| Patent | Date |
|---|
Metal Deposition
App 20220290300 - Vellanki; Ravi ; et al. | 2022-09-15 |
Method For Preventing Line Bending During Metal Fill Process
App 20220262640 - Jandl; Adam ; et al. | 2022-08-18 |
Nucleation-free Tungsten Deposition
App 20220254685 - ERMEZ; Sema ; et al. | 2022-08-11 |
Rapid Flush Purging During Atomic Layer Deposition
App 20220186370 - Nannapaneni; Pragna ; et al. | 2022-06-16 |
Method for preventing line bending during metal fill process
Grant 11,355,345 - Jandl , et al. June 7, 2 | 2022-06-07 |
Metal fill process for three-dimensional vertical NAND wordline
Grant 11,348,795 - Schloss , et al. May 31, 2 | 2022-05-31 |
Multi-layer Feature Fill
App 20210313183 - Ba; Xiaolan ; et al. | 2021-10-07 |
Metal Fill Process For Three-dimensional Vertical Nand Wordline
App 20200211853 - Schloss; Lawrence ; et al. | 2020-07-02 |
Method For Preventing Line Bending During Metal Fill Process
App 20200144066 - Jandl; Adam ; et al. | 2020-05-07 |
Method for preventing line bending during metal fill process
Grant 10,573,522 - Jandl , et al. Feb | 2020-02-25 |
Method For Preventing Line Bending During Metal Fill Process
App 20180053660 - Jandl; Adam ; et al. | 2018-02-22 |
Multilayer Film Including A Tantalum And Titanium Alloy As A Scalable Barrier Diffusion Layer For Copper Interconnects
App 20170170114 - Besser; Paul Raymond ; et al. | 2017-06-15 |
Contact integration for reduced interface and series contact resistance
Grant 9,484,251 - Besser , et al. November 1, 2 | 2016-11-01 |
Method to tune TiO.sub.x stoichiometry using atomic layer deposited Ti film to minimize contact resistance for TiO.sub.x/Ti based MIS contact scheme for CMOS
Grant 9,478,411 - Thombare , et al. October 25, 2 | 2016-10-25 |
Method and apparatus to deposit pure titanium thin film at low temperature using titanium tetraiodide precursor
Grant 9,478,438 - Thombare , et al. October 25, 2 | 2016-10-25 |
Dual plenum, axi-symmetric showerhead with edge-to-center gas delivery
Grant 9,447,499 - Roy , et al. September 20, 2 | 2016-09-20 |
Method for void-free cobalt gap fill
Grant 9,349,637 - Na , et al. May 24, 2 | 2016-05-24 |
Method And Apparatus To Deposit Pure Titanium Thin Film At Low Temperature Using Titanium Tetraiodide Precursor
App 20160056053 - Thombare; Shruti Vivek ; et al. | 2016-02-25 |
Method To Tune Tiox Stoichiometry Using Atomic Layer Deposited Ti Film To Minimize Contact Resistance For Tiox/ti Based Mis Contact Scheme For Cmos
App 20160056037 - Thombare; Shruti Vivek ; et al. | 2016-02-25 |
Method For Void-free Cobalt Gap Fill
App 20160056074 - Na; Jeong-Seok ; et al. | 2016-02-25 |
Systems and methods for remote plasma atomic layer deposition
Grant 9,255,326 - Na , et al. February 9, 2 | 2016-02-09 |
Conformal films on semiconductor substrates
Grant 9,117,884 - Shaviv , et al. August 25, 2 | 2015-08-25 |
Systems And Methods For Remote Plasma Atomic Layer Deposition
App 20140272185 - Na; Jeong-Seok ; et al. | 2014-09-18 |
Dual Plenum, Axi-symmetric Showerhead With Edge-to-center Gas Delivery
App 20130341433 - Roy; Shambhu N. ; et al. | 2013-12-26 |
Conformal films on semiconductor substrates
Grant 8,298,933 - Shaviv , et al. October 30, 2 | 2012-10-30 |
Conformal Films on Semiconductor Substrates
App 20100009533 - Shaviv; Roey ; et al. | 2010-01-14 |
Apparatus and methods for processing semiconductor substrates using supercritical fluids
Grant 7,503,334 - Shrinivasan , et al. March 17, 2 | 2009-03-17 |
Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compounds
Grant 7,456,101 - Gopinath , et al. November 25, 2 | 2008-11-25 |
Use of metallocenes to inhibit copper oxidation during semiconductor processing
Grant 7,279,417 - Dalton , et al. October 9, 2 | 2007-10-09 |
Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compounds
Grant 7,211,509 - Gopinath , et al. May 1, 2 | 2007-05-01 |
Surface treatment using iodine plasma to improve metal deposition
Grant 7,041,596 - Dalton , et al. May 9, 2 | 2006-05-09 |
Atomic layer deposition for fabricating thin films
Grant 7,037,574 - Paranjpe , et al. May 2, 2 | 2006-05-02 |
Method and apparatus for introduction of solid precursors and reactants into a supercritical fluid reactor
Grant 6,951,765 - Gopinath , et al. October 4, 2 | 2005-10-04 |
Apparatus and methods for processing semiconductor substrates using supercritical fluids
Grant 6,848,458 - Shrinivasan , et al. February 1, 2 | 2005-02-01 |
Microelectronic interconnect material with adhesion promotion layer and fabrication method
Grant 6,645,847 - Paranjpe , et al. November 11, 2 | 2003-11-11 |
Microelectronic interconnect material with adhesion promotion layer and fabrication method
Grant 6,627,995 - Paranjpe , et al. September 30, 2 | 2003-09-30 |
Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processing
Grant 6,550,484 - Gopinath , et al. April 22, 2 | 2003-04-22 |
Atomic layer deposition for fabricating thin films
App 20030003635 - Paranjpe, Ajit P. ; et al. | 2003-01-02 |
Microelectronic interconnect material with adhesion promotion layer and fabrication method
App 20020137332 - Paranjpe, Ajit P. ; et al. | 2002-09-26 |
Method of chemical-vapor deposition of a material
Grant 6,444,263 - Paranjpe , et al. September 3, 2 | 2002-09-03 |
Microelectronic interconnect material with adhesion promotion layer and fabrication method
App 20020102838 - Paranjpe, Ajit P. ; et al. | 2002-08-01 |
Microelectronic interconnect material with adhesion promotion layer and fabrication method
Grant 6,365,502 - Paranjpe , et al. April 2, 2 | 2002-04-02 |
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