Package And Method Of Manufacture
App 20110241041 - Greenwood; Jonathon G. | 2011-10-06 |
Light Emitting Diode Wafer-level Package With Self-aligning Features
App 20110220925 - Greenwood; Jonathon G. | 2011-09-15 |
Semiconductor Device Structures And Electronic Devices Including Same Hybrid Conductive Vias
App 20110180936 - Cobbley; Chad A. ; et al. | 2011-07-28 |
Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends
Grant 7,939,449 - Cobbley , et al. May 10, 2 | 2011-05-10 |
Method For Embedding Silicon Die Into A Stacked Package
App 20100224976 - Silvestri; Paul ; et al. | 2010-09-09 |
Hybrid Conductive Vias Including Small Dimension Active Surface Ends And Larger Dimension Back Side Ends, Semiconductor Devices Including The Same, And Associated Methods
App 20090294983 - Cobbley; Chad A. ; et al. | 2009-12-03 |
Microelectronic devices and methods for manufacturing microelectronic devices
App 20070045807 - Greenwood; Jonathon G. ; et al. | 2007-03-01 |
Making chip size semiconductor packages
Grant 6,338,985 - Greenwood January 15, 2 | 2002-01-15 |
Method for improving distribution of underfill between a flip chip die and a circuit board
Grant 5,647,123 - Greenwood , et al. July 15, 1 | 1997-07-15 |
Method and structure for attaching a circuit module to a circuit board
Grant 5,598,967 - Greenwood , et al. February 4, 1 | 1997-02-04 |
Method and apparatus for solder sphere placement using an air knife
Grant 5,431,332 - Kirby , et al. July 11, 1 | 1995-07-11 |
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