Govind; Anand

Patent Applications and Registrations

Patent applications and USPTO patent grants for Govind; Anand.The latest application filed is for "ball assignment schemes for integrated circuit packages".

Company Profile

0.10.6

Govind; Anand - Fremont CA
Govind; Anand - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Robust high density substrate design for thermal cycling reliability Grant 7,345,245 - Govind , et al. March 18, 2	2008-03-18
Routing scheme for differential pairs in flip chip substrates Grant 7,105,926 - Ramakrishnan , et al. September 12, 2	2006-09-12
Ball assignment schemes for integrated circuit packages Grant 7,095,107 - Ramakrishnan , et al. August 22, 2	2006-08-22
Substrate via layout to improve bias humidity testing reliability Grant 7,081,672 - Govind , et al. July 25, 2	2006-07-25
Ball assignment schemes for integrated circuit packages App 20060118929 - Ramakrishnan; Arun ; et al.	2006-06-08
Measurement of package interconnect impedance using tester and supporting tester Grant 6,946,866 - Thurairajaratnam , et al. September 20, 2	2005-09-20
Routing scheme for differential pairs in flip chip substrates App 20050110167 - Ramakrishnan, Arun ; et al.	2005-05-26
Robust high density substrate design for thermal cycling reliability App 20050077081 - Govind, Anand ; et al.	2005-04-14
Measurement of package interconnect impedance using tester and supporting tester App 20040251925 - Thurairajaratnam, Aritharan ; et al.	2004-12-16
Stiffener design Grant 6,825,066 - Ranade , et al. November 30, 2	2004-11-30
Characteristic impedance equalizer and an integrated circuit package employing the same Grant 6,759,921 - Govind , et al. July 6, 2	2004-07-06
Stiffener design App 20040105241 - Ranade, Yogendra ; et al.	2004-06-03
Flip-chip ball grid array package for electromigration testing Grant 6,700,207 - Pekin , et al. March 2, 2	2004-03-02
Method for reliability testing leakage characteristics in an electronic circuit and a testing device for accomplishing the source Grant 6,701,270 - Miller , et al. March 2, 2	2004-03-02
Flip-chip Ball Grid Array Package For Electromigration Testing App 20040021232 - Pekin, Senol ; et al.	2004-02-05
Transmission equalization system and an integrated circuit package employing the same Grant 6,496,081 - Govind , et al. December 17, 2	2002-12-17

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.