Gooch; Roland

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gooch; Roland.The latest application filed is for "getter structure and method for forming such structure".

Company Profile

0.6.8

Gooch; Roland - Dallas TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Getter Structure And Method For Forming Such Structure App 20160040282 - Gooch; Roland ; et al.	2016-02-11
Getter structure and method for forming such structure Grant 9,196,556 - Gooch , et al. November 24, 2	2015-11-24
Integrated bondline spacers for wafer level packaged circuit devices Grant 9,187,312 - Gooch , et al. November 17, 2	2015-11-17
Integrated bondline spacers for wafer level packaged circuit devices Grant 9,174,836 - Gooch , et al. November 3, 2	2015-11-03
Getter Structure And Method For Forming Such Structure App 20150249042 - Gooch; Roland ; et al.	2015-09-03
Method of forming deposited patterns on a surface Grant 9,105,800 - Gooch , et al. August 11, 2	2015-08-11
Disposable bond gap control structures Grant 9,073,298 - Diep , et al. July 7, 2	2015-07-07
Method Of Forming Deposited Patterns On A Surface App 20150162479 - Gooch; Roland ; et al.	2015-06-11
Integrated Bondline Spacers For Wafer Level Packaged Circuit Devices App 20140346643 - Gooch; Roland ; et al.	2014-11-27
Integrated Bondline Spacers For Wafer Level Packaged Circuit Devices App 20140193948 - Gooch; Roland ; et al.	2014-07-10
Getter Structure For Wafer Level Vacuum Packaged Device App 20140175590 - Gooch; Roland ; et al.	2014-06-26
Integrated bondline spacers for wafer level packaged circuit devices Grant 8,736,045 - Gooch , et al. May 27, 2	2014-05-27
Integrated Bondline Spacers For Wafer Level Packaged Circuit Devices App 20140124899 - Gooch; Roland ; et al.	2014-05-08
Disposable Bond Gap Control Structures App 20130255876 - Diep; Buu ; et al.	2013-10-03

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