loadpatents
name:-0.0089151859283447
name:-0.0069410800933838
name:-0.00044107437133789
Gooi; Boon Huan Patent Filings

Gooi; Boon Huan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gooi; Boon Huan.The latest application filed is for "semiconductor die package and method for making the same".

Company Profile
0.7.6
  • Gooi; Boon Huan - Penang MY
  • Gooi; Boon Huan - Bukit Mertajam N/A MY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor die package and method for making the same
Grant 9,159,656 - Jeon , et al. October 13, 2
2015-10-13
Semiconductor device package and method of making a semiconductor device package
Grant 8,912,635 - Tan , et al. December 16, 2
2014-12-16
Semiconductor Die Package And Method For Making The Same
App 20140167238 - Jeon; Oseob ;   et al.
2014-06-19
Semiconductor die package and method for making the same
Grant 8,664,752 - Jeon , et al. March 4, 2
2014-03-04
Semiconductor Die Package And Method For Making The Same
App 20120181675 - Jeon; Oseob ;   et al.
2012-07-19
Semiconductor die package and method for making the same
Grant 8,183,088 - Jeon , et al. May 22, 2
2012-05-22
Semiconductor Device Package And Method Of Making A Semiconductor Device Package
App 20120068323 - Tan; Chip King ;   et al.
2012-03-22
Semiconductor device package and method of making a semiconductor device package
Grant 8,084,299 - Tan , et al. December 27, 2
2011-12-27
Semiconductor Die Package And Method For Making The Same
App 20100258925 - Jeon; Oseob ;   et al.
2010-10-14
Semiconductor Device Package And Method Of Making A Semiconductor Device Package
App 20090194854 - Tan; Chip King ;   et al.
2009-08-06
Semiconductor die package and method for making the same
App 20070001278 - Jeon; Oseob ;   et al.
2007-01-04

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