| Patent | Date |
|---|
Method and Device for Producing a Housing
App 20220285178 - Grassmann; Andreas | 2022-09-08 |
Semiconductor Package with Barrier to Contain Thermal Interface Material
App 20220238422 - Nikitin; Ivan ; et al. | 2022-07-28 |
Double Sided Cooling Module With Power Transistor Submodules
App 20220238413 - GRASSMANN; Andreas | 2022-07-28 |
Package With Encapsulated Electronic Component Between Laminate And Thermally Conductive Carrier
App 20220230930 - GRASSMANN; Andreas | 2022-07-21 |
Fluid-Cooled Package Having Shielding Layer
App 20220115293 - Grassmann; Andreas ; et al. | 2022-04-14 |
Batch manufacture of packages by sheet separated into carriers after mounting of electronic components
Grant 11,264,356 - Meyer , et al. March 1, 2 | 2022-03-01 |
Package cooled with cooling fluid and comprising shielding layer
Grant 11,244,886 - Grassmann , et al. February 8, 2 | 2022-02-08 |
Semiconductor panels, semiconductor packages, and methods for manufacturing thereof
Grant 11,171,066 - Meyer , et al. November 9, 2 | 2021-11-09 |
Leadframe, Encapsulated Package with Punched Lead and Sawn Side Flanks, and Corresponding Manufacturing Method
App 20210225744 - Singer; Frank ; et al. | 2021-07-22 |
Package comprising chip contact element of two different electrically conductive materials
Grant 11,056,458 - Kessler , et al. July 6, 2 | 2021-07-06 |
Batch Manufacture Of Packages By Sheet Separated Into Carriers After Mounting Of Electronic Components
App 20200365553 - Meyer; Thorsten ; et al. | 2020-11-19 |
Semiconductor Panels, Semiconductor Packages, And Methods For Manufacturing Thereof
App 20200203238 - Meyer; Thorsten ; et al. | 2020-06-25 |
Power Semiconductor Module and Method for Producing a Power Semiconductor Module
App 20200183056 - Nikitin; Ivan ; et al. | 2020-06-11 |
Package Comprising Chip Contact Element Of Two Different Electrically Conductive Materials
App 20200176412 - Kessler; Angela ; et al. | 2020-06-04 |
Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet
Grant 10,615,097 - Grassmann , et al. | 2020-04-07 |
Chip carrier configured for delamination-free encapsulation and stable sintering
Grant 10,586,756 - Roth , et al. | 2020-03-10 |
Package with partially encapsulated cooling channel for cooling an encapsulated chip
Grant 10,461,017 - Grassmann , et al. Oc | 2019-10-29 |
Package with roughened encapsulated surface for promoting adhesion
Grant 10,453,771 - Grassmann , et al. Oc | 2019-10-22 |
Cooling Techniques For Semiconductor Package
App 20190318976 - Hoegerl; Juergen ; et al. | 2019-10-17 |
Package with roughened encapsulated surface for promoting adhesion
Grant 10410949 - | 2019-09-10 |
Cooling techniques for semiconductor package
Grant 10,373,890 - Hoegerl , et al. | 2019-08-06 |
Electronic sub-module including a leadframe and a semiconductor chip disposed on the leadframe
Grant 10,304,751 - Grassmann , et al. | 2019-05-28 |
Package with interconnections having different melting temperatures
App 20190157192 - Grassmann; Andreas ; et al. | 2019-05-23 |
Package with interconnections having different melting temperatures
Grant 10,211,133 - Grassmann , et al. Feb | 2019-02-19 |
Semiconductor module cooling system
Grant 10,199,238 - Yoo , et al. Fe | 2019-02-05 |
Package with vertically spaced partially encapsulated contact structures
Grant 10,128,165 - Hable , et al. November 13, 2 | 2018-11-13 |
Semiconductor Module Cooling System
App 20180182643 - Yoo; Inpil ; et al. | 2018-06-28 |
Package with interconnections having different melting temperatures
App 20180138111 - Grassmann; Andreas ; et al. | 2018-05-17 |
Package with vertically spaced partially encapsulated contact structures
App 20180122720 - HABLE; Wolfram ; et al. | 2018-05-03 |
Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet
App 20180102302 - GRASSMANN; Andreas ; et al. | 2018-04-12 |
Chip carrier configured for delamination-free encapsulation and stable sintering
App 20180096919 - ROTH; Alexander ; et al. | 2018-04-05 |
Method of manufacturing a cooler for semiconductor modules
Grant 9,934,990 - Yoo , et al. April 3, 2 | 2018-04-03 |
Package with roughened encapsulated surface for promoting adhesion
App 20180082921 - GRASSMANN; Andreas ; et al. | 2018-03-22 |
Package cooled with cooling fluid and comprising shielding layer
App 20180082925 - GRASSMANN; Andreas ; et al. | 2018-03-22 |
Package with partially encapsulated cooling channel for cooling an encapsulated chip
App 20180040537 - GRASSMANN; Andreas ; et al. | 2018-02-08 |
Electronic Sub-Module Including a Leadframe and a Semiconductor Chip Disposed on the Leadframe
App 20170316999 - Grassmann; Andreas ; et al. | 2017-11-02 |
Electronic switching element and integrated sensor
Grant 9,768,766 - Willkofer , et al. September 19, 2 | 2017-09-19 |
Printed circuit board including a leadframe with inserted packaged semiconductor chips
Grant 9,721,863 - Grassmann , et al. August 1, 2 | 2017-08-01 |
Electronic module and method of manufacturing the same
App 20170154835 - Neugirg; Christian ; et al. | 2017-06-01 |
Method of Manufacturing a Cooler for Semiconductor Modules
App 20170140946 - Yoo; Inpil ; et al. | 2017-05-18 |
Inverter With Thermal Conductivity Interface Material And Hybrid Vehicle To Which The Same Is Applied
App 20170096066 - Lee; Hyun-Koo ; et al. | 2017-04-06 |
Plastic cooler for semiconductor modules
Grant 9,613,885 - Yoo , et al. April 4, 2 | 2017-04-04 |
Electronic module and method of manufacturing the same
Grant 9,589,922 - Neugirg , et al. March 7, 2 | 2017-03-07 |
Power Semiconductor Module And Method For Manufacturing The Same
App 20170062317 - Son; Jeong-Min ; et al. | 2017-03-02 |
Substrate, chip arrangement, and method for manufacturing the same
Grant 9,585,241 - Hable , et al. February 28, 2 | 2017-02-28 |
Printed Circuit Board Including a Leadframe with Inserted Packaged Semiconductor Chips
App 20160293524 - Grassmann; Andreas ; et al. | 2016-10-06 |
Plastic Cooler For Semiconductor Modules
App 20160260654 - Yoo; Inpil ; et al. | 2016-09-08 |
Power semiconductor module with current sensor
Grant 9,370,113 - Ausserlechner , et al. June 14, 2 | 2016-06-14 |
Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip
Grant 9,275,926 - Hable , et al. March 1, 2 | 2016-03-01 |
Electronic Switching Element And Integrated Sensor
App 20160013639 - Willkofer; Stefan ; et al. | 2016-01-14 |
Power Semiconductor Module With Current Sensor
App 20160014916 - Ausserlechner; Udo ; et al. | 2016-01-14 |
Electronic module and method of manufacturing the same
App 20150264796 - NEUGIRG; Christian ; et al. | 2015-09-17 |
Substrate, Chip Arrangement, And Method For Manufacturing The Same
App 20150085446 - Hable; Wolfram ; et al. | 2015-03-26 |
Power module comprising two substrates and method of manufacturing the same
App 20140353818 - GEITNER; Ottmar ; et al. | 2014-12-04 |
Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip
App 20140327127 - HABLE; Wolfram ; et al. | 2014-11-06 |
Contact hole fabrication with the aid of mutually crossing sudden phase shift edges of a single phase shift mask
Grant 6,635,388 - Friedrich , et al. October 21, 2 | 2003-10-21 |
Etching of contact holes
Grant 6,025,116 - Grassmann February 15, 2 | 2000-02-15 |
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