loadpatents
name:-0.027692079544067
name:-0.016860961914062
name:-0.0029211044311523
Gopalan; Periya Patent Filings

Gopalan; Periya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gopalan; Periya.The latest application filed is for "conditioner disk for use on soft or 3d printed pads during cmp".

Company Profile
2.12.14
  • Gopalan; Periya - San Jose CA
  • Gopalan; Periya - Chandler AZ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Conditioner Disk For Use On Soft Or 3d Printed Pads During Cmp
App 20210402563 - Gopalan; Periya ;   et al.
2021-12-30
Polishing Pad with Secondary Window Seal
App 20200361054 - Alagarsamy; Rajkumar ;   et al.
2020-11-19
Methods And Apparatus For Removing Abrasive Particles
App 20200306931 - LIANTO; PRAYUDI ;   et al.
2020-10-01
Polishing pad with secondary window seal
Grant 10,744,618 - Alagarsamy , et al. A
2020-08-18
Printed Chemical Mechanical Polishing Pad Having Particles Therein
App 20180297174 - Krishnan; Kasiraman ;   et al.
2018-10-18
Printed chemical mechanical polishing pad having abrasives therein and system for printing
Grant 10,016,877 - Krishnan , et al. July 10, 2
2018-07-10
Polishing Pad with Secondary Window Seal
App 20180065227 - Alagarsamy; Rajkumar ;   et al.
2018-03-08
Polishing pad with secondary window seal
Grant 9,731,397 - Alagarsamy , et al. August 15, 2
2017-08-15
Printed Chemical Mechanical Polishing Pad Having Abrasives Therein And System For Printing
App 20160354901 - Krishnan; Kasiraman ;   et al.
2016-12-08
Printed chemical mechanical polishing pad having abrasives therein
Grant 9,421,666 - Krishnan , et al. August 23, 2
2016-08-23
Printed Chemical Mechanical Polishing Pad Having Abrasives Therein
App 20150126099 - Krishnan; Kasiraman ;   et al.
2015-05-07
Polishing Pad with Secondary Window Seal
App 20150126100 - Alagarsamy; Rajkumar ;   et al.
2015-05-07
Polishing pad with secondary window seal
Grant 8,961,266 - Alagarsamy , et al. February 24, 2
2015-02-24
Polishing Pad with Secondary Window Seal
App 20140273762 - Alagarsamy; Rajkumar ;   et al.
2014-09-18
Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
Grant 7,297,239 - Emesh , et al. November 20, 2
2007-11-20
Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
App 20050016681 - Emesh, Ismail ;   et al.
2005-01-27
System and method for cleaning workpieces
Grant 6,818,604 - Emesh , et al. November 16, 2
2004-11-16
Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
Grant 6,802,955 - Emesh , et al. October 12, 2
2004-10-12
Polishing pad window for a chemical mechanical polishing tool
Grant 6,685,537 - Fruitman , et al. February 3, 2
2004-02-03
Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
App 20030132120 - Emesh, Ismail ;   et al.
2003-07-17
System and method for cleaning workpieces
App 20030069150 - Emesh, Ismail ;   et al.
2003-04-10
Chemical mechanical polishing method and apparatus for removing material from a surface of a workpiece that includes low-k material
App 20020151255 - Dyer, Tim ;   et al.
2002-10-17
Reinforced CMP carrier bladders
App 20020077049 - Fruitman, Clinton O. ;   et al.
2002-06-20
Mapping system for semiconductor wafer cassettes
Grant 6,364,745 - Gonzalez-Martin , et al. April 2, 2
2002-04-02
Integral machine for polishing, cleaning, rinsing and drying workpieces
Grant 6,213,853 - Gonzalez-Martin , et al. April 10, 2
2001-04-10
Post-CMP wet-HF cleaning station
Grant 5,954,888 - Gupta , et al. September 21, 1
1999-09-21

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