| Patent | Date |
|---|
Integrated Three-dimensional (3d) Dram Cache
App 20220308995 - GOMES; Wilfred ; et al. | 2022-09-29 |
Device, System And Method For Providing Inductor Structures
App 20220302051 - GOMES; Wilfred ; et al. | 2022-09-22 |
Device, Method And System For Providing A Stacked Arrangement Of Integrated Circuit Dies
App 20220271022 - GOMES; Wilfred ; et al. | 2022-08-25 |
Device, system and method for providing inductor structures
Grant 11,387,198 - Gomes , et al. July 12, 2 | 2022-07-12 |
Device, method and system for providing a stacked arrangement of integrated circuit dies
Grant 11,373,987 - Gomes , et al. June 28, 2 | 2022-06-28 |
High Capacity Hidden Memory
App 20220197829 - Gomes; Wilfred ; et al. | 2022-06-23 |
Arrays Of Double-sided Dram Cells Including Capacitors On The Frontside And Backside Of A Stacked Transistor Structure
App 20220199624 - Huang; Cheng-Ying ; et al. | 2022-06-23 |
Hybrid Manufacturing For Integrating Photonic And Electronic Components
App 20220187536 - Sharma; Abhishek A. ; et al. | 2022-06-16 |
Hybrid Manufacturing For Integrated Circuit Devices And Assemblies
App 20220181256 - Gomes; Wilfred ; et al. | 2022-06-09 |
Hybrid Manufacturing For Integrated Circuit Devices And Assemblies
App 20220181313 - Gomes; Wilfred ; et al. | 2022-06-09 |
Integrated Circuit Assemblies With Direct Chip Attach To Circuit Boards
App 20220173046 - Gomes; Wilfred ; et al. | 2022-06-02 |
Integrated Circuit Assemblies
App 20220173090 - Gomes; Wilfred ; et al. | 2022-06-02 |
Transistors with back-side contacts to create three dimensional memory and logic
Grant 11,335,686 - Gomes , et al. May 17, 2 | 2022-05-17 |
Distributed Semiconductor Die And Package Architecture
App 20220139896 - GOMES; Wilfred ; et al. | 2022-05-05 |
Gallium Nitride (gan) Three-dimensional Integrated Circuit Technology
App 20220102339 - THEN; Han Wui ; et al. | 2022-03-31 |
Gallium Nitride (gan) Three-dimensional Integrated Circuit Technology
App 20220102344 - THEN; Han Wui ; et al. | 2022-03-31 |
Three-dimensional Nanoribbon-based Dynamic Random-access Memory
App 20220068931 - Gomes; Wilfred ; et al. | 2022-03-03 |
Distributed semiconductor die and package architecture
Grant 11,257,804 - Gomes , et al. February 22, 2 | 2022-02-22 |
Three-dimensional nanoribbon-based dynamic random-access memory
Grant 11,257,822 - Gomes , et al. February 22, 2 | 2022-02-22 |
Thin Film Transistor Based Memory Cells On Both Sides Of A Layer Of Logic Devices
App 20220045065 - Gomes; Wilfred ; et al. | 2022-02-10 |
Thin film transistor based memory cells on both sides of a layer of logic devices
Grant 11,239,238 - Gomes , et al. February 1, 2 | 2022-02-01 |
Functionally Redundant Semiconductor Dies And Package
App 20210375825 - GOMES; Wilfred ; et al. | 2021-12-02 |
Microelectronic Package With Three-dimensional (3d) Monolithic Memory Die
App 20210375849 - Gomes; Wilfred ; et al. | 2021-12-02 |
Three-dimensional Nanoribbon-based Two-transistor Memory Cells
App 20210375926 - Mehandru; Rishabh ; et al. | 2021-12-02 |
Three-dimensional Memory Arrays With Layer Selector Transistors
App 20210335791 - Gomes; Wilfred ; et al. | 2021-10-28 |
Three-dimensional memory arrays with layer selector transistors
Grant 11,139,300 - Gomes , et al. October 5, 2 | 2021-10-05 |
Functionally redundant semiconductor dies and package
Grant 11,127,712 - Gomes , et al. September 21, 2 | 2021-09-21 |
Three-dimensional Nanoribbon-based Static Random-access Memory
App 20210272624 - Gomes; Wilfred ; et al. | 2021-09-02 |
Three-dimensional nanoribbon-based static random-access memory
Grant 11,087,832 - Gomes , et al. August 10, 2 | 2021-08-10 |
Hyperchip
App 20210225808 - BOHR; Mark T. ; et al. | 2021-07-22 |
Dense memory arrays utilizing access transistors with back-side contacts
Grant 11,056,492 - Gomes , et al. July 6, 2 | 2021-07-06 |
Dense Memory Arrays Utilizing Access Transistors With Back-side Contacts
App 20210193666 - Gomes; Wilfred ; et al. | 2021-06-24 |
Three-dimensional Nanoribbon-based Logic
App 20210184052 - Gomes; Wilfred ; et al. | 2021-06-17 |
Hyperchip
Grant 11,024,601 - Bohr , et al. June 1, 2 | 2021-06-01 |
Three-dimensional Nanoribbon-based Dynamic Random-access Memory
App 20210159229 - Gomes; Wilfred ; et al. | 2021-05-27 |
Three-dimensional nanoribbon-based logic
Grant 11,018,264 - Gomes , et al. May 25, 2 | 2021-05-25 |
Three-dimensional Memory Arrays With Layer Selector Transistors
App 20210151438 - Gomes; Wilfred ; et al. | 2021-05-20 |
Transistors With Back-side Contacts To Create Three Dimensional Memory And Logic
App 20210134802 - Gomes; Wilfred ; et al. | 2021-05-06 |
Thin Film Transistor Based Memory Cells On Both Sides Of A Layer Of Logic Devices
App 20210125990 - Gomes; Wilfred ; et al. | 2021-04-29 |
Device, Method And System For Providing A Stacked Arrangement Of Integrated Circuit Dies
App 20210074695 - GOMES; Wilfred ; et al. | 2021-03-11 |
Package On Active Silicon Semiconductor Packages
App 20210013188 - Gomes; Wilfred ; et al. | 2021-01-14 |
Distributed Semiconductor Die And Package Architecture
App 20200312833 - GOMES; WILFRED ; et al. | 2020-10-01 |
Rlink--die to die channel interconnect configurations to improve signaling
Grant 10,784,204 - Aygun , et al. Sept | 2020-09-22 |
Device, System And Method For Providing Inductor Structures
App 20200258852 - A1 | 2020-08-13 |
Structures For Conducting Heat With A Packaged Device And Method Of Providing Same
App 20200258759 - A1 | 2020-08-13 |
Die Interconnection Scheme For Providing A High Yielding Process For High Performance Microprocessors
App 20200211970 - GOMES; Wilfred ; et al. | 2020-07-02 |
Distributed semiconductor die and package architecture
Grant 10,685,947 - Gomes , et al. | 2020-06-16 |
Active Silicon Bridge
App 20200144186 - THOMAS; Thomas P. ; et al. | 2020-05-07 |
Rlink - Die To Die Channel Interconnect Configurations To Improve Signaling
App 20200066641 - AYGUN; Kemal ; et al. | 2020-02-27 |
Hyperchip
App 20200066679 - BOHR; Mark T. ; et al. | 2020-02-27 |
Structures And Methods For Large Integrated Circuit Dies
App 20200058646 - Gomes; Wilfred ; et al. | 2020-02-20 |
Distributed Semiconductor Die And Package Architecture
App 20190221556 - GOMES; WILFRED ; et al. | 2019-07-18 |
Bridge Hub Tiling Architecture
App 20190206798 - COLLINS; ANDREW P. ; et al. | 2019-07-04 |
Functionally Redundant Semiconductor Dies And Package
App 20190206834 - Gomes; Wilfred ; et al. | 2019-07-04 |
Modular content addressable memory
App 20040268032 - Kommandur, Badarinath N. ; et al. | 2004-12-30 |
Interconnect structure including write and read structures
App 20040123037 - Gomes, Wilfred ; et al. | 2004-06-24 |
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