loadpatents
name:-0.019321918487549
name:-0.012734889984131
name:-0.0054059028625488
GOLZARIAN; Reza M. Patent Filings

GOLZARIAN; Reza M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for GOLZARIAN; Reza M..The latest application filed is for "chemical mechanical polishing of substrates containing copper and ruthenium".

Company Profile
5.11.17
  • GOLZARIAN; Reza M. - Portland OR
  • Golzarian; Reza M - Portland OR
  • GOLZARIAN; Reza M - Hillsboro OR
  • Golzarian; Reza M. - Beaverton OR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Chemical Mechanical Polishing Of Substrates Containing Copper And Ruthenium
App 20220064485 - GUEVENC; Haci Osman ;   et al.
2022-03-03
Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates
Grant 11,264,250 - Reichardt , et al. March 1, 2
2022-03-01
Chemical Mechanical Polishing Of Substrates Containing Copper And Ruthenium
App 20220056307 - GUEVENC; Haci Osman ;   et al.
2022-02-24
Chemical Mechanical Polishing Of Substrates Containing Copper And Ruthenium
App 20220049125 - GUEVENC; Haci Osman ;   et al.
2022-02-17
Use Of A Chemical Mechanical Polishing (cmp) Composition For Polishing Of Cobalt Comprising Substrates
App 20210102093 - REICHARDT; Robert ;   et al.
2021-04-08
Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt comprising substrates
Grant 10,899,945 - Reichardt , et al. January 26, 2
2021-01-26
Chemical Mechanical Polishing Composition
App 20200299547 - DAESCHLEIN; Christian ;   et al.
2020-09-24
Use Of A Chemical Mechanical Polishing (cmp) Composition For Polishing Of Cobalt And / Or Cobalt Alloy Comprising Substrates
App 20200294813 - REICHARDT; Robert ;   et al.
2020-09-17
Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates
Grant 10,738,219 - Reichardt , et al. A
2020-08-11
Use Of A Chemical Mechanical Polishing (cmp) Composition For Polishing Of Cobalt Comprising Substrates
App 20180230333 - REICHARDT; Robert ;   et al.
2018-08-16
Unidirectionally conductive materials for interconnection
Grant 7,405,419 - Golzarian , et al. July 29, 2
2008-07-29
Pre-coated particles for chemical mechanical polishing
App 20070251157 - Golzarian; Reza M. ;   et al.
2007-11-01
Pre-coated particles for chemical mechanical polishing
Grant 7,229,484 - Golzarian , et al. June 12, 2
2007-06-12
Energy enhanced surface planarization
Grant 7,156,947 - Golzarian January 2, 2
2007-01-02
Using acoustic energy including two lasers to activate implanted species
Grant 7,153,760 - Golzarian December 26, 2
2006-12-26
Unidirectionally conductive materials for interconnection
App 20060228884 - Golzarian; Reza M. ;   et al.
2006-10-12
Electrically enhanced surface planarization
Grant 7,097,536 - Golzarian August 29, 2
2006-08-29
Unidirectionally conductive materials for interconnection
Grant 7,084,053 - Golzarian , et al. August 1, 2
2006-08-01
Substrate carrier for surface planarization
App 20060000806 - Golzarian; Reza M. ;   et al.
2006-01-05
Energy enhanced surface planarization
App 20060000807 - Golzarian; Reza M.
2006-01-05
Electrically enhanced surface planarization
App 20060003670 - Golzarian; Reza M.
2006-01-05
Polishing pad conditioning
Grant 6,976,907 - Golzarian , et al. December 20, 2
2005-12-20
Using acoustic energy to activate implanted species
App 20050112852 - Golzarian, Reza M.
2005-05-26
Surface planarization
Grant 6,875,086 - Golzarian , et al. April 5, 2
2005-04-05
Unidirectionally conductive materials for interconnection
App 20050070096 - Golzarian, Reza M. ;   et al.
2005-03-31
Polishing pad conditioning
App 20040166785 - Golzarian, Reza M. ;   et al.
2004-08-26
Surface planarization
App 20040147205 - Golzarian, Reza M. ;   et al.
2004-07-29
Pre-coated particles for chemical mechanical polishing
App 20040106361 - Golzarian, Reza M. ;   et al.
2004-06-03

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