Goolsby; Brian J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Goolsby; Brian J..The latest application filed is for "electronic device including a semiconductor fin having a plurality of gate electrodes and a process for forming the electronic device".

Company Profile

0.7.8

Goolsby; Brian J. - Austin TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic devices including a semiconductor layer Grant 7,821,067 - Thean , et al. October 26, 2	2010-10-26
Electronic device including a semiconductor fin having a plurality of gate electrodes and a process for forming the electronic device Grant 7,566,623 - Mathew , et al. July 28, 2	2009-07-28
Electronic Device Including A Semiconductor Fin Having A Plurality Of Gate Electrodes And A Process For Forming The Electronic Device App 20080185654 - Mathew; Leo ; et al.	2008-08-07
Method for forming an electronic device Grant 7,402,476 - Orlowski , et al. July 22, 2	2008-07-22
Method of making a metal gate semiconductor device Grant 7,361,561 - Goolsby , et al. April 22, 2	2008-04-22
Electronic Devices Including A Semiconductor Layer App 20070272952 - Thean; Voon-Yew ; et al.	2007-11-29
Electronic devices including a semiconductor layer and a process for forming the same Grant 7,265,004 - Thean , et al. September 4, 2	2007-09-04
Electronic devices including a semiconductor layer and a process for forming the same App 20070108481 - Thean; Voon-Yew ; et al.	2007-05-17
Method of forming a semiconductor device having a metal layer Grant 7,208,424 - Stephens , et al. April 24, 2	2007-04-24
Method of making a metal gate semiconductor device App 20060292773 - Goolsby; Brian J. ; et al.	2006-12-28
Method for forming an electronic device App 20060286736 - Orlowski; Marius K. ; et al.	2006-12-21
Semiconductor fabrication process including recessed source/drain regions in an SOI wafer Grant 7,091,071 - Thean , et al. August 15, 2	2006-08-15
Semiconductor Fabrication Process Including Recessed Source/drain Regions In An Soi Wafer App 20060148196 - Thean; Voon-Yew ; et al.	2006-07-06
Method of forming a semiconductor device having a metal layer App 20060063364 - Stephens; Tab A. ; et al.	2006-03-23
Strained semiconductor devices and method for forming at least a portion thereof App 20060030093 - Zhang; Da ; et al.	2006-02-09

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