loadpatents
name:-0.04217004776001
name:-0.0067319869995117
name:-0.00066518783569336
Goldberg, Wendy B. Patent Filings

Goldberg, Wendy B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Goldberg, Wendy B..The latest application filed is for "compositions and methods for low downforce pressure polishing of copper".

Company Profile
0.1.4
  • Goldberg, Wendy B. - Sequim WA
  • Goldberg; Wendy B. - Wilmington DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Compositions and methods for low downforce pressure polishing of copper
App 20050136671 - Goldberg, Wendy B. ;   et al.
2005-06-23
Chemical mechanical planarization of metal substrates
Grant 6,602,436 - Mandigo , et al. August 5, 2
2003-08-05
Method and composition for polishing by CMP
App 20020146965 - Thomas, Terence M. ;   et al.
2002-10-10
Chemical mechanical planarization of metal substrates
App 20020058426 - Mandigo, Glenn C. ;   et al.
2002-05-16
Biocides for polishing slurries
App 20020025762 - Luo, Qiuliang ;   et al.
2002-02-28

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