loadpatents
name:-0.031781911849976
name:-0.044875860214233
name:-0.0026791095733643
Gooch; Roland W. Patent Filings

Gooch; Roland W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gooch; Roland W..The latest application filed is for "wafer level package solder barrier used as vacuum getter".

Company Profile
2.41.25
  • Gooch; Roland W. - Dallas TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
Grant 10,315,918 - Gooch , et al.
2019-06-11
Wafer level package solder barrier used as vacuum getter
Grant 10,262,913 - Gooch , et al.
2019-04-16
Wafer Level Package Solder Barrier Used As Vacuum Getter
App 20180226309 - Gooch; Roland W. ;   et al.
2018-08-09
Wafer level package solder barrier used as vacuum getter
Grant 9,966,320 - Gooch , et al. May 8, 2
2018-05-08
Wafer Level Package Solder Barrier Used As Vacuum Getter
App 20170011977 - Gooch; Roland W. ;   et al.
2017-01-12
Wafer level package solder barrier used as vacuum getter
Grant 9,520,332 - Gooch , et al. December 13, 2
2016-12-13
Method Of Stress Relief In Anti-reflective Coated Cap Wafers For Wafer Level Packaged Infrared Focal Plane Arrays
App 20160340179 - Gooch; Roland W. ;   et al.
2016-11-24
Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
Grant 9,427,776 - Gooch , et al. August 30, 2
2016-08-30
Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling
Grant 9,227,839 - Gooch , et al. January 5, 2
2016-01-05
Wafer Level Packaged Infrared (ir) Focal Plane Array (fpa) With Evanescent Wave Coupling
App 20150321905 - Gooch; Roland W. ;   et al.
2015-11-12
Wafer Level Package Solder Barrier Used As Vacuum Getter
App 20150279755 - Gooch; Roland W. ;   et al.
2015-10-01
Reducing formation of oxide on solder
Grant 9,132,496 - Diep , et al. September 15, 2
2015-09-15
Wafer level package solder barrier used as vacuum getter
Grant 9,093,444 - Gooch , et al. July 28, 2
2015-07-28
Reducing Formation Of Oxide On Solder
App 20150076216 - Diep; Buu Q. ;   et al.
2015-03-19
Wafer Level Package Solder Barrier Used As Vacuum Getter
App 20150014854 - Gooch; Roland W. ;   et al.
2015-01-15
Reducing formation of oxide on solder
Grant 8,844,793 - Diep , et al. September 30, 2
2014-09-30
Incident radiation detector packaging
Grant 8,809,784 - Gooch , et al. August 19, 2
2014-08-19
Method Of Stress Relief In Anti-reflective Coated Cap Wafers For Wafer Level Packaged Infrared Focal Plane Arrays
App 20140053966 - Gooch; Roland W. ;   et al.
2014-02-27
Disposable bond gap control structures
Grant 8,454,789 - Diep , et al. June 4, 2
2013-06-04
Reducing Formation Of Oxide On Solder
App 20120111925 - Diep; Buu ;   et al.
2012-05-10
Disposable Bond Gap Control Structures
App 20120111492 - Diep; Buu ;   et al.
2012-05-10
Incident Radiation Detector Packaging
App 20120096813 - Gooch; Roland W. ;   et al.
2012-04-26
Color correction for radiation detectors
Grant 8,153,980 - Brady , et al. April 10, 2
2012-04-10
Method and apparatus for packaging circuit devices
Grant 7,977,208 - Ables , et al. July 12, 2
2011-07-12
Method and Apparatus for Packaging Circuit Devices
App 20110097845 - Ables; Billy D. ;   et al.
2011-04-28
Method and apparatus for packaging circuit devices
Grant 7,867,874 - Ables , et al. January 11, 2
2011-01-11
Infrared detector elements and methods of forming same
Grant 7,655,909 - Schimert , et al. February 2, 2
2010-02-02
Method and Apparatus for Packaging Circuit Devices
App 20090227068 - Ables; Billy D. ;   et al.
2009-09-10
Method and apparatus for packaging circuit devices
Grant 7,535,093 - Ables , et al. May 19, 2
2009-05-19
Systems and methods for solder bonding
Grant 7,528,061 - Syllaios , et al. May 5, 2
2009-05-05
Surface mounted infrared image detector systems and associated methods
Grant 7,514,684 - Gooch April 7, 2
2009-04-07
Systems and methods for bonding
Grant 7,462,831 - Gooch , et al. December 9, 2
2008-12-09
Systems and methods for integrating focal plane arrays
Grant 7,459,686 - Syllaios , et al. December 2, 2
2008-12-02
Optically blocked reference pixels for focal plane arrays
Grant 7,375,331 - Schimert , et al. May 20, 2
2008-05-20
Surface mounted infrared image detector systems and associated methods
App 20080048120 - Gooch; Roland W.
2008-02-28
Optically blocked reference pixels for focal plane arrays
App 20070262407 - Schimert; Thomas R. ;   et al.
2007-11-15
Optically blocked reference pixels for focal plane arrays
Grant 7,262,412 - Schimert , et al. August 28, 2
2007-08-28
Systems and methods for bonding
App 20070170360 - Gooch; Roland W. ;   et al.
2007-07-26
Systems and methods for integrating focal plane arrays
App 20070170359 - Syllaios; Athanasios J. ;   et al.
2007-07-26
Infrared detector elements and methods of forming same
App 20070170363 - Schimert; Thomas R. ;   et al.
2007-07-26
Sub-wavelength structures for reduction of reflective properties
Grant 7,220,621 - Syllaios , et al. May 22, 2
2007-05-22
Optically blocked reference pixels for focal plane arrays
App 20060124831 - Schimert; Thomas R. ;   et al.
2006-06-15
Systems and methods for solder bonding
App 20060128136 - Syllaios; Athanasios J. ;   et al.
2006-06-15
Vacuum package fabrication of integrated circuit components
Grant 7,015,074 - Syllaios , et al. March 21, 2
2006-03-21
Sub-wavelength structures for reduction of reflective properties
Grant 6,897,469 - Syllaios , et al. May 24, 2
2005-05-24
Vacuum package fabrication of integrated circuit components
Grant 6,879,035 - Syllaios , et al. April 12, 2
2005-04-12
Sub-wavelength structures for reduction of reflective properties
App 20050054212 - Syllaios, Athanasios J. ;   et al.
2005-03-10
Vacuum package fabrication of integrated circuit components
App 20050042839 - Syllaios, Athanasios J. ;   et al.
2005-02-24
Sub-wavelength structures for reduction of reflective properties
App 20040219704 - Syllaios, Athanasios J. ;   et al.
2004-11-04
Vacuum package fabrication of integrated circuit components
App 20040219764 - Syllaios, Athanasios J. ;   et al.
2004-11-04
Microbolometer and method for forming
Grant 6,690,014 - Gooch , et al. February 10, 2
2004-02-10
Vacuum package fabrication of integrated circuit components
Grant 6,586,831 - Gooch , et al. July 1, 2
2003-07-01
Vacuum package fabrication of integrated circuit components
Grant 6,521,477 - Gooch , et al. February 18, 2
2003-02-18
Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
Grant 6,479,320 - Gooch November 12, 2
2002-11-12
High fill factor bolometer array
Grant 6,392,232 - Gooch , et al. May 21, 2
2002-05-21
Vacuum package fabrication of integrated circuit components
App 20020000646 - Gooch, Roland W. ;   et al.
2002-01-03
High frequency infrared emitter
Grant 6,297,511 - Syllaios , et al. October 2, 2
2001-10-02
Apparatus and method for producing electrical stimulation in response to an audio signal
Grant 5,800,503 - Edmark , et al. September 1, 1
1998-09-01
Stress tolerant bolometer
Grant 5,789,753 - Gooch , et al. August 4, 1
1998-08-04
Ramped foot support
Grant 5,777,328 - Gooch July 7, 1
1998-07-07
Hybrid signal conditioning/infared imaging structure
Grant 5,543,641 - Wadsworth , et al. August 6, 1
1996-08-06
Hybrid CCD imaging
Grant 5,449,908 - Wadsworth , et al. September 12, 1
1995-09-12
Process for fabrication and assembly of semiconductor devices
Grant 3,965,568 - Gooch June 29, 1
1976-06-29

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