Graf; Eckhard

Patent Applications and Registrations

Patent applications and USPTO patent grants for Graf; Eckhard.The latest application filed is for "micromechanical device and method for manufacturing a micromechanical device".

Company Profile

2.23.20

Graf; Eckhard - Gomaringen DE
Graf, Eckhard - Gomringen DE
Graf; Eckhard - Bad Duerrheim DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Micromechanical device and method for manufacturing a micromechanical device Grant 11,261,082 - Graf , et al. March 1, 2	2022-03-01
MEMS component having two different internal pressures Grant 10,752,498 - Breitling , et al. A	2020-08-25
Micromechanical Device And Method For Manufacturing A Micromechanical Device App 20200198966 - Graf; Eckhard ; et al.	2020-06-25
Mems Component Having Two Different Internal Pressures App 20180346324 - Breitling; Achim ; et al.	2018-12-06
Component Having A Via And Method For Manufacturing It App 20150137329 - Gonska; Julian ; et al.	2015-05-21
Component having a via and method for manufacturing it Grant 8,975,118 - Gonska , et al. March 10, 2	2015-03-10
Sensor module Grant 8,748,998 - Frey , et al. June 10, 2	2014-06-10
Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches Grant 8,647,961 - Frey , et al. February 11, 2	2014-02-11
Method for establishing and closing a trench of a semiconductor component Grant 8,587,095 - Reinmuth , et al. November 19, 2	2013-11-19
Method for producing a micromechanical component having a trench structure for backside contact Grant 8,564,078 - Scheuerer , et al. October 22, 2	2013-10-22
Component Having a Via and Method for Manufacturing It App 20130147020 - Gonska; Julian ; et al.	2013-06-13
Method for producing a micromechanical component having a filler layer and a masking layer Grant 8,419,957 - Scheuerer , et al. April 16, 2	2013-04-16
Micromechanical component having multiple caverns, and manufacturing method Grant 8,174,082 - Fischer , et al. May 8, 2	2012-05-08
Method for producing a micromechanical component having a trench structure for backside contact Grant 8,138,006 - Scheuerer , et al. March 20, 2	2012-03-20
Method For Producing A Micromechanical Component Having A Trench Structure For Backside Contact App 20120049301 - Scheuerer; Roland ; et al.	2012-03-01
Method For Filling Cavities In Wafers, Correspondingly Filled Blind Hole And Wafer Having Correspondingly Filled Insulation Trenches App 20120038030 - Frey; Jens ; et al.	2012-02-16
Sensor Module App 20120032283 - FREY; Jens ; et al.	2012-02-09
Method For Establishing And Closing A Trench Of A Semiconductor Component App 20110169143 - Reinmuth; Jochen ; et al.	2011-07-14
Method For Producing A Micromechanical Component Having A Trench Structure For Backside Contact App 20100133630 - Scheuerer; Roland ; et al.	2010-06-03
Method For Producing A Micromechanical Component Having A Filler Layer And A Masking Layer App 20100089868 - Scheuerer; Roland ; et al.	2010-04-15
Micromechanical Component Having Multiple Caverns, and Manufacturing Method App 20080136000 - Fischer; Frank ; et al.	2008-06-12
Micromechanical cap structure and a corresponding production method Grant 7,294,894 - Fischer , et al. November 13, 2	2007-11-13
Micromechanical component as well as a method for producing a micromechanical component Grant 7,153,718 - Fischer , et al. December 26, 2	2006-12-26
Micromechanical component and corresponsing production method App 20050253240 - Nuechter, Wolfgang ; et al.	2005-11-17
Method for joining a silicon plate to a second plate Grant 6,955,975 - Reichenbach , et al. October 18, 2	2005-10-18
Method for manufacturing a micromechanical component and a component that is manufactured in accordance with the method Grant 6,951,824 - Fischer , et al. October 4, 2	2005-10-04
Method for anodic bonding of wafers and device App 20050112843 - Fischer, Frank ; et al.	2005-05-26
Micromechanical component as well as a method for producing a micromechanical component Grant 6,876,048 - Fischer , et al. April 5, 2	2005-04-05
Micromechanical cap structure and a corresponding production method App 20050045973 - Fischer, Frank ; et al.	2005-03-03
Micromechanical component as well as a method for producing a micromechanical component App 20040195638 - Fischer, Frank ; et al.	2004-10-07
Method for joining a silicon plate to a second plate App 20040082145 - Reichenbach, Frank ; et al.	2004-04-29
Method for producing a micromechanical component, and a component produced according to said method App 20030141561 - Fischer, Frank ; et al.	2003-07-31
Micromechanical component as well as a method for producing a micromechanical component App 20030001221 - Fischer, Frank ; et al.	2003-01-02
Method for sectioning a substrate wafer into a plurality of substrate chips App 20010055855 - Fischer, Frank ; et al.	2001-12-27
Method of producing acceleration sensors Grant 5,937,275 - Munzel , et al. August 10, 1	1999-08-10
Inside sealing device sleeve for insertion of pipes Grant 5,769,459 - Graf , et al. June 23, 1	1998-06-23

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