Goller; Klaus

Patent Applications and Registrations

Patent applications and USPTO patent grants for Goller; Klaus.The latest application filed is for "barrier for power metallization in semiconductor devices".

Company Profile

1.15.17

Goller; Klaus - Regensburg DE
Goller; Klaus - Dresden DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Barrier for power metallization in semiconductor devices Grant 11,127,693 - Gatterbauer , et al. September 21, 2	2021-09-21
Barrier for Power Metallization in Semiconductor Devices App 20200111754 - Gatterbauer; Johann ; et al.	2020-04-09
Integrated circuit arrangement with an auxiliary indentation, particularly with aligning marks Grant 8,901,737 - Goller , et al. December 2, 2	2014-12-02
Integrated circuit arrangement including vias having two sections, and method for producing the same Grant 8,273,658 - Goller , et al. September 25, 2	2012-09-25
Capacitor assemblies Grant 8,008,161 - Bachmann , et al. August 30, 2	2011-08-30
Capacitor arrangement and method for making same Grant 7,989,919 - Boeck , et al. August 2, 2	2011-08-02
Interconnections for integrated circuits Grant 7,951,703 - Goller , et al. May 31, 2	2011-05-31
Integrated Circuit Arrangement With An Auxiliary Indentation, Particularly With Aligning Marks App 20100320613 - Goller; Klaus ; et al.	2010-12-23
Capacitor Arrangement And Method For Making Same App 20100309606 - ALLERS; Karl-Heinz ; et al.	2010-12-09
Method for producing an integrated circuit assembly with an auxiliary indentation, particularly with aligning marks, and an integrated circuit arrangement Grant 7,795,105 - Goller , et al. September 14, 2	2010-09-14
Method for producing a layer arrangement Grant 7,795,135 - Eckert , et al. September 14, 2	2010-09-14
Method and arrangement for contacting terminals Grant 7,666,783 - Goller , et al. February 23, 2	2010-02-23
Method of making a semiconductor element Grant 7,611,958 - Goller , et al. November 3, 2	2009-11-03
Interconnections For Integrated Circuits App 20090263964 - Goller; Klaus ; et al.	2009-10-22
Interconnections for integrated circuits Grant 7,569,938 - Goller , et al. August 4, 2	2009-08-04
Method Of Making A Semiconductor Element App 20090148996 - Goller; Klaus ; et al.	2009-06-11
Integrated Circuit Arrangment Including Vias Having Two Sections, and Method For Producing the Same App 20080303169 - Goller; Klaus ; et al.	2008-12-11
Method for producing a layer arrangement App 20080102625 - Eckert; Stefan ; et al.	2008-05-01
Method and arrangement for contacting terminals App 20080070403 - Goller; Klaus ; et al.	2008-03-20
Device having a useful structure and an auxiliary structure Grant 7,342,314 - Bachmann , et al. March 11, 2	2008-03-11
Method for producing an integrated circuit assembly with an auxiliary indentation, particularly with aligning marks, and an integrated circuit arrangement App 20070102819 - Goller; Klaus ; et al.	2007-05-10
Making Contact With The Emitter Contact Of A Semiconductor App 20060246726 - Goller; Klaus	2006-11-02
Interconnections for integrated circuits App 20060163737 - Goller; Klaus ; et al.	2006-07-27
Semiconductor device and a method for fabricating a semiconductor device Grant 7,026,547 - Goller , et al. April 11, 2	2006-04-11
Capacitor assemblies App 20050287755 - Bachmann, Jens ; et al.	2005-12-29
Test structure for determining the electrical loadability of contacts Grant 6,899,543 - Goller , et al. May 31, 2	2005-05-31
Method of producing a capacitor in a dielectric layer App 20050079669 - Goller, Klaus	2005-04-14
Device having a useful structure and an auxiliary structure App 20050017328 - Bachmann, Jens ; et al.	2005-01-27
Making contact with the emitter contact of a semiconductor App 20040227212 - Goller, Klaus	2004-11-18
Method and arrangement for contacting terminals App 20040198039 - Goller, Klaus ; et al.	2004-10-07
Test structure for determining the electrical loadability of contacts App 20040115963 - Goller, Klaus ; et al.	2004-06-17

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