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Gopalan; Ramesh Patent Filings

Gopalan; Ramesh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gopalan; Ramesh.The latest application filed is for "wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing".

Company Profile
12.13.24
  • Gopalan; Ramesh - Fremont CA
  • Gopalan; Ramesh - Mumbai IN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wireless In-situ Real-time Measurement Of Electrostatic Chucking Force In Semiconductor Wafer Processing
App 20220285185 - Gopalan; Ramesh
2022-09-08
Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing
Grant 11,373,890 - Gopalan June 28, 2
2022-06-28
Methods and systems for monitoring input power for process control in semiconductor process systems
Grant 11,355,325 - Gopalan , et al. June 7, 2
2022-06-07
Methods And Systems For Processing A Substrate
App 20210375701 - GOPALAN; Ramesh ;   et al.
2021-12-02
Methods And Systems For Monitoring Input Power For Process Control In Semiconductor Process Systems
App 20210375601 - GOPALAN; Ramesh ;   et al.
2021-12-02
Substrate chucking and dechucking methods
Grant 11,114,326 - Boyd, Jr. , et al. September 7, 2
2021-09-07
Protective yttria coating for semiconductor equipment parts
Grant 11,047,035 - Gopalan , et al. June 29, 2
2021-06-29
Inline Measurement Of Process Gas Dissociation Using Infrared Absorption
App 20210159060 - GOPALAN; Ramesh ;   et al.
2021-05-27
Anti-virus filter for facemasks and respirators
App 20210138279 - Gopalan; Ramesh
2021-05-13
Self-Regulating Smart Irrigation System
App 20210045286 - Gopalan; Ramesh
2021-02-18
Smart Cosmetic Applicator
App 20200196937 - Gopalan; Ramesh
2020-06-25
Wireless In-situ Real-time Measurement Of Electrostatic Chucking Force In Semiconductor Wafer Processing
App 20200194290 - Gopalan; Ramesh ;   et al.
2020-06-18
Measuring concentrations of radicals in semiconductor processing
Grant 10,685,819 - Gopalan , et al.
2020-06-16
Surface acoustic wave sensors in semiconductor processing equipment
Grant 10,656,100 - Gopalan , et al.
2020-05-19
Chemical mechanical polishing smart ring
Grant 10,513,008 - Huang , et al. Dec
2019-12-24
Skylight with compound parabolic diffusers
Grant 10,415,251 - Gopalan Sept
2019-09-17
Protective Yttria Coating For Semiconductor Equipment Parts
App 20190264314 - Gopalan; Ramesh ;   et al.
2019-08-29
Substrate Chucking And Dechucking Methods
App 20190206712 - BOYD, JR.; Wendell Glenn ;   et al.
2019-07-04
Surface Acoustic Wave Sensors In Semiconductor Processing Equipment
App 20190137415 - GOPALAN; Ramesh ;   et al.
2019-05-09
Measuring Concentrations Of Radicals In Semiconductor Processing
App 20180342377 - GOPALAN; Ramesh ;   et al.
2018-11-29
Surface acoustic wave sensors in semiconductor processing equipment
Grant 10,094,788 - Gopalan , et al. October 9, 2
2018-10-09
Skylight
App 20180209151 - Gopalan; Ramesh
2018-07-26
Chemical Mechanical Polishing Smart Ring
App 20180071889 - HUANG; Zubin ;   et al.
2018-03-15
Surface Acoustic Wave Sensors In Semiconductor Processing Equipment
App 20170176349 - GOPALAN; Ramesh ;   et al.
2017-06-22
Method For Removing Aluminum Fluoride Contamination From Semiconductor Processing Equipment
App 20170056935 - GOPALAN; Ramesh ;   et al.
2017-03-02
Surface Profile Modifications For Extended Life Of Consumable Parts In Semiconductor Processing Equipment
App 20160155657 - GOPALAN; Ramesh ;   et al.
2016-06-02
Method and apparatus for detecting planarization of metal films prior to clearing
Grant 7,690,966 - Gopalan , et al. April 6, 2
2010-04-06
Method and apparatus for detecting planarization of metal films prior to clearing
Grant 7,413,988 - Gopalan , et al. August 19, 2
2008-08-19
Method of and system for organizing unstructured information utilizing parameterized templates and a technology presentation layer
App 20070198516 - Ganapathy; Palamadai Ramachandran ;   et al.
2007-08-23
Method for reducing or eliminating de-lamination of semiconductor wafer film layers during a chemical mechanical planarization process
Grant 7,040,952 - Srivatsan , et al. May 9, 2
2006-05-09

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