Goswami; Jagadish C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Goswami; Jagadish C..The latest application filed is for "thermally stable adhesive comprising soluble polyimide resin and epoxy resin".

Company Profile

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Goswami; Jagadish C. - New City NY
Goswami; Jagadish C. - New York NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermally stable adhesive comprising soluble polyimide resin and epoxy resin Grant 4,692,272 - Goswami , et al. September 8, 1	1987-09-08
Rapid curing, thermally stable adhesive composition comprising epoxy resin, polyimide, reactive solvent, and crosslinker Grant 4,652,398 - Goswami , et al. March 24, 1	1987-03-24
Thermally stable adhesive Grant 4,604,230 - Goswami , et al. August 5, 1	1986-08-05
Laminate for the protection of motor vehicle bodies Grant 4,496,628 - Deatcher , et al. January 29, 1	1985-01-29
Blend of internally plasticized vinyl chloride copolymer and ethylene/carbon monoxide polymer Grant 4,489,193 - Goswami December 18, 1	1984-12-18
Blend of internally plasticized vinyl chloride copolymer and polyurethane elastomer Grant 4,350,792 - Goswami , et al. September 21, 1	1982-09-21
Process for forming a crosslinked polyvinyl chloride foam and product thereof by means of radiation crosslinking Grant 4,187,159 - Goswami , et al. February 5, 1	1980-02-05
Internally plasticized vinyl chloride copolymer Grant 4,147,853 - Goswami , et al. April 3, 1	1979-04-03
Fire Retardant Resin Compositions Of Post-chlorinated Vinyl Halide-bis(hydrocarbyl) Vinylphosphonate Copolymers Grant 3,725,359 - Goswami , et al. April 3, 1	1973-04-03

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