Patent | Date |
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Multiple-depth trench interconnect technology at advanced semiconductor nodes Grant 10,169,525 - Greco , et al. J | 2019-01-01 |
Early overlay prediction and overlay-aware mask design Grant 10,152,567 - Greco , et al. Dec | 2018-12-11 |
Early Overlay Prediction And Overlay-aware Mask Design App 20180129774 - Greco; Stephen E. ;   et al. | 2018-05-10 |
Early overlay prediction and overlay-aware mask design Grant 9,940,429 - Greco , et al. April 10, 2 | 2018-04-10 |
Multiple-depth Trench Interconnect Technology At Advanced Semiconductor Nodes App 20170277823 - Greco; Stephen E. ;   et al. | 2017-09-28 |
Multiple-depth trench interconnect technology at advanced semiconductor nodes Grant 9,710,592 - Greco , et al. July 18, 2 | 2017-07-18 |
Interconnect level structures for confining stitch-induced via structures Grant 9,601,367 - Greco , et al. March 21, 2 | 2017-03-21 |
Integrated circuit structure with crack stop and method of forming same Grant 9,589,912 - Liang , et al. March 7, 2 | 2017-03-07 |
Integrated circuit structure with metal crack stop and methods of forming same Grant 9,589,911 - Liang , et al. March 7, 2 | 2017-03-07 |
Integrated Circuit Structure With Crack Stop And Method Of Forming Same App 20170062355 - Liang; Jim S. ;   et al. | 2017-03-02 |
Integrated Circuit Structure With Metal Crack Stop And Methods Of Forming Same App 20170062354 - Liang; Jim S. ;   et al. | 2017-03-02 |
Early Overlay Prediction And Overlay-aware Mask Design App 20160378904 - Greco; Stephen E. ;   et al. | 2016-12-29 |
Selective local metal cap layer formation for improved electromigration behavior Grant 9,455,186 - Angyal , et al. September 27, 2 | 2016-09-27 |
Stitch-derived via structures and methods of generating the same Grant 9,454,631 - Greco , et al. September 27, 2 | 2016-09-27 |
Dividing lithography exposure fields to improve semiconductor fabrication Grant 9,424,388 - Greco , et al. August 23, 2 | 2016-08-23 |
Selective local metal cap layer formation for improved electromigration behavior Grant 9,406,560 - Angyal , et al. August 2, 2 | 2016-08-02 |
Selective local metal cap layer formation for improved electromigration behavior Grant 9,385,038 - Angyal , et al. July 5, 2 | 2016-07-05 |
Dividing Lithography Exposure Fields To Improve Semiconductor Fabrication App 20160180003 - Greco; Stephen E. ;   et al. | 2016-06-23 |
Interconnect level structures for confining stitch-induced via structures Grant 9,373,538 - Greco , et al. June 21, 2 | 2016-06-21 |
Multiple-depth Trench Interconnect Technology At Advancedsemiconductor Nodes App 20160042114 - Greco; Stephen E. ;   et al. | 2016-02-11 |
Interconnect Level Structures For Confining Stitch-induced Via Structures App 20160027687 - Greco; Stephen E. ;   et al. | 2016-01-28 |
Stitch-derived Via Structures And Methods Of Generating The Same App 20150339422 - Greco; Stephen E. ;   et al. | 2015-11-26 |
Measuring metal line spacing in semiconductor devices Grant 9,157,980 - Dyer , et al. October 13, 2 | 2015-10-13 |
Selective Local Metal Cap Layer Formation For Improved Electromigration Behavior App 20150255343 - Angyal; Matthew S. ;   et al. | 2015-09-10 |
Selective Local Metal Cap Layer Formation For Improved Electromigration Behavior App 20150255342 - Angyal; Matthew S. ;   et al. | 2015-09-10 |
Selective Local Metal Cap Layer Formation For Improved Electromigration Behavior App 20150255398 - Angyal; Matthew S. ;   et al. | 2015-09-10 |
System and method of predicting problematic areas for lithography in a circuit design Grant 9,075,944 - Brunner , et al. July 7, 2 | 2015-07-07 |
Selective local metal cap layer formation for improved electromigration behavior Grant 9,076,847 - Angyal , et al. July 7, 2 | 2015-07-07 |
Reticle data decomposition for focal plane determination in lithographic processes Grant 9,058,457 - Greco , et al. June 16, 2 | 2015-06-16 |
Reticle Data Decomposition For Focal Plane Determination In Lithographic Processes App 20150143305 - Greco; Stephen E. ;   et al. | 2015-05-21 |
Interconnect Level Structures For Confining Stitch-induced Via Structures App 20140284813 - Greco; Stephen E. ;   et al. | 2014-09-25 |
Generation of design shapes for confining stitch-induced via structures Grant 8,806,393 - Greco , et al. August 12, 2 | 2014-08-12 |
Selective Local Metal Cap Layer Formation For Improved Electromigration Behavior App 20140203435 - Angyal; Matthew S. ;   et al. | 2014-07-24 |
Measuring Metal Line Spacing In Semiconductor Devices App 20140139236 - Dyer; Thomas W. ;   et al. | 2014-05-22 |
System And Method Of Predicting Problematic Areas For Lithography In A Circuit Design App 20130286370 - Brunner; Timothy A. ;   et al. | 2013-10-31 |
IC having viabar interconnection and related method Grant 8,492,268 - Chidambarrao , et al. July 23, 2 | 2013-07-23 |
System and method of predicting problematic areas for lithography in a circuit design Grant 8,484,586 - Brunner , et al. July 9, 2 | 2013-07-09 |
IC having viabar interconnection and related method Grant 8,299,622 - Chidambarrao , et al. October 30, 2 | 2012-10-30 |
System And Method Of Predicting Problematic Areas For Lithography In A Circuit Design App 20120254812 - BRUNNER; Timothy A. ;   et al. | 2012-10-04 |
System and method of predicting problematic areas for lithography in a circuit design Grant 8,239,789 - Brunner , et al. August 7, 2 | 2012-08-07 |
Ic Having Viabar Interconnection And Related Method App 20120164758 - Chidambarrao; Dureseti ;   et al. | 2012-06-28 |
Apparatus, method and computer program product for fast simulation of manufacturing effects during integrated circuit design Grant 8,117,568 - Xiang , et al. February 14, 2 | 2012-02-14 |
Integrated circuit fuse Grant 8,053,862 - Greco November 8, 2 | 2011-11-08 |
System and method of predicting problematic areas for lithography in a circuit design Grant 8,001,495 - Brunner , et al. August 16, 2 | 2011-08-16 |
System And Method Of Predicting Problematic Areas For Lithography In A Circuit Design App 20110184715 - BRUNNER; Timothy A. ;   et al. | 2011-07-28 |
Via density change to improve wafer surface planarity Grant 7,949,981 - Greco May 24, 2 | 2011-05-24 |
Intersect area based ground rule for semiconductor design Grant 7,941,780 - Avanessian , et al. May 10, 2 | 2011-05-10 |
Laser fuse structures for high power applications Grant 7,701,035 - Greco , et al. April 20, 2 | 2010-04-20 |
Apparatus, Method and Computer Program Product for Fast Stimulation of Manufacturing Effects During Integrated Circuit Design App 20100077372 - Xiang; Hua ;   et al. | 2010-03-25 |
Ic Having Viabar Interconnection And Related Method App 20100032846 - Chidambarrao; Dureseti ;   et al. | 2010-02-11 |
Via Density Change To Improve Wafer Surface Planarity App 20100031221 - Greco; Stephen E. | 2010-02-04 |
Dry etchback of interconnect contacts Grant 7,645,700 - Standaert , et al. January 12, 2 | 2010-01-12 |
Structure to monitor arcing in the processing steps of metal layer build on silicon-on-insulator semiconductors Grant 7,612,371 - Ahsan , et al. November 3, 2 | 2009-11-03 |
Intersect Area Based Ground Rule For Semiconductor Design App 20090265673 - Avanessian; Albrik ;   et al. | 2009-10-22 |
System And Method Of Predicting Problematic Areas For Lithography In A Circuit Design App 20090265679 - Brunner; Timothy A. ;   et al. | 2009-10-22 |
Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy via Grant 7,439,173 - Greco , et al. October 21, 2 | 2008-10-21 |
Integrated Circuit Fuse App 20080179709 - Greco; Stephen E. | 2008-07-31 |
Integrated circuit fuse and method of opening Grant 7,390,615 - Greco June 24, 2 | 2008-06-24 |
Dynamic metal fill for correcting non-planar region Grant 7,368,302 - Greco May 6, 2 | 2008-05-06 |
Dry Etchback Of Interconnect Contacts App 20080088027 - STANDAERT; THEODORUSE ;   et al. | 2008-04-17 |
Increasing Electromigration Lifetime And Current Density In Ic Using Vertically Upwardly Extending Dummy Via App 20080026567 - Greco; Stephen E. ;   et al. | 2008-01-31 |
Dry etchback of interconnect contacts Grant 7,323,410 - Standaert , et al. January 29, 2 | 2008-01-29 |
Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy via Grant 7,301,236 - Greco , et al. November 27, 2 | 2007-11-27 |
Structure To Monitor Arcing In The Processing Steps Of Metal Layer Build On Silicon-on-insulator Semiconductors App 20070164421 - Ahsan; Ishtiaq ;   et al. | 2007-07-19 |
Laser Fuse Structures For High Power Applications App 20070120232 - Greco; Stephen E. ;   et al. | 2007-05-31 |
Increasing Electromigration Lifetime And Current Densityin Ic Using Vertically Upwardly Extending Dummy Via App 20070087555 - Greco; Stephen E. ;   et al. | 2007-04-19 |
Dry Etchback Of Interconnect Contacts App 20070032055 - Standaert; Theodorus E. ;   et al. | 2007-02-08 |
Reliable low-k interconnect structure with hybrid dielectric Grant 7,135,398 - Fitzsimmons , et al. November 14, 2 | 2006-11-14 |
Dynamic Metal Fill For Correcting Non-planar Region App 20060246609 - GRECO; STEPHEN E. | 2006-11-02 |
Method to generate porous organic dielectric Grant 7,101,784 - Clevenger , et al. September 5, 2 | 2006-09-05 |
Forming of local and global wiring for semiconductor product Grant 7,071,099 - Greco , et al. July 4, 2 | 2006-07-04 |
Method to generate porous organic dielectric App 20050200024 - Clevenger, Lawrence A. ;   et al. | 2005-09-15 |
Method to generate porous organic dielectric Grant 6,921,978 - Clevenger , et al. July 26, 2 | 2005-07-26 |
Reliable low-k interconnect structure with hybrid dielectric Grant 6,917,108 - Fitzsimmons , et al. July 12, 2 | 2005-07-12 |
Reliable low-k interconnect structure with hybrid dielectric App 20050023693 - Fitzsimmons, John A. ;   et al. | 2005-02-03 |
Integrated Circuit Fuse And Method Of Opening App 20040259035 - Greco, Stephen E. | 2004-12-23 |
Method To Generate Porous Organic Dielectric App 20040224494 - Clevenger, Lawrence A. ;   et al. | 2004-11-11 |
Reliable low-k interconnect structure with hybrid dielectric App 20040094839 - Fitzsimmons, John A. ;   et al. | 2004-05-20 |
Method of forming planar Cu interconnects without chemical mechanical polishing App 20040094511 - Seo, Soon-Cheon ;   et al. | 2004-05-20 |
Fine-pitch device lithography using a sacrificial hardmask Grant 6,734,096 - Dalton , et al. May 11, 2 | 2004-05-11 |
Dual damascene flowable oxide insulation structure and metallic barrier Grant 6,727,589 - Greco , et al. April 27, 2 | 2004-04-27 |
Fine-pitch device lithography using a sacrificial hardmask App 20030134505 - Dalton, Timothy J. ;   et al. | 2003-07-17 |
Interim oxidation of silsesquioxane dielectric for dual damascene process App 20010036739 - Cook, Robert ;   et al. | 2001-11-01 |
Dual damascene flowable oxide insulation structure and metallic barrier App 20010000115 - Greco, Stephen E. ;   et al. | 2001-04-05 |
Integrated circuit having crack stop for interlevel dielectric layers Grant 6,091,131 - Cook , et al. July 18, 2 | 2000-07-18 |
Large scale IC personalization method employing air dielectric structure for extended conductor Grant 5,530,290 - Aitken , et al. June 25, 1 | 1996-06-25 |
Larce scale IC personalization method employing air dielectric structure for extended conductors Grant 5,444,015 - Aitken , et al. August 22, 1 | 1995-08-22 |
Chip interconnection having a breathable etch stop layer Grant 5,371,047 - Greco , et al. December 6, 1 | 1994-12-06 |
Method of forming conductive lines and studs Grant 4,997,746 - Greco , et al. March 5, 1 | 1991-03-05 |
Cross-linked polyalkenyl phenol based photoresist compositions Grant 4,600,683 - Greco , et al. July 15, 1 | 1986-07-15 |