Gong; Demei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gong; Demei.The latest application filed is for "power semiconductor device and the preparation method".

Company Profile

0.4.6

Gong; Demei - Shanghai CN
Gong; Demei -

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Power semiconductor device and the preparation method Grant 9,337,131 - Huo , et al. May 10, 2	2016-05-10
Power Semiconductor Device And The Preparation Method App 20160093560 - Huo; Yan ; et al.	2016-03-31
Method of Making a Low Profile Flip Chip Power Module App 20120167384 - Sun; Ming ; et al.	2012-07-05
Low profile flip chip power module and method of making Grant 8,159,828 - Sun , et al. April 17, 2	2012-04-17
Flip chip mounted semiconductor device package having a dimpled leadframe Grant 7,466,014 - Sun , et al. December 16, 2	2008-12-16
Low Profile Flip Chip Power Module and Method of Making App 20080205008 - Sun; Ming ; et al.	2008-08-28
Flip chip mounted semiconductor device package having a dimpled leadframe App 20070252251 - Sun; Ming ; et al.	2007-11-01
Common drain dual semiconductor chip scale package and method of fabricating same App 20070148875 - Sun; Ming ; et al.	2007-06-28
Wafer level bumpless method of making a flip chip mounted semiconductor device package Grant 7,202,113 - Sun , et al. April 10, 2	2007-04-10
Wafer level bumpless method of making a flip chip mounted semiconductor device package App 20060281225 - Sun; Ming ; et al.	2006-12-14

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