Gotcher; Lee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gotcher; Lee.The latest application filed is for "method and system for electrically coupling a chip to chip package".

Company Profile

0.8.7

Gotcher; Lee - Boise ID US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and system for electrically coupling a chip to chip package Grant 9,305,861 - Murphy , et al. April 5, 2	2016-04-05
Method And System For Electrically Coupling A Chip To Chip Package App 20120013368 - Murphy; Tim ; et al.	2012-01-19
Method and system for electrically coupling a chip to chip package Grant 8,072,037 - Murphy , et al. December 6, 2	2011-12-06
Method And System For Electrically Coupling A Chip To Chip Package App 20100219421 - MURPHY; TIM ; et al.	2010-09-02
Method and system for electrically coupling a chip to chip package Grant 7,732,882 - Murphy , et al. June 8, 2	2010-06-08
Method And System For Electrically Coupling A Chip To Chip Package App 20080105883 - Murphy; Tim ; et al.	2008-05-08
Method and system for electrically coupling a chip to chip package Grant 7,335,985 - Murphy , et al. February 26, 2	2008-02-26
Method and system for electrically coupling a chip to chip package Grant 7,015,559 - Murphy , et al. March 21, 2	2006-03-21
Method and system for electrically coupling a chip to chip package Grant 6,936,489 - Murphy , et al. August 30, 2	2005-08-30
Method and system for electrically coupling a chip to chip package Grant 6,831,301 - Murphy , et al. December 14, 2	2004-12-14
Method and system for electrically coupling a chip to chip package App 20040036136 - Murphy, Tim ; et al.	2004-02-26
Method and system for electrically coupling a chip to chip package App 20040036166 - Murphy, Tim ; et al.	2004-02-26
Method and system for electrically coupling a chip to chip package App 20040037136 - Murphy, Tim ; et al.	2004-02-26
Method and system for electrically coupling a chip to chip package App 20030071334 - Murphy, Tim ; et al.	2003-04-17

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.