Gong; Dan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gong; Dan.The latest application filed is for "quasi-real-time data collection system and method for competitive power market".

Company Profile

4.2.6

Gong; Dan - Nanjing Jiangsu
Gong; Dan - Shenzhen CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Quasi-real-time Data Collection System And Method For Competitive Power Market App 20220308101 - Zhou; Chao ; et al.	2022-09-29
Integrated package structure for MEMS element and ASIC chip and method for manufacturing the same Grant 11,130,674 - Ma , et al. September 28, 2	2021-09-28
Wafer scale ultrasonic sensing device and manufacturing method thereof Grant 11,075,072 - Jin , et al. July 27, 2	2021-07-27
Wafer Scale Ultrasonic Sensing Device And Manufacturing Method Thereof App 20210013026 - JIN; Yu-Feng ; et al.	2021-01-14
Integrated Package Structure For Mems Element And Asic Chip And Method For Manufacturing The Same App 20200262700 - Ma; Sheng-Lin ; et al.	2020-08-20
Wafer Scale Ultrasonic Sensor Assembly And Method For Manufacturing The Same App 20200191646 - Jin; Yu-Feng ; et al.	2020-06-18
Wafer Level Ultrasonic Chip Module And Manufacturing Method Thereof App 20200179979 - JIN; Yu-Feng ; et al.	2020-06-11
Wafer Level Ultrasonic Chip Module Having Suspension Structure And Manufacturing Method Thereof App 20200164406 - JIN; Yu-Feng ; et al.	2020-05-28

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