Goruganthu; Rama R.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Goruganthu; Rama R..The latest application filed is for "laser scanning module including an optical isolator".
Company Profile
0.44.5
- Goruganthu; Rama R. - Austin TX US
Patent Activity
| Patent | Date |
|---|---|
| Laser scanning module including an optical isolator Grant 9,304,308 - Goruganthu April 5, 2 | 2016-04-05 |
| Optical isolation module and method for utilizing the same Grant 8,537,464 - Goruganthu September 17, 2 | 2013-09-17 |
| Laser Scanning Module Including an Optical Isolator App 20120320455 - Goruganthu; Rama R. | 2012-12-20 |
| Silicon photon detector Grant 8,232,586 - Potok , et al. July 31, 2 | 2012-07-31 |
| Solid immersion lens lithography Grant 8,187,772 - Goruganthu , et al. May 29, 2 | 2012-05-29 |
| Optical isolation module and method for utilizing the same App 20110134520 - Goruganthu; Rama R. | 2011-06-09 |
| Silicon Photon Detector App 20110037107 - Potok; Ronald M. ; et al. | 2011-02-17 |
| Wide area soft defect localization Grant 7,884,633 - Potok , et al. February 8, 2 | 2011-02-08 |
| Wide Area Soft Defect Localization App 20090302880 - Potok; Ronald M. ; et al. | 2009-12-10 |
| Thermally conductive integrated circuit mounting structures Grant 7,272,010 - Santana, Jr. , et al. September 18, 2 | 2007-09-18 |
| Electrical probing of SOI circuits Grant 7,235,800 - Goruganthu , et al. June 26, 2 | 2007-06-26 |
| Semiconductor die analysis as a function of optical reflections from the die Grant 7,196,800 - Birdsley , et al. March 27, 2 | 2007-03-27 |
| Solid immersion lens lithography App 20060078637 - Goruganthu; Rama R. ; et al. | 2006-04-13 |
| Thermally conductive integrated circuit mounting structures Grant 6,994,584 - Santana, Jr. , et al. February 7, 2 | 2006-02-07 |
| Dual-differential interferometry for silicon device damage detection Grant 6,992,773 - Bruce , et al. January 31, 2 | 2006-01-31 |
| Circuit analysis and manufacture using electric field-induced effects Grant 6,894,518 - Bruce , et al. May 17, 2 | 2005-05-17 |
| Circuit analysis using electric field-induced effects Grant 6,891,390 - Goruganthu , et al. May 10, 2 | 2005-05-10 |
| Localized heating for defect isolation during die operation Grant 6,873,166 - Bruce , et al. March 29, 2 | 2005-03-29 |
| High resolution heat exchange Grant 6,836,132 - Bruce , et al. December 28, 2 | 2004-12-28 |
| Electro-optical analysis of integrated circuits Grant 6,833,716 - Goruganthu , et al. December 21, 2 | 2004-12-21 |
| Substrate removal as a function of emitted photons at the back side of a semiconductor chip Grant 6,806,166 - Birdsley , et al. October 19, 2 | 2004-10-19 |
| Nanotube tip for atomic force microscope Grant 6,780,664 - Goruganthu , et al. August 24, 2 | 2004-08-24 |
| Semiconductor structure having backside probe points for direct signal access from active and well regions Grant 6,720,641 - Birdsley , et al. April 13, 2 | 2004-04-13 |
| Optical analysis for SOI integrated circuits Grant 6,716,683 - Bruce , et al. April 6, 2 | 2004-04-06 |
| De broglie microscope Grant 6,714,294 - Bruce , et al. March 30, 2 | 2004-03-30 |
| Arrangement and method for providing an imaging path using a silicon-crystal damaging laser Grant 6,709,985 - Goruganthu , et al. March 23, 2 | 2004-03-23 |
| Defect detection in semiconductor devices Grant 6,686,757 - Ring , et al. February 3, 2 | 2004-02-03 |
| Picosecond imaging circuit analysis probe and system Grant 6,657,446 - Goruganthu , et al. December 2, 2 | 2003-12-02 |
| IC analysis involving logic state mapping in a SOI die Grant 6,653,849 - Bruce , et al. November 25, 2 | 2003-11-25 |
| Method of substrate silicon removal for integrated circuit devices Grant 6,635,572 - Goruganthu , et al. October 21, 2 | 2003-10-21 |
| Timing margin alteration via the insulator of a SOI die Grant 6,621,288 - Bruce , et al. September 16, 2 | 2003-09-16 |
| Single point high resolution time resolved photoemission microscopy system and method Grant 6,608,494 - Bruce , et al. August 19, 2 | 2003-08-19 |
| Quadrant avalanche photodiode time-resolved detection Grant 6,483,327 - Bruce , et al. November 19, 2 | 2002-11-19 |
| Selective state change analysis of a SOI die Grant 6,414,335 - Goruganthu , et al. July 2, 2 | 2002-07-02 |
| Selectively activatable solar cells for integrated circuit analysis Grant 6,391,664 - Goruganthu , et al. May 21, 2 | 2002-05-21 |
| Integrated circuit defect detection via laser heat and IR thermography Grant 6,387,715 - Davis , et al. May 14, 2 | 2002-05-14 |
| Substrate removal as a functional of sonic analysis Grant 6,350,624 - Goruganthu , et al. February 26, 2 | 2002-02-26 |
| Substrate removal as a function of resistance at the back side of a semiconductor device Grant 6,303,396 - Ring , et al. October 16, 2 | 2001-10-16 |
| Endpoint detection for thinning of silicon of a flip chip bonded integrated circuit Grant 6,285,036 - Goruganthu , et al. September 4, 2 | 2001-09-04 |
| Substrate removal as a function of SIMS analysis Grant 6,281,025 - Ring , et al. August 28, 2 | 2001-08-28 |
| Substrate removal from a semiconductor chip structure having buried insulator (BIN) Grant 6,252,239 - Goruganthu , et al. June 26, 2 | 2001-06-26 |
| Led in substrate with back side monitoring Grant 6,248,600 - Bruce , et al. June 19, 2 | 2001-06-19 |
| Ionized metal cluster beam systems and methods Grant 5,331,172 - Kumar , et al. July 19, 1 | 1994-07-19 |
| Process for making semiconductor electrode bumps by metal cluster ion deposition and etching Grant 5,290,732 - Kumar , et al. March 1, 1 | 1994-03-01 |
| Bonding metal members with multiple laser beams Grant 5,272,309 - Goruganthu , et al. December 21, 1 | 1993-12-21 |
| Method of making semiconductor bonding bumps using metal cluster ion deposition Grant 5,156,997 - Kumar , et al. October 20, 1 | 1992-10-20 |
| Bonding metal electrical members with a frequency doubled pulsed laser beam Grant 5,083,007 - Spletter , et al. January 21, 1 | 1992-01-21 |
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