Gondcharton; Paul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gondcharton; Paul.The latest application filed is for "method for adhering a first structure and a second structure".

Company Profile

3.9.10

Gondcharton; Paul - Grenoble FR
Gondcharton; Paul - Germigny L'exempt FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for adhering a first structure and a second structure Grant 10,710,192 - Imbert , et al.	2020-07-14
Method for assembling two substrates of different natures via a ductile intermediate layer Grant 10,679,963 - Imbert , et al.	2020-06-09
Metal-metal direct bonding method Grant 10,483,111 - Gondcharton , et al. Nov	2019-11-19
Direct bonding method Grant 10,403,597 - Gondcharton , et al. Sep	2019-09-03
Method for direct adhesion via low-roughness metal layers Grant 10,115,698 - Gondcharton , et al. October 30, 2	2018-10-30
Method For Adhering A First Structure And A Second Structure App 20180297143 - IMBERT; Bruno ; et al.	2018-10-18
Direct Bonding Method App 20180218999 - GONDCHARTON; Paul ; et al.	2018-08-02
Method for obtaining a bonding surface for direct bonding Grant 10,032,742 - Benaissa , et al. July 24, 2	2018-07-24
Process for producing a structure by assembling at least two elements by direct adhesive bonding Grant 9,922,953 - Gondcharton , et al. March 20, 2	2018-03-20
Metal-metal Direct Bonding Method App 20180019124 - GONDCHARTON; Paul ; et al.	2018-01-18
Method For Direct Adhesion Via Low-roughness Metal Layers App 20170236800 - GONDCHARTON; Paul ; et al.	2017-08-17
Process for manufacturing a semiconductor structure with temporary bonding via metal layers Grant 9,735,038 - Gondcharton , et al. August 15, 2	2017-08-15
Tungsten Layer Passivation Process And Direct Bonding Process App 20170213807 - BENAISSA; Lamine ; et al.	2017-07-27
Process For Producing A Structure By Assembling At Least Two Elements By Direct Adhesive Bonding App 20170025377 - GONDCHARTON; Paul ; et al.	2017-01-26
Method for carrying out a conductive direct metal bonding Grant 9,472,530 - Gondcharton , et al. October 18, 2	2016-10-18
Process For Manufacturing A Semiconductor Structure With Temporary Bonding Via Metal Layers App 20160189995 - GONDCHARTON; Paul ; et al.	2016-06-30
Method For Assembling Two Substrates Of Different Natures Via A Ductile Intermediate Layer App 20160126215 - IMBERT; Bruno ; et al.	2016-05-05
Method For Carrying Out A Conductive Direct Metal Bonding App 20150380383 - GONDCHARTON; Paul ; et al.	2015-12-31
Method For Obtaining A Bonding Surface For Direct Bonding App 20150364442 - BENAISSA; Lamine ; et al.	2015-12-17

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