Goldsmith; Norman

Patent Applications and Registrations

Patent applications and USPTO patent grants for Goldsmith; Norman.The latest application filed is for "method of fabricating back-illuminated imaging sensors using a bump bonding technique".

Company Profile

0.6.4

Goldsmith; Norman - East Brunswick NJ
Goldsmith; Norman - Princeton NJ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of fabricating back-illuminated imaging sensors using a bump bonding technique Grant 7,932,575 - Bhaskaran , et al. April 26, 2	2011-04-26
Method and apparatus for reducing smear in back-illuminated imaging sensors Grant 7,777,229 - Swain , et al. August 17, 2	2010-08-17
Method Of Fabricating Back-illuminated Imaging Sensors Using A Bump Bonding Technique App 20090256227 - Bhaskaran; Mahalingam ; et al.	2009-10-15
Method of fabricating back-illuminated imaging sensors using a bump bonding technique Grant 7,541,256 - Swain , et al. June 2, 2	2009-06-02
Method of Fabricating Back-Illuminated Imaging Sensors Using a Bump Bonding Technique App 20080237762 - Swain; Pradyumna Kumar ; et al.	2008-10-02
Method For Aligning Color Filters To A Back-illuminated Imaging Array App 20080068735 - Goldsmith; Norman	2008-03-20
Method and Apparatus for Reducing Smear in Back-Illuminated Imaging Sensors App 20080061390 - Swain; Pradyumna Kumar ; et al.	2008-03-13
Method of forming an improved gate member for a gate injected floating gate memory device Grant 4,334,347 - Goldsmith , et al. June 15, 1	1982-06-15
Gate injected floating gate memory device Grant 4,253,106 - Goldsmith , et al. February 24, 1	1981-02-24
Method of growing thick expitaxial layers of silicon Grant 3,945,864 - Goldsmith , et al. March 23, 1	1976-03-23

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