Gorrell; Jerry A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Gorrell; Jerry A..The latest application filed is for "alignment verification for c4np solder transfer".
- Gorrell; Jerry A. - Lagrangeville NY
| Patent | Date |
|---|---|
| Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface Grant 7,833,897 - Knickerbocker , et al. November 16, 2 | 2010-11-16 |
| Alignment verification for C4NP solder transfer Grant 7,666,780 - Gorrell , et al. February 23, 2 | 2010-02-23 |
| Alignment Verification For C4np Solder Transfer App 20090181533 - Gorrell; Jerry A. ; et al. | 2009-07-16 |
| PROCESS FOR MAKING INTERCONNECT SOLDER Pb-FREE BUMPS FREE FROM ORGANO-TIN/TIN DEPOSITS ON THE WAFER SURFACE App 20090020590 - Knickerbocker; Sarah H. ; et al. | 2009-01-22 |
| Method and apparatus for application of pressure to a workpiece by thermal expansion Grant 6,892,781 - McHerron , et al. May 17, 2 | 2005-05-17 |
| Method and apparatus for application of pressure to a workpiece by thermal expansion App 20030221777 - McHerron, Dale C. ; et al. | 2003-12-04 |
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