Gong; Yuping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gong; Yuping.The latest application filed is for "system in package module assembly, system in package module, and electronic device".

Company Profile

0.32.26

Gong; Yuping - Shanghai CN
Gong; Yuping - Songjiang CN
Gong; Yuping - Sanghai CA CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
System in package module assembly, system in package module, and electronic device Grant 11,133,128 - Gong , et al. September 28, 2	2021-09-28
System In Package Module Assembly, System In Package Module, And Electronic Device App 20180308616 - GONG; Yuping ; et al.	2018-10-25
Preparation method of a thin power device Grant 9,854,686 - Gong , et al. December 26, 2	2017-12-26
Dual-side exposed semiconductor package with ultra-thin die and manufacturing method thereof Grant 9,437,528 - Gong , et al. September 6, 2	2016-09-06
Substrateless Power Device Packages App 20150340301 - Feng; Tao ; et al.	2015-11-26
Method for preparing semiconductor devices applied in flip chip technology Grant 9,196,534 - Xue , et al. November 24, 2	2015-11-24
Substrateless power device packages Grant 9,136,154 - Feng , et al. September 15, 2	2015-09-15
Preparation Method Of A Thin Power Device App 20150189764 - Gong; Yuping ; et al.	2015-07-02
Thin power device and preparation method thereof Grant 9,006,901 - Gong , et al. April 14, 2	2015-04-14
Substrateless power device packages Grant 8,987,878 - Feng , et al. March 24, 2	2015-03-24
Substrateless Power Device Packages App 20150056752 - Feng; Tao ; et al.	2015-02-26
Stacked multi-chip bottom source semiconductor device and preparation method thereof Grant 8,952,509 - Yilmaz , et al. February 10, 2	2015-02-10
Thin Power Device And Preparation Method Thereof App 20150021780 - Gong; Yuping ; et al.	2015-01-22
Double-side exposed semiconductor device Grant 8,933,545 - Gong , et al. January 13, 2	2015-01-13
Flip-chip semiconductor chip packing method Grant 8,877,555 - Shi , et al. November 4, 2	2014-11-04
Double-side Exposed Semiconductor Device App 20140312480 - Gong; Yuping ; et al.	2014-10-23
Manufacturing method of a semiconductor package of small footprint with a stack of lead frame die paddle sandwiched between high-side and low-side MOSFET Grant 8,841,167 - Gong , et al. September 23, 2	2014-09-23
Method For Preparing Semiconductor Devices Applied In Flip Chip Technology App 20140242756 - Xue; Yan Xun ; et al.	2014-08-28
Packaging method of molded wafer level chip scale package (WLCSP) Grant 8,778,735 - Xue , et al. July 15, 2	2014-07-15
Flip-chip Semiconductor Chip Packing Method App 20140141567 - Shi; Lei ; et al.	2014-05-22
Semiconductor wafer level package (WLP) and method of manufacture thereof Grant 8,642,397 - Gong , et al. February 4, 2	2014-02-04
Packaging method of molded wafer level chip scale package (WLCSP) Grant 8,563,361 - Xue , et al. October 22, 2	2013-10-22
Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing method Grant 8,519,520 - Gong , et al. August 27, 2	2013-08-27
Packaging Method Of Molded Wafer Level Chip Scale Package (wlcsp) App 20130210195 - Xue; Yan Xun ; et al.	2013-08-15
Wafer level packaging method of encapsulating the bottom and side of a semiconductor chip Grant 8,486,803 - Huang , et al. July 16, 2	2013-07-16
Double-side exposed semiconductor device and its manufacturing method Grant 8,450,152 - Gong , et al. May 28, 2	2013-05-28
Wafer Level Packaging Method Of Encapsulating The Bottom And Side Of A Semiconductor Chip App 20130095612 - Huang; Ping ; et al.	2013-04-18
Semiconductor Package With High-side And Low-side Mosfets And Manufacturing Method App 20130075884 - Gong; YuPing ; et al.	2013-03-28
Double-side Exposed Semiconductor Device And Its Manufacturing Method App 20130026615 - Gong; Yuping ; et al.	2013-01-31
Chip-exposed semiconductor device Grant 8,344,499 - Gong , et al. January 1, 2	2013-01-01
Power semiconductor device package method Grant 8,338,232 - Shi , et al. December 25, 2	2012-12-25
Wafer Level Chip Scale Package Method Using Clip Array App 20120267787 - Gong; Yuping	2012-10-25
Wafer level chip scale package method using clip array Grant 8,236,613 - Gong August 7, 2	2012-08-07
Chip-Exposed Semiconductor Device App 20120175706 - Gong; Yuping ; et al.	2012-07-12
Power Semiconductor Device Package Method App 20120164793 - Shi; Lei ; et al.	2012-06-28
Substrateless Power Device Packages App 20120104580 - Feng; Tao ; et al.	2012-05-03
Chip-exposed semiconductor device and its packaging method Grant 8,163,601 - Gong , et al. April 24, 2	2012-04-24
Chip-Exposed Semiconductor Device and Its Packaging Method App 20110284997 - Gong; Yuping ; et al.	2011-11-24
Wafer Level Chip Scale Package Method Using Clip Array App 20110285025 - Gong; Yuping	2011-11-24

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