Gouker; Mark A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gouker; Mark A..The latest application filed is for "superconducting integrated circuit".

Company Profile

1.12.10

Gouker; Mark A. - Belmont MA
Gouker; Mark A. - Lexington MA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Superconducting integrated circuit Grant 10,658,424 - Oliver , et al.	2020-05-19
Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure Grant 10,418,350 - Das , et al. Sept	2019-09-17
Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits Grant 10,396,269 - Oliver , et al. A	2019-08-27
Shielded through via structures and methods for fabricating shielded through via structures Grant 10,199,553 - Oliver , et al. Fe	2019-02-05
Qubit and coupler circuit structures and coupling techniques Grant 10,134,972 - Oliver , et al. November 20, 2	2018-11-20
Interconnect structures and methods for fabricating interconnect structures Grant 10,121,754 - Oliver , et al. November 6, 2	2018-11-06
Interconnect structures for assembly of semiconductor structures including at least one integrated circuit structure Grant 10,079,224 - Das , et al. September 18, 2	2018-09-18
Superconducting Integrated Circuit App 20180247974 - Oliver; William D. ; et al.	2018-08-30
Multi-layer semiconductor devices fabricated using a combination of substrate and via structures and fabrication techniques Grant 9,881,904 - Das , et al. January 30, 2	2018-01-30
Interconnect Structures For Assembly Of Semiconductor Structures Including Superconducting Integrated Circuits App 20180012932 - Oliver; William D. ; et al.	2018-01-11
Qubit and Coupler Circuit Structures and Coupling Techniques App 20180013052 - Oliver; William D. ; et al.	2018-01-11
Interconnect structures for assembly of multi-layer semiconductor devices Grant 9,812,429 - Das , et al. November 7, 2	2017-11-07
Interconnect structures for fine pitch assembly of semiconductor structures and related techniques Grant 9,786,633 - Das , et al. October 10, 2	2017-10-10
Interconnect structures for assembly of multi-layer semiconductor devices Grant 9,780,075 - Das , et al. October 3, 2	2017-10-03
Interconnect Structures for Assembly of Multi-Layer Semiconductor Devices App 20170200700 - Das; Rabindra N. ; et al.	2017-07-13
Interconnect Structures For Assembly Of Semiconductor Structures Including At Least One Integrated Circuit Structure App 20170162550 - Das; Rabindra N. ; et al.	2017-06-08
Semiconductor Structures For Assembly In Multi-Layer Semiconductor Devices Including At Least One Semiconductor Structure App 20170162507 - Das; Rabindra N. ; et al.	2017-06-08
Interconnect Structures And Methods For Fabricating Interconnect Structures App 20170133336 - Oliver; William D. ; et al.	2017-05-11
Interconnect Structures For Fine Pitch Assembly Of Semiconductor Structures App 20170098627 - Das; Rabindra N. ; et al.	2017-04-06
Interconnect Structures for Assembly of Multi-Layer Semiconductor Devices App 20170092621 - DAS; Rabindra N. ; et al.	2017-03-30
Multi-Layer Semiconductor Devices Fabricated Using a Combination of Substrate and Via Structures and Fabrication Techniques App 20170040296 - Das; Rabindra N. ; et al.	2017-02-09
Reconfigurable antennas using microelectromechanical (MEMs) shutters and methods to utilize such Grant 7,061,447 - Bozler , et al. June 13, 2	2006-06-13

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