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Patent applications and USPTO patent grants for Gooch; Roland W..The latest application filed is for "wafer level package solder barrier used as vacuum getter".
Patent | Date |
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Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays Grant 10,315,918 - Gooch , et al. | 2019-06-11 |
Wafer level package solder barrier used as vacuum getter Grant 10,262,913 - Gooch , et al. | 2019-04-16 |
Wafer Level Package Solder Barrier Used As Vacuum Getter App 20180226309 - Gooch; Roland W. ;   et al. | 2018-08-09 |
Wafer level package solder barrier used as vacuum getter Grant 9,966,320 - Gooch , et al. May 8, 2 | 2018-05-08 |
Wafer Level Package Solder Barrier Used As Vacuum Getter App 20170011977 - Gooch; Roland W. ;   et al. | 2017-01-12 |
Wafer level package solder barrier used as vacuum getter Grant 9,520,332 - Gooch , et al. December 13, 2 | 2016-12-13 |
Method Of Stress Relief In Anti-reflective Coated Cap Wafers For Wafer Level Packaged Infrared Focal Plane Arrays App 20160340179 - Gooch; Roland W. ;   et al. | 2016-11-24 |
Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays Grant 9,427,776 - Gooch , et al. August 30, 2 | 2016-08-30 |
Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling Grant 9,227,839 - Gooch , et al. January 5, 2 | 2016-01-05 |
Wafer Level Packaged Infrared (ir) Focal Plane Array (fpa) With Evanescent Wave Coupling App 20150321905 - Gooch; Roland W. ;   et al. | 2015-11-12 |
Wafer Level Package Solder Barrier Used As Vacuum Getter App 20150279755 - Gooch; Roland W. ;   et al. | 2015-10-01 |
Reducing formation of oxide on solder Grant 9,132,496 - Diep , et al. September 15, 2 | 2015-09-15 |
Wafer level package solder barrier used as vacuum getter Grant 9,093,444 - Gooch , et al. July 28, 2 | 2015-07-28 |
Reducing Formation Of Oxide On Solder App 20150076216 - Diep; Buu Q. ;   et al. | 2015-03-19 |
Wafer Level Package Solder Barrier Used As Vacuum Getter App 20150014854 - Gooch; Roland W. ;   et al. | 2015-01-15 |
Reducing formation of oxide on solder Grant 8,844,793 - Diep , et al. September 30, 2 | 2014-09-30 |
Incident radiation detector packaging Grant 8,809,784 - Gooch , et al. August 19, 2 | 2014-08-19 |
Method Of Stress Relief In Anti-reflective Coated Cap Wafers For Wafer Level Packaged Infrared Focal Plane Arrays App 20140053966 - Gooch; Roland W. ;   et al. | 2014-02-27 |
Disposable bond gap control structures Grant 8,454,789 - Diep , et al. June 4, 2 | 2013-06-04 |
Reducing Formation Of Oxide On Solder App 20120111925 - Diep; Buu ;   et al. | 2012-05-10 |
Disposable Bond Gap Control Structures App 20120111492 - Diep; Buu ;   et al. | 2012-05-10 |
Incident Radiation Detector Packaging App 20120096813 - Gooch; Roland W. ;   et al. | 2012-04-26 |
Color correction for radiation detectors Grant 8,153,980 - Brady , et al. April 10, 2 | 2012-04-10 |
Method and apparatus for packaging circuit devices Grant 7,977,208 - Ables , et al. July 12, 2 | 2011-07-12 |
Method and Apparatus for Packaging Circuit Devices App 20110097845 - Ables; Billy D. ;   et al. | 2011-04-28 |
Method and apparatus for packaging circuit devices Grant 7,867,874 - Ables , et al. January 11, 2 | 2011-01-11 |
Infrared detector elements and methods of forming same Grant 7,655,909 - Schimert , et al. February 2, 2 | 2010-02-02 |
Method and Apparatus for Packaging Circuit Devices App 20090227068 - Ables; Billy D. ;   et al. | 2009-09-10 |
Method and apparatus for packaging circuit devices Grant 7,535,093 - Ables , et al. May 19, 2 | 2009-05-19 |
Systems and methods for solder bonding Grant 7,528,061 - Syllaios , et al. May 5, 2 | 2009-05-05 |
Surface mounted infrared image detector systems and associated methods Grant 7,514,684 - Gooch April 7, 2 | 2009-04-07 |
Systems and methods for bonding Grant 7,462,831 - Gooch , et al. December 9, 2 | 2008-12-09 |
Systems and methods for integrating focal plane arrays Grant 7,459,686 - Syllaios , et al. December 2, 2 | 2008-12-02 |
Optically blocked reference pixels for focal plane arrays Grant 7,375,331 - Schimert , et al. May 20, 2 | 2008-05-20 |
Surface mounted infrared image detector systems and associated methods App 20080048120 - Gooch; Roland W. | 2008-02-28 |
Optically blocked reference pixels for focal plane arrays App 20070262407 - Schimert; Thomas R. ;   et al. | 2007-11-15 |
Optically blocked reference pixels for focal plane arrays Grant 7,262,412 - Schimert , et al. August 28, 2 | 2007-08-28 |
Systems and methods for bonding App 20070170360 - Gooch; Roland W. ;   et al. | 2007-07-26 |
Systems and methods for integrating focal plane arrays App 20070170359 - Syllaios; Athanasios J. ;   et al. | 2007-07-26 |
Infrared detector elements and methods of forming same App 20070170363 - Schimert; Thomas R. ;   et al. | 2007-07-26 |
Sub-wavelength structures for reduction of reflective properties Grant 7,220,621 - Syllaios , et al. May 22, 2 | 2007-05-22 |
Optically blocked reference pixels for focal plane arrays App 20060124831 - Schimert; Thomas R. ;   et al. | 2006-06-15 |
Systems and methods for solder bonding App 20060128136 - Syllaios; Athanasios J. ;   et al. | 2006-06-15 |
Vacuum package fabrication of integrated circuit components Grant 7,015,074 - Syllaios , et al. March 21, 2 | 2006-03-21 |
Sub-wavelength structures for reduction of reflective properties Grant 6,897,469 - Syllaios , et al. May 24, 2 | 2005-05-24 |
Vacuum package fabrication of integrated circuit components Grant 6,879,035 - Syllaios , et al. April 12, 2 | 2005-04-12 |
Sub-wavelength structures for reduction of reflective properties App 20050054212 - Syllaios, Athanasios J. ;   et al. | 2005-03-10 |
Vacuum package fabrication of integrated circuit components App 20050042839 - Syllaios, Athanasios J. ;   et al. | 2005-02-24 |
Sub-wavelength structures for reduction of reflective properties App 20040219704 - Syllaios, Athanasios J. ;   et al. | 2004-11-04 |
Vacuum package fabrication of integrated circuit components App 20040219764 - Syllaios, Athanasios J. ;   et al. | 2004-11-04 |
Microbolometer and method for forming Grant 6,690,014 - Gooch , et al. February 10, 2 | 2004-02-10 |
Vacuum package fabrication of integrated circuit components Grant 6,586,831 - Gooch , et al. July 1, 2 | 2003-07-01 |
Vacuum package fabrication of integrated circuit components Grant 6,521,477 - Gooch , et al. February 18, 2 | 2003-02-18 |
Vacuum package fabrication of microelectromechanical system devices with integrated circuit components Grant 6,479,320 - Gooch November 12, 2 | 2002-11-12 |
High fill factor bolometer array Grant 6,392,232 - Gooch , et al. May 21, 2 | 2002-05-21 |
Vacuum package fabrication of integrated circuit components App 20020000646 - Gooch, Roland W. ;   et al. | 2002-01-03 |
High frequency infrared emitter Grant 6,297,511 - Syllaios , et al. October 2, 2 | 2001-10-02 |
Apparatus and method for producing electrical stimulation in response to an audio signal Grant 5,800,503 - Edmark , et al. September 1, 1 | 1998-09-01 |
Stress tolerant bolometer Grant 5,789,753 - Gooch , et al. August 4, 1 | 1998-08-04 |
Ramped foot support Grant 5,777,328 - Gooch July 7, 1 | 1998-07-07 |
Hybrid signal conditioning/infared imaging structure Grant 5,543,641 - Wadsworth , et al. August 6, 1 | 1996-08-06 |
Hybrid CCD imaging Grant 5,449,908 - Wadsworth , et al. September 12, 1 | 1995-09-12 |
Process for fabrication and assembly of semiconductor devices Grant 3,965,568 - Gooch June 29, 1 | 1976-06-29 |
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