Goldblatt; Ronald D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Goldblatt; Ronald D..The latest application filed is for "low resistance, low reflection, and low cost contact grids for photovoltaic cells".

Company Profile

0.9.6

Goldblatt; Ronald D. - Voorheesville NY
Goldblatt; Ronald D. - Yorktown Heights NY
Goldblatt; Ronald D. - Rye Brook NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Low resistance, low reflection, and low cost contact grids for photovoltaic cells Grant 9,666,749 - Goldblatt , et al. May 30, 2	2017-05-30
Low Resistance, Low Reflection, And Low Cost Contact Grids For Photovoltaic Cells App 20160225934 - Goldblatt; Ronald D. ; et al.	2016-08-04
METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION App 20080073790 - Burrell; Lloyd G. ; et al.	2008-03-27
Method of fabricating a wire bond pad with Ni/Au metallization Grant 7,294,565 - Burrell , et al. November 13, 2	2007-11-13
Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor Grant 7,098,676 - Landers , et al. August 29, 2	2006-08-29
Novel integration of wire bond pad with Ni/Au metallization App 20050074959 - Burrell, Lloyd G. ; et al.	2005-04-07
Multi-functional structure for enhanced chip manufacturibility & reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor App 20040129938 - Landers, William F. ; et al.	2004-07-08
Common ball-limiting metallurgy for I/O sites App 20030092254 - Walker, George F. ; et al.	2003-05-15
Common ball-limiting metallurgy for I/O sites Grant 6,534,863 - Walker , et al. March 18, 2	2003-03-18
Common ball-limiting metallurgy for I/O sites App 20020111010 - Walker, George F. ; et al.	2002-08-15
Copper seed layer repair technique using electroless touch-up Grant 6,395,164 - Andricacos , et al. May 28, 2	2002-05-28
Reactive surface functionalization Grant 5,357,005 - Buchwalter , et al. * October 18, 1	1994-10-18
Lamination method for coating the sidewall or filling a cavity in a substrate Grant 5,208,068 - Davis , et al. May 4, 1	1993-05-04
Means of seeding and metallizing polymide Grant 5,178,914 - Goldblatt , et al. January 12, 1	1993-01-12
Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment Grant 5,019,210 - Chou , et al. May 28, 1	1991-05-28

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